WO2009053207A2 - Sensor, particularly for measuring rotational speed, and method for producing the same - Google Patents
Sensor, particularly for measuring rotational speed, and method for producing the same Download PDFInfo
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- WO2009053207A2 WO2009053207A2 PCT/EP2008/062831 EP2008062831W WO2009053207A2 WO 2009053207 A2 WO2009053207 A2 WO 2009053207A2 EP 2008062831 W EP2008062831 W EP 2008062831W WO 2009053207 A2 WO2009053207 A2 WO 2009053207A2
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- sensor
- magnet
- sensor element
- grid
- stamped grid
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/026—Housings for speed measuring devices, e.g. pulse generator
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/42—Devices characterised by the use of electric or magnetic means
- G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
- G01P3/48—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
- G01P3/481—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals
- G01P3/487—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals delivered by rotating magnets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/42—Devices characterised by the use of electric or magnetic means
- G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
- G01P3/48—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
- G01P3/481—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals
- G01P3/488—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals delivered by variable reluctance detectors
Definitions
- the invention relates to a sensor, in particular for speed detection and a method for producing the same.
- Sensors for speed detection are known from the prior art, having stamped grid arms, which are first encapsulated with plastic, for example thermoplastics, so as to form a holder.
- plastic for example thermoplastics
- This holder then takes on a magnet, a homogenizing and optionally a sensor element.
- the sensor element may be part of an integrated circuit.
- the electrical connection elements of the sensor element are connected to the stamped grid arms, for example by welding.
- the components with a sheath made of plastic, such as thermosets surrounded.
- Corresponding sensors are installed, for example, in the electronic module for the transmission control.
- the different material pairing of, for example, thermoplastic and thermoset in operation due to the different expansion coefficients cause material stresses between the holder and the sheath.
- the sensor according to the invention with the features of the appended claim 1 advantageously has a high density against liquids and a simple and inexpensive to manufacture overall construction. Due to the fact that the magnet and the homogenizing disk are fastened to the stamped grid by means of stamped grid arms of the stamped grid, it is possible to dispense with a separately produced plastic holder. An occurring due to material stresses between different plastics leakage of the housing is advantageously avoided.
- the sensor element After the attachment of the magnet and the homogenizing disk on the stamped grid, which can be done, for example, by clamping, the sensor element is attached to the stamped grid and then produced a sheathing surrounding at least the sensor element, the magnet and the homogenization.
- the magnet and the homogenizing disc form a stack, which is held between two punched grid sections.
- the stack formed by the magnet and the homogenization disk is clamped on the stamped grid between the stamped grid sections. This simplifies the mounting of the sensor.
- at least one stamped grid section can have a spring element which pretensions the stack formed by the magnet and the homogenizing disc against a second stamped grid section.
- the magnet and / or the homogenizing are fixed potential-free.
- the assembly of the sensor element on the stamped grid can advantageously be simplified in that the sensor element is laterally encompassed by at least two projections of the stamped grid at its circumference.
- the sensor element is then advantageously secured in its position.
- the sensor element is clamped between the projections.
- the sheath is advantageously made of a plastic, in particular a thermosetting plastic.
- Duroplast When using Duroplast as encapsulation only small forces act on the individual parts, whereby the possibility of slipping of the individual parts is reduced.
- FIG. 1 is a schematic exploded view of a known sensor without encapsulation
- FIG. 2 is a schematic representation of a first embodiment of a sensor according to the invention without a casing
- 3a is a schematic representation of a second embodiment of an inventive sensor without wrapping
- FIG. 3b shows another view of FIG. 3a without a homogenizing disk and magnets
- FIG. 4 shows a schematic illustration of the sensor according to the invention with a casing. - A -
- FIG. 1 shows a known sensor 10 without a jacket.
- the sensor has a stamped grid with stamped grid tracks 11 for the electrical contacting of a sensor element 14.
- the sensor element 14 is designed as an integrated circuit 14. Electrical connections of the sensor element 14 are welded onto the stamped lattice webs 11, for example.
- a holder 15 made of plastic is further formed.
- the plastic is, for example, a thermoplastic.
- the holder 15 receives a magnet 12, a homogenizing disk 13 and the sensor element 14. To produce the holder 15, a separate manufacturing step is necessary.
