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WO2009065795A2 - Capteur de pression - Google Patents

Capteur de pression Download PDF

Info

Publication number
WO2009065795A2
WO2009065795A2 PCT/EP2008/065642 EP2008065642W WO2009065795A2 WO 2009065795 A2 WO2009065795 A2 WO 2009065795A2 EP 2008065642 W EP2008065642 W EP 2008065642W WO 2009065795 A2 WO2009065795 A2 WO 2009065795A2
Authority
WO
WIPO (PCT)
Prior art keywords
pressure sensor
contacts
contact frame
sensor cell
sensor according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/065642
Other languages
German (de)
English (en)
Other versions
WO2009065795A3 (fr
Inventor
Dietmar Schultz
Ralf Schimmel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of WO2009065795A2 publication Critical patent/WO2009065795A2/fr
Publication of WO2009065795A3 publication Critical patent/WO2009065795A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes

Definitions

  • the invention relates to a pressure sensor, consisting of a pressure sensor cell, arranged on the pressure sensor cell contacts and electrical connection cables.
  • the invention is therefore based on the object to provide a pressure sensor which allows reliable signal transmission even under harsh operating conditions and corresponding to the measured values.
  • the pressure sensor should be simple in construction and inexpensive to manufacture and assemble.
  • the object is achieved in that the pressure sensor cell is arranged in a contact frame, that the contact frame has contacts, that the contacts of the contact frame are connected at one end to the terminal contacts of the pressure sensor cell and that the contacts at the other end for connection to the electrical Connecting lines are formed.
  • the possibility is opened to attach the pressure sensor cell separately to another component and thus optimally fit this component to the Adjustment conditions.
  • two different contacts can now be used, wherein each contact is optimally adapted to the respective conditions of use. The previous attachment and contact owed compromises are thus avoided.
  • This is made possible by the two connection points at each end of the contacts in the contact frame.
  • the pressure sensor cell can be contacted with the contact frame such that this contact is optimally aligned with the pressure sensor cell.
  • an optimized contact with the connection lines can be selected via the second end of the contacts in the contact frame.
  • the pressure sensor cell can be made simpler and cheaper because the mounting and mounting now takes place over the contact frame. In this respect, the additional costs for the further component have a less pronounced effect.
  • a particularly good connection which ensures reliable contact even under the most difficult operating conditions, such as vibrations, is achieved by connecting the first ends of the contacts of the contact frame to the connection contacts of the pressure sensor cell by means of bonded wires.
  • the contact points between the contact frame and the pressure sensor cell are provided with a protective layer.
  • the protective layer may be, for example, a lacquer.
  • a good contacting of the electrical connection lines, which may also be arranged in particular on a printed circuit board, with the contact frame is achieved in that the second ends of the contacts of the contact frame by means of soldering connections are connected to the electrical connection lines.
  • This embodiment has the advantage that the soldering as a standard contact due to low operating costs incurred in final assembly, since the complete assembly can also be prefabricated.
  • the contacting of the electrical connection lines can also be effected by press-fitting or by the pin-in-paste method. These contact formations are also characterized by their low cost.
  • the contacts are particularly easy to manufacture and handle, if they are designed as stamped grid.
  • a particularly good bonding during bonding is achieved according to a further embodiment in that the contacts are coated on the first end with aluminum, preferably roll-clad, or with gold, preferably applied by electroplating.
  • An improved positioning and mounting of the pressure sensor to other components, preferably a printed circuit board, is achieved in that the contact frame has positioning and mounting projections.
  • the contact frame has projections, which are designed for positioning and mounting the pressure sensor cell.
  • the receptacles are designed as latching hooks which interact with latching points on the holding component, preferably a printed circuit board. But it is also conceivable to form the receptacles as pins, which engage in holes in the circuit board, preferably by means of press fit.
  • the contact frame for receiving further components preferably a housing for the pressure sensor cell is formed.
  • the training may consist in that on the contact frame guides, latching hooks or locking points are arranged, which serve to fasten the other components.
  • FIG. 1 shows a pressure sensor according to the invention on a printed circuit board
  • FIG. 2 shows a contact frame in the view from below
  • Figure 3 the contact frame of Figure 2 with a pressure sensor cell
  • Figure 4 a pressure sensor with housing.
  • FIG. 1 shows a pressure sensor 1 which is arranged on a printed circuit board 2.
  • the pressure sensor 1 consists of a pressure sensor cell 3, which is pressed into a contact frame 4.
  • In the contact frame 4 four contacts 5 are arranged, which engage with their second end 6 in each case a bore 7 in the circuit board 2.
  • On the invisible back of the circuit board 2, the second ends 6 of the contacts 5 are soldered.
  • the holes 7 are part of the connecting lines. 8
  • the contact frame 4 shown in Figure 2 is made of plastic and has a ring 9 for receiving the pressure sensor cell.
  • On the ring 9 molded locking hooks 10 serve to fix the pressure sensor cell.
  • the contacts 5 are arranged, wherein three contacts 5 are shown in the installed position and a contact 5 in an exploded view.
  • the contacts 5 are injected into the ring 9.
  • the respective first ends 11 of the contacts 5 are within the ring 9.
  • the respective second ends 6 are outside the contact frame 4.
  • the contact frame 4 further has a pin 12 for correct mounting on the circuit board.
  • integrally formed latching hooks 13 serve the additional mechanical connection with the circuit board, as shown in Figure 4 below.
  • FIG. 3 shows the connection of the contact frame 4 with the pressure sensor cell 3 inserted in it.
  • the electrical connection of the pressure sensor cell 3 to the contact frame 4 takes place via a bond connection.
  • connection contacts 14 At the bottom of the pressure sensor cell 3 there are four connection contacts 14, to each of which a wire 15 is bonded. The respective other end of the wires 15 is bonded to the respective first end 11 of the contacts 5.
  • a coating applied to the contacts 5 and the terminal contacts 14 lacquer layer protects the bonds against environmental influences.
  • FIG. 4 shows the printed circuit board 2 with mounted pressure sensor 1 from below.
  • the pin 12 of the pressure sensor 1 is used for positional alignment.
  • the pressure sensor 1 is held mechanically by means of the two latching hooks 13, which latch in the printed circuit board 2.
  • a housing 16 is provided which rests the ring 9 enclosing on the upper side of the printed circuit board 2.
  • a seal 17 is arranged in the housing 16.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention concerne un capteur de pression 1, constitué d'une cellule de capteur de pression 3, de contacts 5 disposés sur la cellule de capteur de pression 3, et de lignes électriques de raccordement 8. La cellule de capteur de pression 3 est disposée dans un cadre de contact 4. Le cadre de contact 4 possède des contacts 5, sachant que les contacts 5 du cadre de contact 4 sont reliés, à une première extrémité 11, aux contacts de raccordement 14 de la cellule de capteur de pression 3, et que les contacts 5 sont conçus, à leur deuxième extrémité 6, pour la liaison avec les lignes électriques de raccordement 8.
PCT/EP2008/065642 2007-11-22 2008-11-17 Capteur de pression Ceased WO2009065795A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710056284 DE102007056284A1 (de) 2007-11-22 2007-11-22 Drucksensor
DE102007056284.7 2007-11-22

