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WO2009054453A1 - 微小銀粒子含有組成物、その製造方法、微小銀粒子の製造方法および微小銀粒子を有するペースト - Google Patents

微小銀粒子含有組成物、その製造方法、微小銀粒子の製造方法および微小銀粒子を有するペースト Download PDF

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Publication number
WO2009054453A1
WO2009054453A1 PCT/JP2008/069234 JP2008069234W WO2009054453A1 WO 2009054453 A1 WO2009054453 A1 WO 2009054453A1 JP 2008069234 W JP2008069234 W JP 2008069234W WO 2009054453 A1 WO2009054453 A1 WO 2009054453A1
Authority
WO
WIPO (PCT)
Prior art keywords
silver
solution
microparticle
silver microparticle
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/069234
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English (en)
French (fr)
Inventor
Yutaka Hisaeda
Toshihiko Ueyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Electronics Materials Co Ltd
Original Assignee
Dowa Electronics Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40579555&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2009054453(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dowa Electronics Materials Co Ltd filed Critical Dowa Electronics Materials Co Ltd
Priority to CN200880113477.3A priority Critical patent/CN101835557B/zh
Priority to EP08843155.6A priority patent/EP2208559B1/en
Priority to KR1020107019213A priority patent/KR101239563B1/ko
Priority to US12/739,239 priority patent/US8293144B2/en
Publication of WO2009054453A1 publication Critical patent/WO2009054453A1/ja
Anticipated expiration legal-status Critical
Priority to US13/187,159 priority patent/US8486310B2/en
Priority to US13/187,141 priority patent/US8293142B2/en
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0545—Dispersions or suspensions of nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/148—Agglomerating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/11—Powder tap density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)

Abstract

粒度が均一で微細な描画パターンを形成でき、環境負荷が小さい微小銀粒子含有組成物、その製造方法、微小銀粒子の製造方法および微小銀粒子を有するペーストを提供することを目的とする。水とアンモニア水とヘキサン酸とヒドラジン水和水溶液とを含む還元液を調整する調液工程と、硝酸銀水溶液を添加して反応させる銀反応工程と、ろ過・洗浄工程とを行い微小銀粒子を製造する。反応工程は、４０℃から８０℃の間に昇温させた還元液に硝酸銀水溶液を添加して行う。硝酸銀水溶液は一挙に添加する。更に、極性溶媒に前記微小銀粒子含有組成物を分散させて微小銀粒子含有組成物を製造する。炭素数６以下の直鎖脂肪酸と結合した銀粒子を含む微小銀粒子含有組成物が得られる。
PCT/JP2008/069234 2007-10-24 2008-10-23 微小銀粒子含有組成物、その製造方法、微小銀粒子の製造方法および微小銀粒子を有するペースト Ceased WO2009054453A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN200880113477.3A CN101835557B (zh) 2007-10-24 2008-10-23 含微小银粒子的组合物、其制造方法、微小银粒子的制造方法及具有微小银粒子的糊料
EP08843155.6A EP2208559B1 (en) 2007-10-24 2008-10-23 Silver microparticle-containing composition, process for production of the composition, process for production of the silver microparticle, and paste containing the silver microparticle
KR1020107019213A KR101239563B1 (ko) 2007-10-24 2008-10-23 미소 은 입자 함유 조성물 및 미소 은 입자를 갖는 페이스트
US12/739,239 US8293144B2 (en) 2007-10-24 2008-10-23 Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
US13/187,159 US8486310B2 (en) 2007-10-24 2011-07-20 Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
US13/187,141 US8293142B2 (en) 2007-10-24 2011-07-20 Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007276099 2007-10-24
JP2007-276099 2007-10-24

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US12/739,239 A-371-Of-International US8293144B2 (en) 2007-10-24 2008-10-23 Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
US13/187,159 Division US8486310B2 (en) 2007-10-24 2011-07-20 Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
US13/187,141 Division US8293142B2 (en) 2007-10-24 2011-07-20 Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles

Publications (1)

Publication Number Publication Date
WO2009054453A1 true WO2009054453A1 (ja) 2009-04-30

Family

ID=40579555

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069234 Ceased WO2009054453A1 (ja) 2007-10-24 2008-10-23 微小銀粒子含有組成物、その製造方法、微小銀粒子の製造方法および微小銀粒子を有するペースト

Country Status (7)

Country Link
US (3) US8293144B2 (ja)
EP (2) EP3042727B1 (ja)
JP (1) JP4344001B2 (ja)
KR (2) KR101239563B1 (ja)
CN (1) CN101835557B (ja)
TW (1) TWI402118B (ja)
WO (1) WO2009054453A1 (ja)

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CN101996699A (zh) * 2009-08-14 2011-03-30 施乐公司 在降低的加工温度下由银纳米颗粒形成高导电部件的新方法
US20110155968A1 (en) * 2008-06-30 2011-06-30 Dowa Electronics Materials Co., Ltd. Fine metal particle-containing composition and method for manufacturing the same
JP2013196997A (ja) * 2012-03-22 2013-09-30 Toray Ind Inc 導電性組成物
US10941304B2 (en) 2016-04-04 2021-03-09 Nichia Corporation Metal powder sintering paste and method of producing the same, and method of producing conductive material

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US8673049B2 (en) * 2010-08-27 2014-03-18 Dowa Electronics Materials Co., Ltd. Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same
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HUE043602T2 (hu) 2010-11-22 2019-08-28 Dowa Electronics Materials Co Ltd Eljárás összeillesztendõ elemek sokaságának összeillesztésére
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CN103551586B (zh) * 2013-09-22 2015-08-05 江苏瑞德新能源科技有限公司 一种导电银浆用微米球形银粉的制备方法
JP6355240B2 (ja) 2014-05-19 2018-07-11 Ｄｏｗａエレクトロニクス株式会社 銀微粒子分散液
CN104148668A (zh) * 2014-08-22 2014-11-19 宁波蓝威环保科技有限公司 一种液相纳米银胶体的制备方法
US20170306170A1 (en) * 2014-08-29 2017-10-26 SDCmaterials, Inc. Composition comprising nanoparticles with desired sintering and melting point temperatures and methods of making thereof
JP6280497B2 (ja) * 2014-12-12 2018-02-14 株式会社ノリタケカンパニーリミテド 銀ペーストおよびその利用
CN107709418B (zh) 2015-05-08 2021-04-27 汉高知识产权控股有限责任公司 可烧结的膜和膏及其使用方法
CN111521623B (zh) * 2020-04-28 2023-04-07 广西大学 一种提高粉末样品透射电镜原位加热芯片制样成功率的方法
JP7641140B2 (ja) * 2021-03-09 2025-03-06 Ｄｏｗａエレクトロニクス株式会社 銀微粒子の製造方法
CN113773811A (zh) * 2021-09-06 2021-12-10 苏州立昂新材料有限公司 纳米银流体及其制备方法
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EP2208559B1 (en) 2016-04-20
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KR101239563B1 (ko) 2013-03-05
EP3042727B1 (en) 2017-08-30
JP2009120949A (ja) 2009-06-04
US20100243967A1 (en) 2010-09-30
EP2208559A1 (en) 2010-07-21
US8486310B2 (en) 2013-07-16
US8293144B2 (en) 2012-10-23
KR101004553B1 (ko) 2011-01-03
CN101835557A (zh) 2010-09-15
CN101835557B (zh) 2015-01-07
US20110278508A1 (en) 2011-11-17
EP3042727A1 (en) 2016-07-13
JP4344001B2 (ja) 2009-10-14
TWI402118B (zh) 2013-07-21
TW200930482A (en) 2009-07-16
KR20100110884A (ko) 2010-10-13
KR20100046285A (ko) 2010-05-06

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