- the holder 15 is made for example by injection molding.
- FIG. 2 shows a schematic representation of a first exemplary embodiment of the sensor 20 according to the invention without sheathing.
- the sensor can be, for example, a sensor for detecting rotational speeds of an engine (crankshaft), for detecting rotational speeds in a transmission or for detecting wheel speeds.
- the sensor may be an active sensor or a passive sensor.
- a sensor is referred to as active in the context of the invention, if it is activated by applying a supply voltage and only then generates an output signal.
- a sensor is called passive when it is operating without supply voltage.
- the sensor can work according to the Hall principle (Hall effect). This has the advantage that the sensor can detect forward and backward movements. It is also possible that the sensor works due to magnetic induction.
- the sensor can be part of an integrated circuit and be designed, for example, as a Hall IC chip.
- the sensor 20 has a stamped grid 21 for electrically contacting the sensor element 14.
- a stamped grid is a two-dimensional or three-dimensional network produced from a metal strip by punching.
- the stamped grid can be encapsulated with plastic / encased.
- the material of the stamped grid can contain CuSn ⁇ .
- the lead frame material can be electrodeposited to provide adhesion enhancement to plastics.
- Connection elements 141, 142 of the sensor element 14 are provided with stamped lattice webs the lead frame 21, for example, connected by welding.
- the sensor element 14 can also be attached to the stamped grid in a detachable or non-detachable manner. This can be done for example by clamping, soldering, crimping and / or welding.
- the punched grid 21 has an additional punched grid arm 22 which holds a magnet 12 and a homogenizing disk 13.
- the additional punched grid arm 22 abuts the homogenizing disk 13 with a first punched grid section on the side of the magnet 12 facing away from the sensor element 14 and with a second punched grid section not visible in FIG. 2, whereby the magnet and the homogenizing disk are held directly on the stamped grid become.
- This is preferably potential-free.
- the magnet and the homogenizing disk can be galvanically separated from each other.
- the magnet used preferably generates a stationary magnetic field. Under a homogenizing according to the invention a component for aligning or influencing the magnetic field understood.
- the homogenizing disc may consist of a soft magnetic material or other suitable materials with which an alignment or influence of the magnetic field can be achieved.
- FIG. 3 a shows a further exemplary embodiment of the sensor according to the invention without the sheathing.
- the punched grid 21 has a U-shaped stamped grid section 210, to which three stamped grid arms 211, 212 and 213 are bent, which are bent away from the stamped grid section 210.
- the stamped grid 21 has a further stamped grid section 214 on which a spring element 214a in the form of an elastically flexible tab is formed, as best seen in FIG. 3b.
- the magnet 12 and the homogenizing disk 13 are inserted between the angled leadframe arms 211, 212 and 213 in such a way that the stamped grid section 214 with the spring element rests against the side of the magnet 12 facing away from the homogenization disk, while one on the rod support arm 212 formed punched grid section 215 abuts the side facing away from the magnet side of the homogenizing disk 13.
- the stack consisting of the magnet 12 and the homogenizing disk 13 is thereby held directly on the stamped grid 21.
- the punched grid sections 214 and 215 form a thrust bearing for the stack.
- the lead frame exerts an elastic biasing force on the stack.
- the sensor element 14 is mounted on the stamped grid.
- the punched grid arms 211, 212 and 213 are bent endwise in the direction of the sensor element 14, whereby projections 216, 217 and 218 are formed, which laterally surround the sensor element 14 during its mounting on its circumference.
- the projections 216 and 217 abut, for example, on sides facing away from each other on the circumference of the sensor element 14.
- the sensor element 14 can be clamped in the projections, so that they generate a clamping force.
- the terminals of the sensor element 14 are contacted with the stamped grid.
- the stamped grid sections 211, 212 and 213 may have, in the middle of their longitudinal extent, bent portions towards the magnet, which abut an example, cylindrical outer wall of the magnet 12, so that it is also mounted in the radial direction.