Publications (2)

Publication Number Publication Date
WO2009065795A2 true WO2009065795A2 (fr) 2009-05-28
WO2009065795A3 WO2009065795A3 (fr) 2009-07-16

Family

ID=40467057

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/065642 Ceased WO2009065795A2 (fr) 2007-11-22 2008-11-17 Capteur de pression

Country Status (2)

Country Link
DE (1) DE102007056284A1 (fr)
WO (1) WO2009065795A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019126526A1 (de) * 2019-10-01 2021-04-01 Rapa Automotive Gmbh & Co. Kg Drucksensor mit platine zu platine verbindung
DE102023119941A1 (de) * 2023-05-09 2024-11-14 Sciosense B.V. Sensormodul und Verfahren zur Herstellung eines Sensormoduls

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5257547A (en) * 1991-11-26 1993-11-02 Honeywell Inc. Amplified pressure transducer
US5969259A (en) * 1995-04-07 1999-10-19 Sensym, Inc. Side port package for micromachined fluid sensor
DE19626084C2 (de) * 1996-06-28 2003-04-17 Infineon Technologies Ag Drucksensorvorrichtung für eine Montage auf der Bestückungsoberfläche einer Leiterplatte
US5763787A (en) * 1996-09-05 1998-06-09 Rosemont Inc. Carrier assembly for fluid sensor
DE19703206C2 (de) * 1997-01-29 2002-01-24 Infineon Technologies Ag Drucksensor-Bauteil mit Schlauchanschluß
DE19717348A1 (de) * 1997-04-24 1998-10-29 Siemens Ag Verfahren zum Herstellen einer Sensorbaugruppe sowie Sensorbaugruppe
JP3309808B2 (ja) * 1998-08-04 2002-07-29 株式会社デンソー 圧力検出装置
DE102004032984A1 (de) * 2004-07-08 2006-01-26 Robert Bosch Gmbh Bauraumoptimierte Sensoranbindung

Also Published As

Publication number Publication date
WO2009065795A3 (fr) 2009-07-16
DE102007056284A1 (de) 2009-05-28

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