[go: up one dir, main page]

WO2009066620A1 - 熱電モジュール - Google Patents

熱電モジュール Download PDF

Info

Publication number
WO2009066620A1
WO2009066620A1 PCT/JP2008/070792 JP2008070792W WO2009066620A1 WO 2009066620 A1 WO2009066620 A1 WO 2009066620A1 JP 2008070792 W JP2008070792 W JP 2008070792W WO 2009066620 A1 WO2009066620 A1 WO 2009066620A1
Authority
WO
WIPO (PCT)
Prior art keywords
warp
substrate
thermoelectric elements
outer circumference
opposing surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/070792
Other languages
English (en)
French (fr)
Inventor
Akio Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kelk Ltd
Original Assignee
Kelk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kelk Ltd filed Critical Kelk Ltd
Priority to US12/743,699 priority Critical patent/US20100252084A1/en
Priority to CN2008801171679A priority patent/CN101868867B/zh
Publication of WO2009066620A1 publication Critical patent/WO2009066620A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electromechanical Clocks (AREA)

Abstract

　熱電素子が基板の対向面のうちの中央領域に配置されず、中央領域を除く領域すなわち中央領域を取り囲む周辺領域や外周領域に密状態で配置される。対向面の中央に熱電素子が配置される場合と対向面の中央領域を除く領域に熱電素子が配置される場合とを比較すると、前者よりも後者の方が反りの基点となる熱電素子が外周側に位置することになり、すなわち反りの基点と基板の外周との距離が短くなる。反りの基点と基板の外周との距離が短いほど、基板の外周に生ずる反りの変位量及び力は小さくなる。また熱電素子が密に配置されることで、基板の反りによって一つあたりの熱電素子が引っ張られる力は小さくなる。このように基板の外周に生ずる反りの変位量及び力を低減することによって基板の反りに起因する熱電素子の損傷を防止する。
PCT/JP2008/070792 2007-11-20 2008-11-14 熱電モジュール Ceased WO2009066620A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/743,699 US20100252084A1 (en) 2007-11-20 2008-11-14 Thermoelectric module
CN2008801171679A CN101868867B (zh) 2007-11-20 2008-11-14 热电组件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007300484A JP5465829B2 (ja) 2007-11-20 2007-11-20 熱電モジュール
JP2007-300484 2007-11-20

Publications (1)

Publication Number Publication Date
WO2009066620A1 true WO2009066620A1 (ja) 2009-05-28

Family

ID=40667443

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070792 Ceased WO2009066620A1 (ja) 2007-11-20 2008-11-14 熱電モジュール

Country Status (4)

Country Link
US (1) US20100252084A1 (ja)
JP (1) JP5465829B2 (ja)
CN (1) CN101868867B (ja)
WO (1) WO2009066620A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105283973A (zh) * 2013-09-27 2016-01-27 京瓷株式会社 热电模块

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5523769B2 (ja) * 2009-08-28 2014-06-18 株式会社Ｋｅｌｋ 熱電モジュール
JP5638333B2 (ja) * 2010-09-30 2014-12-10 京セラ株式会社 熱電モジュール
JP6524406B2 (ja) * 2014-08-18 2019-06-05 パナソニックＩｐマネジメント株式会社 熱電変換モジュール
EP3032596B1 (en) * 2014-12-09 2017-03-01 Panasonic Intellectual Property Management Co., Ltd. Thermoelectric conversion module and thermoelectric conversion system
JP6145609B2 (ja) * 2014-12-09 2017-06-14 パナソニックＩｐマネジメント株式会社 熱電変換モジュール及び熱電変換システム
CN104681708B (zh) * 2014-12-24 2018-09-04 杭州大和热磁电子有限公司 一种非等距排布的热电模块
JP6881885B2 (ja) * 2015-03-13 2021-06-02 株式会社Kelk 熱電発電モジュール
US20160372650A1 (en) * 2015-06-17 2016-12-22 Sheetak Inc. Thermoelectric device for high temperature applications
CN107710428B (zh) * 2015-09-28 2020-02-18 京瓷株式会社 热电模块
KR102366388B1 (ko) * 2016-01-13 2022-02-23 엘지이노텍 주식회사 열전 소자
WO2018100933A1 (ja) 2016-11-29 2018-06-07 京セラ株式会社 熱電モジュール
JP6926510B2 (ja) * 2017-02-17 2021-08-25 株式会社アイシン 熱電モジュール
KR102367202B1 (ko) * 2017-09-29 2022-02-24 엘지이노텍 주식회사 열전 소자
KR102724358B1 (ko) * 2018-02-01 2024-11-01 엘지이노텍 주식회사 열전장치
KR102608780B1 (ko) * 2018-09-11 2023-12-04 엘지이노텍 주식회사 열전소자
KR102511766B1 (ko) * 2018-11-08 2023-03-20 엘지이노텍 주식회사 열전모듈
KR102164983B1 (ko) * 2019-11-08 2020-10-13 엘지이노텍 주식회사 열전소자