- FIG. 4 shows the sensor 20 wherein the sheath 31 encloses the magnet 12, the homogenizing disk 13, and the integrated circuit 14. For contacting purposes punched lanes of the lead frame 21 are led out of the sheath 31.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Abstract
Description
Beschreibung description
Titeltitle
Sensor, insbesondere zur Drehzahlerfassung, und Verfahren zur Herstellung desselbenSensor, in particular for speed detection, and method for producing the same
Stand der TechnikState of the art
Die Erfindung betrifft einen Sensor, insbesondere zur Drehzahlerfassung sowie ein Verfahren zur Herstellung desselben.The invention relates to a sensor, in particular for speed detection and a method for producing the same.
Aus dem Stand der Technik sind Sensoren zur Drehzahlerfassung bekannt, die Stanzgitterarme aufweisen, welche zunächst mit Kunststoff, z.B. Thermoplasten, umspritzt wer- den, um so einen Halter zu bilden. Dieser Halter nimmt anschließend einen Magneten, eine Homogenisierungsscheibe und gegebenenfalls ein Sensorelement auf. Das Sensorelement kann Teil eines integrierten Schaltkreises sein. Die elektrischen Anschlusselemente des Sensorelementes werden mit den Stanzgitterarmen beispielsweise durch Schweißen verbunden. Anschließend werden die Bauteile mit einer Ummantelung aus Kunststoff, z.B. Duroplasten, umgeben. Entsprechende Sensoren werden beispielsweise im Elektronikmodul für die Getriebesteuerung verbaut. Bei den bekannten Sensoren kann die unterschiedliche Materialpaarung von z.B. Thermoplast und Duroplast im Betrieb aufgrund der unterschiedlicher Ausdehnungskoeffizienten Materialspannungen zwischen dem Halter und der Ummantelung bewirken. Diese Spannungen können sich wiederum negativ auf die Dichtheit des Aufbaus und damit auf die Lebensdauer des Sensors auswirken. Im Falle der Undichtheit in den Sensor eindringende Flüssigkeiten, beispielsweise ein Getriebefluid, können zur Korrosion und Beschädigung des integrierten Schaltkreises oder der Anschlüsse desselben führen. Die Dichtheit des Sensors gegenüber Flüssigkeiten ist daher ein wichtiges Qualitätserfordernis für insbesondere in der Kraftfahrzeugtechnik eingesetzte Sensoren. Offenbarung der ErfindungSensors for speed detection are known from the prior art, having stamped grid arms, which are first encapsulated with plastic, for example thermoplastics, so as to form a holder. This holder then takes on a magnet, a homogenizing and optionally a sensor element. The sensor element may be part of an integrated circuit. The electrical connection elements of the sensor element are connected to the stamped grid arms, for example by welding. Subsequently, the components with a sheath made of plastic, such as thermosets, surrounded. Corresponding sensors are installed, for example, in the electronic module for the transmission control. In the known sensors, the different material pairing of, for example, thermoplastic and thermoset in operation due to the different expansion coefficients cause material stresses between the holder and the sheath. These stresses can in turn have a negative effect on the tightness of the structure and thus on the life of the sensor. In the event of leakage, liquids entering the sensor, such as a transmission fluid, can result in corrosion and damage to the integrated circuit or its terminals. The tightness of the sensor with respect to liquids is therefore an important quality requirement for sensors used in particular in motor vehicle technology. Disclosure of the invention
Vorteile der ErfindungAdvantages of the invention
Der erfindungsgemäße Sensor mit den Merkmalen des anhängigen Anspruchs 1 weist vorteilhaft eine hohe Dichtheit gegenüber Flüssigkeiten und einen einfach und preisgünstig herzustellenden Gesamtaufbau auf. Dadurch, dass der Magnet und die Homogenisierungsscheibe mittels Stanzgitterarmen des Stanzgitters an dem Stanzgitter befestigt sind, kann auf einen eigens hergestellten separaten Kunststoffhalter verzichtet wer- den. Eine durch Materialspannungen zwischen verschiedenen Kunststoffen auftretende Undichtheit des Gehäuses wird vorteilhaft vermieden. Nach der Befestigung des Magneten und der Homogenisierungsscheibe am Stanzgitter, was beispielsweise durch Einklemmen geschehen kann, wird das Sensorelement an dem Stanzgitter befestigt und anschließend eine wenigstens das Sensorelement, den Magneten und die Homogenisie- rungsscheibe umgebende Ummantelung hergestellt.The sensor according to the invention with the features of the appended claim 1 advantageously has a high density against liquids and a simple and inexpensive to manufacture overall construction. Due to the fact that the magnet and the homogenizing disk are fastened to the stamped grid by means of stamped grid arms of the stamped grid, it is possible to dispense with a separately produced plastic holder. An occurring due to material stresses between different plastics leakage of the housing is advantageously avoided. After the attachment of the magnet and the homogenizing disk on the stamped grid, which can be done, for example, by clamping, the sensor element is attached to the stamped grid and then produced a sheathing surrounding at least the sensor element, the magnet and the homogenization.
