[go: up one dir, main page]

WO2009069253A1 - 圧電デバイスとこれを用いた電子機器、及び自動車 - Google Patents

圧電デバイスとこれを用いた電子機器、及び自動車 Download PDF

Info

Publication number
WO2009069253A1
WO2009069253A1 PCT/JP2008/003232 JP2008003232W WO2009069253A1 WO 2009069253 A1 WO2009069253 A1 WO 2009069253A1 JP 2008003232 W JP2008003232 W JP 2008003232W WO 2009069253 A1 WO2009069253 A1 WO 2009069253A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead wire
automobile
same
piezoelectric
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/003232
Other languages
English (en)
French (fr)
Inventor
Toshiyuki Nozoe
Hideo Ohkoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to EP08853441.7A priority Critical patent/EP2181778A4/en
Priority to US12/680,801 priority patent/US8159116B2/en
Priority to CN2008801147720A priority patent/CN101848772B/zh
Publication of WO2009069253A1 publication Critical patent/WO2009069253A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0519—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for cantilever
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02133—Means for compensation or elimination of undesirable effects of stress
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/09—Elastic or damping supports

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)

Abstract

本発明の圧電デバイスは、回路パターンにその一端が電気的に接続されるリード線（１２）と、リード線（１２）の他端に電気的に接続された端子（１３ａ）を有する圧電振動子（１３）とを備え、圧電振動子（１３）がリード線（１２）の他端により中空保持されており、リード線（１２）の他端における圧電振動子（１３）との接続面（１２ａ）の裏面（１２ｂ）には支持部材（１４）を設けた構成としたものである。
PCT/JP2008/003232 2007-11-27 2008-11-07 圧電デバイスとこれを用いた電子機器、及び自動車 Ceased WO2009069253A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08853441.7A EP2181778A4 (en) 2007-11-27 2008-11-07 PIEZOELECTRIC DEVICE, ELECTRONIC DEVICE USED, AND MOTOR VEHICLE
US12/680,801 US8159116B2 (en) 2007-11-27 2008-11-07 Piezoelectric device, electronic device using the same, and automobile
CN2008801147720A CN101848772B (zh) 2007-11-27 2008-11-07 压电设备、使用它的电子设备及汽车

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-305413 2007-11-27
JP2007305413A JP5555974B2 (ja) 2007-11-27 2007-11-27 圧電デバイスとこれを用いた電子機器、及び自動車

Publications (1)

Publication Number Publication Date
WO2009069253A1 true WO2009069253A1 (ja) 2009-06-04

Family

ID=40678168

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003232 Ceased WO2009069253A1 (ja) 2007-11-27 2008-11-07 圧電デバイスとこれを用いた電子機器、及び自動車

Country Status (7)

Country Link
US (1) US8159116B2 (ja)
EP (1) EP2181778A4 (ja)
JP (1) JP5555974B2 (ja)
KR (1) KR20100087184A (ja)
CN (2) CN102307042B (ja)
TW (1) TWI484676B (ja)
WO (1) WO2009069253A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8450913B1 (en) * 2011-03-31 2013-05-28 Georgia Tech Research Corporation Tunable Piezoelectric MEMS Resonators suitable for real-time clock applications
DE102011121456B4 (de) * 2011-12-16 2021-12-09 HELLA GmbH & Co. KGaA Fahrzeug mit Foliensensor sowie Nachrüstsatz einer Erfassungseinrichtung mit Foliensensor
JP2014197731A (ja) * 2013-03-29 2014-10-16 セイコーエプソン株式会社 振動デバイス、振動デバイスの製造方法、電子機器、移動体
JP6680079B2 (ja) * 2016-05-25 2020-04-15 セイコーエプソン株式会社 電子デバイス、電子デバイスの製造方法、物理量センサー、電子機器および移動体
DE102022107944B4 (de) * 2022-04-04 2025-01-09 Infineon Technologies Ag Ultraschallwandler

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000304763A (ja) * 1999-04-20 2000-11-02 Hokuriku Electric Ind Co Ltd 加速度センサユニット
JP2007165664A (ja) * 2005-12-15 2007-06-28 Alps Electric Co Ltd 振動子の配線構造及び圧電ポンプ
JP2007167854A (ja) 2007-02-02 2007-07-05 Seiko Epson Corp 圧電デバイスおよび圧電デバイスを搭載する電子機器。