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307826A (ja) * 1998-04-22 1999-11-05 Yamaha Corp 熱電モジュール
JP2002139264A (ja) * 2000-11-02 2002-05-17 Komatsu Electronics Inc 熱交換装置
JP2004221259A (ja) * 2003-01-14 2004-08-05 Komatsu Electronics Inc 熱電変換素子モジュール及びこれを用いた電子冷却装置
JP2006319262A (ja) * 2005-05-16 2006-11-24 Okano Electric Wire Co Ltd 熱電変換モジュール

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5228923A (en) * 1991-12-13 1993-07-20 Implemed, Inc. Cylindrical thermoelectric cells
CN2192846Y (zh) * 1994-04-23 1995-03-22 林伟堂 热电冷却偶的结构
JP2946205B1 (ja) * 1997-12-25 1999-09-06 セイコーインスツルメンツ株式会社 熱発電ユニット並びに該ユニットを用いた携帯用電子機器
JP4548626B2 (ja) * 1999-10-04 2010-09-22 株式会社小松製作所 熱電モジュールおよび熱電モジュールを用いた温度調整プレート
JP4620268B2 (ja) * 2001-02-27 2011-01-26 アイシン精機株式会社 熱電モジュールを放熱部材に組み付ける方法
JP2004200270A (ja) * 2002-12-17 2004-07-15 Yamaha Corp 熱電モジュール
US7629531B2 (en) * 2003-05-19 2009-12-08 Digital Angel Corporation Low power thermoelectric generator
JP4488778B2 (ja) * 2003-07-25 2010-06-23 株式会社東芝 熱電変換装置
JP2007067231A (ja) * 2005-08-31 2007-03-15 Aisin Seiki Co Ltd 熱電モジュール
TWI360901B (en) * 2007-12-28 2012-03-21 Ind Tech Res Inst Thermoelectric device with thin film elements, app

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307826A (ja) * 1998-04-22 1999-11-05 Yamaha Corp 熱電モジュール
JP2002139264A (ja) * 2000-11-02 2002-05-17 Komatsu Electronics Inc 熱交換装置
JP2004221259A (ja) * 2003-01-14 2004-08-05 Komatsu Electronics Inc 熱電変換素子モジュール及びこれを用いた電子冷却装置
JP2006319262A (ja) * 2005-05-16 2006-11-24 Okano Electric Wire Co Ltd 熱電変換モジュール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105283973A (zh) * 2013-09-27 2016-01-27 京瓷株式会社 热电模块
CN105283973B (zh) * 2013-09-27 2018-05-08 京瓷株式会社 热电模块

Also Published As

Publication number Publication date
CN101868867A (zh) 2010-10-20
JP5465829B2 (ja) 2014-04-09
US20100252084A1 (en) 2010-10-07
CN101868867B (zh) 2012-06-13
JP2009129968A (ja) 2009-06-11

Similar Documents

Publication Publication Date Title
WO2009066620A1 (ja) 熱電モジュール
USD654489S1 (en) Case for electronic device
USD602505S1 (en) Ground engaging wear member
USD622056S1 (en) Footwear
WO2009007786A3 (en) A solar cell including a silicone resin layer
WO2010088423A3 (en) Shape memory riblets
USD680947S1 (en) Keyboard solar panels
WO2011129591A3 (ko) 전지셀 어셈블리
NZ599178A (en) Drainage body
USD663004S1 (en) Arrowhead
TW200710936A (en) MEMS devices having support structures and methods of fabricating the same
WO2010135550A3 (en) Cushions comprising deformable members and related methods
GB2476019B (en) Thin active layer fishbone photodiode with a shallow N+ layer and method of manufacturing the same
USD655771S1 (en) Knob of a ball bat
WO2010097199A8 (en) Anti-scour system
WO2010039321A3 (en) Armor having prismatic, tesselated core
WO2009002463A3 (en) Back-contact solar cell for high power-over-weight applications
WO2008114675A1 (ja) 複合センサ
WO2011034972A3 (en) Display device with at least one movable stop element
WO2010114766A3 (en) Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems
WO2011082806A3 (de) Solarzellenmodul
WO2013074408A3 (en) Improved flexible high modulus photovoltaic building sheathing member
WO2013039608A3 (en) Carrier head with composite plastic portions
USD596682S1 (en) Racquet
USD735216S1 (en) Portable electronic device with graphical images

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880117167.9

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08851399

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 12743699

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08851399

Country of ref document: EP

Kind code of ref document: A1