Vorteilhafte Ausbildungen und Weiterentwicklungen der Erfindung werden durch die in den abhängigen Ansprüchen angegebenen Maßnahmen ermöglicht.Advantageous embodiments and further developments of the invention are made possible by the measures specified in the dependent claims.
Vorteilhaft bilden der Magnet und die Homogenisierungsscheibe einen Stapel, der zwischen zwei Stanzgitterabschnitten gehalten ist. In besonders vorteilhafter Ausgestaltung ist der durch den Magneten und die Homogenisierungsscheibe gebildete Stapel an dem Stanzgitter zwischen den Stanzgitterabschnitten eingespannt. Hierdurch wird die Montage des Sensors vereinfacht. Zu diesem Zweck kann wenigstens ein Stanzgitterab- schnitt ein Federelement aufweisen, das den durch den Magneten und die Homogenisierungsscheibe gebildeten Stapel gegen einen zweiten Stanzgitterabschnitt vorspannt.Advantageously, the magnet and the homogenizing disc form a stack, which is held between two punched grid sections. In a particularly advantageous embodiment, the stack formed by the magnet and the homogenization disk is clamped on the stamped grid between the stamped grid sections. This simplifies the mounting of the sensor. For this purpose, at least one stamped grid section can have a spring element which pretensions the stack formed by the magnet and the homogenizing disc against a second stamped grid section.
In einem bevorzugten Ausführungsbeispiel sind der Magnet und/oder die Homogenisierungsscheibe potentialfrei befestigt.In a preferred embodiment, the magnet and / or the homogenizing are fixed potential-free.
Die Montage des Sensorelementes an dem Stanzgitter kann vorteilhaft dadurch vereinfacht werden, dass das Sensorelement an seinem Umfang von wenigstens zwei Vorsprüngen des Stanzgitters seitlich umfasst wird. Bei der Herstellung der Ummantelung ist das Sensorelement dann vorteilhaft in seiner Lage gesichert. Insbesondere ist es vorteilhaft, wenn das Sensorelement zwischen den Vorsprüngen eingeklemmt wird.The assembly of the sensor element on the stamped grid can advantageously be simplified in that the sensor element is laterally encompassed by at least two projections of the stamped grid at its circumference. In the production of the jacket the sensor element is then advantageously secured in its position. In particular, it is advantageous if the sensor element is clamped between the projections.
Die Ummantelung wird vorteilhaft aus einem Kunststoff insbesondere einem Duroplast hergestellt. Bei der Verwendung von Duroplast als Umspritzung wirken nur geringe Kräfte auf die einzelnen Teile, wodurch die Möglichkeit eines Verrutschens der einzelnen Teile verringert wird.The sheath is advantageously made of a plastic, in particular a thermosetting plastic. When using Duroplast as encapsulation only small forces act on the individual parts, whereby the possibility of slipping of the individual parts is reduced.
Weiterhin vorteilhaft ist ein Verfahren zur Herstellung des erfindungsgemäßen Sensors, bei dem der Magnet und die Homogenisierungsscheibe an Stanzgitterabschnitten des Stanzgitters befestigt werden, anschließend das Sensorelement an dem Stanzgitter befestigt wird und schließlich eine Ummantelung zumindest des Sensorelementes, des Magneten und der Homogenisierungsscheibe hergestellt wird.Also advantageous is a method for producing the sensor according to the invention, in which the magnet and the homogenizing are attached to punched grid sections of the stamped grid, then the sensor element is attached to the stamped grid and finally a jacket of at least the sensor element, the magnet and the homogenization is made.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Die Erfindung wird nachstehend anhand der beigefügten Zeichnungen beispielhaft näher erläutert. Es zeigen:The invention will now be described by way of example with reference to the accompanying drawings. Show it:
Fig. 1 eine schematische Explosionsdarstellung eines bekannten Sensors ohne Umspritzung,1 is a schematic exploded view of a known sensor without encapsulation,
Fig. 2 eine schematische Darstellung eines ersten Ausführungsbeispiels eines erfindungsgemäßen Sensors ohne Umhüllung,2 is a schematic representation of a first embodiment of a sensor according to the invention without a casing,
Fig. 3a eine schematische Darstellung eines zweiten Ausführungsbeispiels eines erfin- dungsgemäßen Sensors ohne Umhüllung,3a is a schematic representation of a second embodiment of an inventive sensor without wrapping,
Fig. 3b eine andere Ansicht von Fig. 3a ohne Homogenisierungsscheibe und Magneten und Fig. 4 eine schematische Darstellung des erfindungsgemäßen Sensors mit Umhüllung. - A -FIG. 3b shows another view of FIG. 3a without a homogenizing disk and magnets, and FIG. 4 shows a schematic illustration of the sensor according to the invention with a casing. - A -
Ausführungsformen der ErfindungEmbodiments of the invention
In Figur 1 ist ein bekannter Sensor 10 ohne Ummantelung dargestellt. Der Sensor weist ein Stanzgitter mit Stanzgitterbahnen 11 zur elektrischen Kontaktierung eines Sensor- elementes 14 auf. Das Sensorelement 14 ist als integrierter Schaltkreises 14 ausgebildet. Elektrische Anschlüsse des Sensorelementes 14 werden auf die Stanzgitterbahnen 11 beispielsweise aufgeschweißt. An den Stanzgitterbahnen 11 ist weiterhin ein Halter 15 aus Kunststoff angeformt. Bei dem Kunststoff handelt es sich beispielsweise um ein Thermoplast. Der Halter 15 nimmt einen Magneten 12, eine Homogenisierungsscheibe 13 und das Sensorelement 14 auf. Zur Herstellung des Halters 15 ist ein eigener Herstellungsschritt nötig. Der Halter 15 wird beispielsweise im Spritzgussverfahren angefertigt.FIG. 1 shows a known sensor 10 without a jacket. The sensor has a stamped grid with stamped grid tracks 11 for the electrical contacting of a sensor element 14. The sensor element 14 is designed as an integrated circuit 14. Electrical connections of the sensor element 14 are welded onto the stamped lattice webs 11, for example. At the punched grid tracks 11, a holder 15 made of plastic is further formed. The plastic is, for example, a thermoplastic. The holder 15 receives a magnet 12, a homogenizing disk 13 and the sensor element 14. To produce the holder 15, a separate manufacturing step is necessary. The holder 15 is made for example by injection molding.
Figur 2 stellt eine schematische Darstellung eines ersten Ausführungsbeispiels des er- findungsgemäßen Sensors 20 ohne Ummantelung dar. Der Sensor kann beispielsweise ein Sensor zur Erfassung von Drehzahlen eines Motors (Kurbelwelle), zur Erfassung von Drehzahlen in einem Getriebe oder zur Erfassung von Raddrehzahlen sein. Der Sensor kann ein aktiver Sensor oder ein passiver Sensor sein. Dabei wird im Sinne der Erfindung ein Sensor als aktiv bezeichnet, wenn er durch Anlegen einer Versorgungs- Spannung aktiviert wird und erst dann ein Ausgangssignal generiert. Ein Sensor wird als passiv bezeichnet, wenn er ohne Versorgungsspannung arbeitet. Des Weiteren kann der Sensor nach dem Hall-Prinzip (Hall-Effekt) arbeiten. Dies hat den Vorteil, dass der Sensor Vorwärts- und Rückwärtsbewegungen erkennen kann. Es ist auch möglich, dass der Sensor aufgrund magnetischer Induktion arbeitet. Der Sensor kann Teil einer integ- rierten Schaltung sein und beispielsweise als Hall-IC-Chip ausgebildet sein.FIG. 2 shows a schematic representation of a first exemplary embodiment of the sensor 20 according to the invention without sheathing. The sensor can be, for example, a sensor for detecting rotational speeds of an engine (crankshaft), for detecting rotational speeds in a transmission or for detecting wheel speeds. The sensor may be an active sensor or a passive sensor. In this case, a sensor is referred to as active in the context of the invention, if it is activated by applying a supply voltage and only then generates an output signal. A sensor is called passive when it is operating without supply voltage. Furthermore, the sensor can work according to the Hall principle (Hall effect). This has the advantage that the sensor can detect forward and backward movements. It is also possible that the sensor works due to magnetic induction. The sensor can be part of an integrated circuit and be designed, for example, as a Hall IC chip.
Wie in Figur 2 zu erkennen ist, weist der Sensor 20 ein Stanzgitter 21 zur elektrischen Kontaktierung des Sensorelementes 14 auf. Im Sinne der Erfindung ist ein Stanzgitter ein aus einem Metallstreifen durch Stanzen erzeugtes zwei- oder dreidimensionales Netzwerk. Das Stanzgitter kann mit Kunststoff umspritzt / ummantelt werden. Das Material des Stanzgitters kann CuSnβ enthalten. Ferner kann das Stanzgittermaterial galvanisch beschichtet werden, um eine Haftungsverbesserung mit Kunststoffen herbeizuführen. Anschlusselemente 141, 142 des Sensorelementes 14 sind mit Stanzgitterbahnen des Stanzgitters 21 beispielsweise durch Schweißen verbunden. Natürlich kann das Sensorelement 14 auch in anderer Weise an dem Stanzgitter lösbar oder unlösbar befestigt werden. Dies kann beispielsweise durch Klemmen, Löten, Crimpen und/oder Schweißen erfolgen.As can be seen in FIG. 2, the sensor 20 has a stamped grid 21 for electrically contacting the sensor element 14. For the purposes of the invention, a stamped grid is a two-dimensional or three-dimensional network produced from a metal strip by punching. The stamped grid can be encapsulated with plastic / encased. The material of the stamped grid can contain CuSnβ. Further, the lead frame material can be electrodeposited to provide adhesion enhancement to plastics. Connection elements 141, 142 of the sensor element 14 are provided with stamped lattice webs the lead frame 21, for example, connected by welding. Of course, the sensor element 14 can also be attached to the stamped grid in a detachable or non-detachable manner. This can be done for example by clamping, soldering, crimping and / or welding.
Das Stanzgitter 21 weist einen zusätzlichen Stanzgitterarm 22 auf, der einen Magneten 12 und eine Homogenisierungsscheibe 13 hält. Der zusätzliche Stanzgitterarm 22 liegt mit einem ersten Stanzgitterabschnitt an der von dem Sensorelement 14 abgewandten Seite des Magneten 12 und mit einem in Figur 2 nicht zu erkennbaren zweiten Stanzgit- terabschnitt an der Homogenisierungsscheibe 13 an, wodurch der Magnet und die Homogenisierungsscheibe unmittelbar an dem Stanzgitter gehalten werden. Dies erfolgt vorzugsweise potentialfrei. Der Magnet und die Homogenisierungsscheibe können galvanisch voneinander getrennt sein. Der verwendete Magnet erzeugt vorzugsweise ein stationäres Magnetfeld. Unter einer Homogenisierungsscheibe wird erfindungsgemäß ein Bauteil zur Ausrichtung oder Beeinflussung des Magnetfeldes verstanden. Die Homogenisierungsscheibe kann dabei aus einem weichmagnetischen Werkstoff oder anderen geeigneten Werkstoffen bestehen, mit denen eine Ausrichtung oder Beeinflussung des Magnetfelds erreicht werden kann.The punched grid 21 has an additional punched grid arm 22 which holds a magnet 12 and a homogenizing disk 13. The additional punched grid arm 22 abuts the homogenizing disk 13 with a first punched grid section on the side of the magnet 12 facing away from the sensor element 14 and with a second punched grid section not visible in FIG. 2, whereby the magnet and the homogenizing disk are held directly on the stamped grid become. This is preferably potential-free. The magnet and the homogenizing disk can be galvanically separated from each other. The magnet used preferably generates a stationary magnetic field. Under a homogenizing according to the invention a component for aligning or influencing the magnetic field understood. The homogenizing disc may consist of a soft magnetic material or other suitable materials with which an alignment or influence of the magnetic field can be achieved.
In Figur 3 a ist ein weiteres Ausführungsbeispiel des erfmdungsgemäßen Sensors ohne die Ummantelung dargestellt. In Figur 3 a ist zu erkennen, dass das Stanzgitter 21 einen U-förmigen Stanzgitterabschnitt 210 aufweist, an den drei Stanzgitterarme 211, 212 und 213 angeformt sind, die von dem Stanzgitterabschnitt 210 abgebogen sind. Das Stanzgitter 21 weist einen weiteren Stanzgitterabschnitt 214 auf, an dem ein Federelement 214a in Form einer elastisch biegsamen Lasche ausgebildet ist, wie am besten in Figur 3b zu erkennen ist. Bei der Montage des Sensors wird der Magnet 12 und die Homogenisierungsscheibe 13 zwischen den abgewinkelten Stanzgitterarmen 211, 212 und 213 derart eingeschoben, dass der Stanzgitterabschnitt 214 mit dem Federelement an der von der Homogenisierungsscheibe abgewandten Seite des Magneten 12 anliegt, während ein an dem Stangitterarm 212 ausgebildeter Stanzgitterabschnitt 215 an der von dem Magneten abgewandten Seite der Homogenisierungsscheibe 13 anliegt. Der aus dem Magneten 12 und der Homogenisierungsscheibe 13 bestehende Stapel wird dadurch unmittelbar an dem Stanzgitter 21 gehalten. Die Stanzgitterabschnitte 214 und 215 bilden dabei ein Axiallager für den Stapel. Durch das Federelement 214a übt das Stanzgitter eine elastische Vorspannkraft auf den Stapel aus.FIG. 3 a shows a further exemplary embodiment of the sensor according to the invention without the sheathing. In FIG. 3 a, it can be seen that the punched grid 21 has a U-shaped stamped grid section 210, to which three stamped grid arms 211, 212 and 213 are bent, which are bent away from the stamped grid section 210. The stamped grid 21 has a further stamped grid section 214 on which a spring element 214a in the form of an elastically flexible tab is formed, as best seen in FIG. 3b. During assembly of the sensor, the magnet 12 and the homogenizing disk 13 are inserted between the angled leadframe arms 211, 212 and 213 in such a way that the stamped grid section 214 with the spring element rests against the side of the magnet 12 facing away from the homogenization disk, while one on the rod support arm 212 formed punched grid section 215 abuts the side facing away from the magnet side of the homogenizing disk 13. The stack consisting of the magnet 12 and the homogenizing disk 13 is thereby held directly on the stamped grid 21. The punched grid sections 214 and 215 form a thrust bearing for the stack. By the spring element 214a, the lead frame exerts an elastic biasing force on the stack.
Anschließend wird das Sensorelement 14 an dem Stanzgitter montiert. Bei dem in Figur 3 a und 3b dargestellten Ausführungsbeispiel sind die Stanzgitterarme 211, 212 und 213 endseitig in Richtung des Sensorelementes 14 abgebogen, wodurch Vorsprünge 216, 217 und 218 gebildet sind, die das Sensorelement 14 bei dessen Montage an seinem Umfang seitlich umfassen. Die Vorsprünge 216 und 217 liegen beispielsweise an voneinander abgewandten Seiten am Umfang des Sensorelementes 14 an. Das Sensorele- ment 14 kann in die Vorsprünge eingeklemmt werden, so dass diese eine Spannkraft erzeugen. Anschließend werden die Anschlüsse des Sensorelementes 14 mit dem Stanzgitter kontaktiert. Weiterhin können die Stanzgitterabschnitte 211, 212 und 213 in der Mitte ihrer Längserstreckung zu dem Magneten hin abgebogene Abschnitte aufweisen, die an einer beispielsweise zylindrischen Außenwand des Magneten 12 anliegen, so dass dieser auch in radialer Richtung gelagert ist.Subsequently, the sensor element 14 is mounted on the stamped grid. In the embodiment shown in Figure 3a and 3b, the punched grid arms 211, 212 and 213 are bent endwise in the direction of the sensor element 14, whereby projections 216, 217 and 218 are formed, which laterally surround the sensor element 14 during its mounting on its circumference. The projections 216 and 217 abut, for example, on sides facing away from each other on the circumference of the sensor element 14. The sensor element 14 can be clamped in the projections, so that they generate a clamping force. Subsequently, the terminals of the sensor element 14 are contacted with the stamped grid. Furthermore, the stamped grid sections 211, 212 and 213 may have, in the middle of their longitudinal extent, bent portions towards the magnet, which abut an example, cylindrical outer wall of the magnet 12, so that it is also mounted in the radial direction.