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4847290A (ja) * 1971-10-18 1973-07-05
JPS54154986A (en) * 1978-05-29 1979-12-06 Seiko Instr & Electronics Ltd Temperature compensated crystal oscillator unit
JP2730352B2 (ja) * 1991-10-25 1998-03-25 日本電気株式会社 Ｔａｂテープ
JPH0828396B2 (ja) * 1992-01-31 1996-03-21 株式会社東芝 半導体装置
KR100248035B1 (ko) * 1994-09-29 2000-03-15 니시무로 타이죠 반도체 패키지
JP2001258879A (ja) * 2000-03-15 2001-09-25 Olympus Optical Co Ltd 超音波トランスデューサシステムおよび超音波トランスデュー
US6628048B2 (en) * 2000-11-29 2003-09-30 Samsung Electro-Mechanics Co., Ltd. Crystal oscillator with improved shock resistance
JP3826875B2 (ja) * 2002-10-29 2006-09-27 セイコーエプソン株式会社 圧電デバイスおよびその製造方法
JP3966237B2 (ja) * 2003-06-19 2007-08-29 セイコーエプソン株式会社 圧電デバイス、圧電デバイスを搭載した電子機器
JP3864952B2 (ja) * 2003-12-01 2007-01-10 セイコーエプソン株式会社 振動子デバイス及びそれを備えた電子機器並びに振動子デバイスの製造方法
JP4442526B2 (ja) * 2005-07-20 2010-03-31 セイコーエプソン株式会社 圧電振動ジャイロセンサ及び圧電振動ジャイロセンサを備えた電子機器
JP4534912B2 (ja) * 2005-08-30 2010-09-01 株式会社デンソー 角速度センサの取付構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000304763A (ja) * 1999-04-20 2000-11-02 Hokuriku Electric Ind Co Ltd 加速度センサユニット
JP2007165664A (ja) * 2005-12-15 2007-06-28 Alps Electric Co Ltd 振動子の配線構造及び圧電ポンプ
JP2007167854A (ja) 2007-02-02 2007-07-05 Seiko Epson Corp 圧電デバイスおよび圧電デバイスを搭載する電子機器。

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2181778A4

Also Published As

Publication number Publication date
TW200926469A (en) 2009-06-16
TWI484676B (zh) 2015-05-11
US20100219723A1 (en) 2010-09-02
CN102307042A (zh) 2012-01-04
JP5555974B2 (ja) 2014-07-23
JP2009130236A (ja) 2009-06-11
CN102307042B (zh) 2016-01-13
CN101848772A (zh) 2010-09-29
EP2181778A1 (en) 2010-05-05
KR20100087184A (ko) 2010-08-03
EP2181778A4 (en) 2013-05-29
CN101848772B (zh) 2012-02-15
US8159116B2 (en) 2012-04-17

Similar Documents

Publication Publication Date Title
WO2007124050A3 (en) Probe structures with electronic components
WO2007146769A3 (en) Nano-piezoelectronics
JP2009105036A5 (ja)
WO2007011544A3 (en) Electronically connecting substrate with electrical device
EP2426825A3 (en) Wireless headset comprising a housing and an earbud electrically coupled to the housing by a flexible circuit board
WO2008087771A1 (ja) 撮像装置、内視鏡
EP2778638A3 (en) Temperature sensor assembly and method of manufacturing thereof
TW200733475A (en) Module with a built-in antenna, card-formed information device and manufacturing methods thereof
TW200802790A (en) Electronic substrate, semiconductor device, and electronic device
SG170618A1 (en) Polymeric oligonucleotide prodrugs
EP2037700A3 (en) Miniature microphone assembly with hydrophobic surface coating
WO2008135811A3 (en) Connector for flexible circuit
WO2007005617A3 (en) Electrically conducting polymer glue, devices made therewith and methods of manufacture
EP2432013A3 (en) Sealing member for electronic component package and electronic component package
TW200629662A (en) Electronic device package and electronic equipment
WO2009050843A1 (ja) 電子デバイス
ATE502399T1 (de) Schaltungsvorrichtung mit gebondetem smd-bauteil
WO2009001170A3 (en) Filter having impedance matching circuits
WO2009069253A1 (ja) 圧電デバイスとこれを用いた電子機器、及び自動車
EP1753277A3 (en) Wiring circuit board
WO2006094025A3 (en) Fabricated adhesive microstructures for making an electrical connection
TW200733843A (en) Filter and its coils connecting frame
JP2006160243A5 (ja)
WO2010088499A3 (en) Crimped solder on a flexible circuit board
WO2005045997A3 (en) An electrical circuit assembly with improved shock resistance

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880114772.0

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08853441

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2008853441

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12680801

Country of ref document: US

ENP Entry into the national phase

Ref document number: 20107011553

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE