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WO2009055862A8 - Procédé d'assemblage d'un composant sur un substrat - Google Patents

Procédé d'assemblage d'un composant sur un substrat Download PDF

Info

Publication number
WO2009055862A8
WO2009055862A8 PCT/AU2008/001616 AU2008001616W WO2009055862A8 WO 2009055862 A8 WO2009055862 A8 WO 2009055862A8 AU 2008001616 W AU2008001616 W AU 2008001616W WO 2009055862 A8 WO2009055862 A8 WO 2009055862A8
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
component
free
component assembly
standing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/AU2008/001616
Other languages
English (en)
Other versions
WO2009055862A1 (fr
Inventor
Till Boecking
John Justin Gooding
Kristopher A Kilian
Michael Gal
Katharina Gaus
Peter John Reece
Qiao Hong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NewSouth Innovations Pty Ltd
Original Assignee
NewSouth Innovations Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/933,541 external-priority patent/US20090117339A1/en
Priority claimed from AU2008902248A external-priority patent/AU2008902248A0/en
Application filed by NewSouth Innovations Pty Ltd filed Critical NewSouth Innovations Pty Ltd
Priority to CN200880119793.1A priority Critical patent/CN101903285B/zh
Priority to AU2008318286A priority patent/AU2008318286A1/en
Priority to EP08844674.5A priority patent/EP2212239A4/fr
Priority to US12/740,734 priority patent/US8722437B2/en
Publication of WO2009055862A1 publication Critical patent/WO2009055862A1/fr
Publication of WO2009055862A8 publication Critical patent/WO2009055862A8/fr
Anticipated expiration legal-status Critical
Priority to US14/250,872 priority patent/US9347940B2/en
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/45—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00007—Assembling automatically hinged components, i.e. self-assembly processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/45—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods
    • G01N2021/458—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods using interferential sensor, e.g. sensor fibre, possibly on optical waveguide
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/6428—Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes"
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0816—Multilayer mirrors, i.e. having two or more reflecting layers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/28—Interference filters
    • G02B5/285—Interference filters comprising deposited thin solid films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

L'invention porte sur un procédé d'assemblage d'un composant sur un substrat, et sur un assemblage d'un composant lié sur un substrat. Le procédé comprend les étapes consistant à former un composant autonome ayant une caractéristique optique; réaliser un motif d'une première espèce de liaison sur le substrat ou sur le composant autonome; et former un composant lié sur le substrat à l'aide d'une interaction de liaison par l'intermédiaire de la première espèce de liaison; le composant lié présentant sensiblement la même caractéristique optique que celle du composant autonome.
PCT/AU2008/001616 2007-11-01 2008-10-31 Procédé d'assemblage d'un composant sur un substrat Ceased WO2009055862A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN200880119793.1A CN101903285B (zh) 2007-11-01 2008-10-31 在基片上组装元件的方法
AU2008318286A AU2008318286A1 (en) 2007-11-01 2008-10-31 Method of component assembly on a substrate
EP08844674.5A EP2212239A4 (fr) 2007-11-01 2008-10-31 Procédé d'assemblage d'un composant sur un substrat
US12/740,734 US8722437B2 (en) 2007-11-01 2008-10-31 Method of component assembly on a substrate
US14/250,872 US9347940B2 (en) 2007-11-01 2014-04-11 Method of component assembly on a substrate

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/933,541 2007-11-01
US11/933,541 US20090117339A1 (en) 2007-11-01 2007-11-01 Method of component assembly on a substrate
AU2008902248A AU2008902248A0 (en) 2008-05-08 A sensor structure and a method of fabricating the same
AU2008902248 2008-05-08

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US11/933,541 Continuation-In-Part US20090117339A1 (en) 2007-11-01 2007-11-01 Method of component assembly on a substrate

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/740,734 A-371-Of-International US8722437B2 (en) 2007-11-01 2008-10-31 Method of component assembly on a substrate
US14/250,872 Division US9347940B2 (en) 2007-11-01 2014-04-11 Method of component assembly on a substrate

Publications (2)

Publication Number Publication Date
WO2009055862A1 WO2009055862A1 (fr) 2009-05-07
WO2009055862A8 true WO2009055862A8 (fr) 2009-08-20

Family

ID=40590454

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AU2008/001616 Ceased WO2009055862A1 (fr) 2007-11-01 2008-10-31 Procédé d'assemblage d'un composant sur un substrat

Country Status (4)

Country Link
EP (1) EP2212239A4 (fr)
CN (1) CN101903285B (fr)
AU (1) AU2008318286A1 (fr)
WO (1) WO2009055862A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011016567B4 (de) * 2011-04-08 2023-05-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines optoelektronischen Bauelements und derart hergestelltes Bauelement
CN102313717B (zh) * 2011-08-02 2013-08-28 上海交通大学 多孔硅微腔生物传感器及其制备方法
CN102914503A (zh) * 2012-09-26 2013-02-06 华侨大学 光谱分析仪及其g-t谐振腔阵列的制作方法
GB202014318D0 (en) * 2020-09-11 2020-10-28 Poro Tech Ltd LED Device
CN113049542B (zh) * 2021-05-06 2025-02-07 苏州大学 一种选择性检测分子的硅基反射干涉传感器及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6652808B1 (en) * 1991-11-07 2003-11-25 Nanotronics, Inc. Methods for the electronic assembly and fabrication of devices
US6569382B1 (en) * 1991-11-07 2003-05-27 Nanogen, Inc. Methods apparatus for the electronic, homogeneous assembly and fabrication of devices
GB2366666B (en) * 2000-09-11 2002-12-04 Toshiba Res Europ Ltd An optical device and method for its manufacture
DE10105872A1 (de) * 2001-02-09 2002-09-05 Infineon Technologies Ag Anordnung mit einem Trägersubstrat mit mindestens einem Chip, Matrixdisplay und Verfahren zum Herstellen einer Anordnung mit einem Trägersubstrat mit mindestens einem Chip
US6974604B2 (en) * 2001-09-28 2005-12-13 Hrl Laboratories, Llc Method of self-latching for adhesion during self-assembly of electronic or optical components

Also Published As

Publication number Publication date
EP2212239A1 (fr) 2010-08-04
AU2008318286A1 (en) 2009-05-07
CN101903285A (zh) 2010-12-01
WO2009055862A1 (fr) 2009-05-07
CN101903285B (zh) 2012-07-18
EP2212239A4 (fr) 2014-09-17

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