Wie in Figur 4 dargestellt ist, wird der Sensor 20 nach der Montage des Magneten, der Homogenisierungsscheibe und des Sensorelementes 14 mit einer Ummantelung aus beispielsweise Duroplast umgeben. In Figur 3 ist der Sensor 20 dargestellt, wobei die Ummantelung 31 den Magneten 12, die Homogenisierungsscheibe 13, sowie den integrierten Schaltkreis 14 umschließt. Zu Kontaktierungszwecken sind Stanzgitterbahnen des Stanzgitters 21 aus der Ummantelung 31 herausgeführt. As shown in FIG. 4, after the magnet, the homogenizing disk and the sensor element 14 have been mounted, the sensor 20 is surrounded by a sheath made of, for example, duroplastic. FIG. 3 shows the sensor 20, wherein the sheath 31 encloses the magnet 12, the homogenizing disk 13, and the integrated circuit 14. For contacting purposes punched lanes of the lead frame 21 are led out of the sheath 31.
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200710050988 DE102007050988A1 (en) | 2007-10-25 | 2007-10-25 | Sensor, in particular for speed detection, and method for producing the same |
| DE102007050988.1 | 2007-10-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2009053207A2 true WO2009053207A2 (en) | 2009-04-30 |
| WO2009053207A3 WO2009053207A3 (en) | 2009-06-18 |
Family
ID=40490150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2008/062831 Ceased WO2009053207A2 (en) | 2007-10-25 | 2008-09-25 | Sensor, particularly for measuring rotational speed, and method for producing the same |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE102007050988A1 (en) |
| WO (1) | WO2009053207A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9612365B2 (en) | 2011-12-23 | 2017-04-04 | Johnson & Johnson Vision Care, Inc. | Silicone hydrogels having desirable water content and oxygen permeability |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009029265A1 (en) | 2009-09-08 | 2011-03-10 | Robert Bosch Gmbh | Method for producing a sensor |
| DE102010063614B4 (en) * | 2010-12-21 | 2024-05-08 | Zf Friedrichshafen Ag | Method for manufacturing a sensor assembly |
| DE102013226045A1 (en) * | 2013-12-16 | 2015-06-18 | Continental Teves Ag & Co. Ohg | Mechanically over-determined built-in speed sensor with elastic encapsulation |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5963028A (en) * | 1997-08-19 | 1999-10-05 | Allegro Microsystems, Inc. | Package for a magnetic field sensing device |
| DE102004061260A1 (en) * | 2004-12-20 | 2006-06-29 | Robert Bosch Gmbh | magnetic field sensor |
| DE102005027767A1 (en) * | 2005-06-15 | 2006-12-28 | Infineon Technologies Ag | Integrated magnetic sensor component for e.g. measuring magnetic field intensity, has contact surfaces electrically connected with flat conductors by flip-chip-contacts and homogenization disk attached between semiconductor chip and magnet |
-
2007
- 2007-10-25 DE DE200710050988 patent/DE102007050988A1/en not_active Withdrawn
-
2008
- 2008-09-25 WO PCT/EP2008/062831 patent/WO2009053207A2/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9612365B2 (en) | 2011-12-23 | 2017-04-04 | Johnson & Johnson Vision Care, Inc. | Silicone hydrogels having desirable water content and oxygen permeability |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009053207A3 (en) | 2009-06-18 |
| DE102007050988A1 (en) | 2009-04-30 |
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