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WO2009051001A1 - 一方向流体移動装置 - Google Patents

一方向流体移動装置 Download PDF

Info

Publication number
WO2009051001A1
WO2009051001A1 PCT/JP2008/067547 JP2008067547W WO2009051001A1 WO 2009051001 A1 WO2009051001 A1 WO 2009051001A1 JP 2008067547 W JP2008067547 W JP 2008067547W WO 2009051001 A1 WO2009051001 A1 WO 2009051001A1
Authority
WO
WIPO (PCT)
Prior art keywords
loop
fluid moving
moving route
shaped fluid
moving device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/067547
Other languages
English (en)
French (fr)
Inventor
Shoichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THREE EYE CO Ltd
Original Assignee
THREE EYE CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THREE EYE CO Ltd filed Critical THREE EYE CO Ltd
Priority to JP2009538031A priority Critical patent/JPWO2009051001A1/ja
Publication of WO2009051001A1 publication Critical patent/WO2009051001A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P3/00—Liquid cooling
    • F01P3/22—Liquid cooling characterised by evaporation and condensation of coolant in closed cycles; characterised by the coolant reaching higher temperatures than normal atmospheric boiling-point
    • F01P2003/2278—Heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P2060/00—Cooling circuits using auxiliaries
    • F01P2060/02—Intercooler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

　簡素な構造で熱伝達性能に優れたヒートパイプが提供される。ループ式ヒートパイプ１は、蒸発部２と蒸気リッチ管部４と、凝縮部３と液リッチ管部５とを順次接続してなるループ状の流体移動経路をもつ。このループ状の流体移動経路には、ノズル部６とディフューザ部７とが形成されている。これにより、ループ状の流体移動経路の順方向流体抵抗と逆方向流体抵抗とに差を設けて、ループ状の流体移動経路に一方向の蒸気流を形成する。
PCT/JP2008/067547 2007-10-19 2008-09-26 一方向流体移動装置 Ceased WO2009051001A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009538031A JPWO2009051001A1 (ja) 2007-10-19 2008-09-26 一方向流体移動装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-272804 2007-10-19
JP2007272804 2007-10-19

Publications (1)

Publication Number Publication Date
WO2009051001A1 true WO2009051001A1 (ja) 2009-04-23

Family

ID=40567274

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067547 Ceased WO2009051001A1 (ja) 2007-10-19 2008-09-26 一方向流体移動装置

Country Status (2)

Country Link
JP (1) JPWO2009051001A1 (ja)
WO (1) WO2009051001A1 (ja)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010117092A1 (en) * 2009-04-10 2010-10-14 Three Eye Co., Ltd. Loop heat pipe with nozzle and diffuser
CN107084569A (zh) * 2017-05-12 2017-08-22 威海职业学院 高效制冷电冰箱
JP2020034185A (ja) * 2018-08-27 2020-03-05 新光電気工業株式会社 冷却器
CN111578756A (zh) * 2020-04-02 2020-08-25 南方科技大学 梯度润湿性环路热管
EP3958432A1 (en) * 2020-08-19 2022-02-23 Nokia Technologies Oy Cooling apparatus
CN114838606A (zh) * 2022-03-28 2022-08-02 华北电力大学 一种二极管相分离蒸发器
CN114857968A (zh) * 2022-05-31 2022-08-05 广州大学 一种双环结构气体单向流反重力平板热管
CN115087295A (zh) * 2021-03-12 2022-09-20 北京小米移动软件有限公司 中框组件、中框组件的制造方法以及移动终端
CN115451739A (zh) * 2022-10-20 2022-12-09 北京航空航天大学 一种换热流道及热管、换热器
JP2023046034A (ja) * 2021-09-22 2023-04-03 スタンレー電気株式会社 成形構造体
CN116518761A (zh) * 2023-05-09 2023-08-01 广州大学 一种单向气流的多级分压式热二极管及其加工方法
EP4317888A1 (en) * 2022-08-02 2024-02-07 Vast Glory Electronic & Hardware & Plastic (Hui Zhou) Ltd Heat dissipating device
CN119658599A (zh) * 2024-11-18 2025-03-21 南京航空航天大学 一种用于航空航天高强韧难加工材料磨削的间歇式振荡热管砂轮及其制作方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112556468A (zh) * 2020-11-20 2021-03-26 广州大学 一种单向传热管及其加工方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5447162A (en) * 1977-09-02 1979-04-13 Euratom Heat pump
JPS6069493A (ja) * 1983-09-27 1985-04-20 Toshiba Corp 伝熱管
JPH01127895A (ja) * 1987-11-04 1989-05-19 Akutoronikusu Kk 閉ループ管型熱伝達装置
JPH01189496A (ja) * 1988-01-21 1989-07-28 Akutoronikusu Kk ループ管型熱伝達装置
JPH07332881A (ja) * 1994-06-09 1995-12-22 Akutoronikusu Kk ループ型蛇行細管ヒートパイプ
JPH11201592A (ja) * 1998-01-17 1999-07-30 Tsuneo Arii 冷媒回収法およびそのための装置と工具
JP2002349975A (ja) * 2001-02-28 2002-12-04 Sony Corp 熱輸送装置
JP2004308948A (ja) * 2003-04-03 2004-11-04 Mitsubishi Electric Corp ヒートパイプ及びそれを用いた冷却装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5447162A (en) * 1977-09-02 1979-04-13 Euratom Heat pump
JPS6069493A (ja) * 1983-09-27 1985-04-20 Toshiba Corp 伝熱管
JPH01127895A (ja) * 1987-11-04 1989-05-19 Akutoronikusu Kk 閉ループ管型熱伝達装置
JPH01189496A (ja) * 1988-01-21 1989-07-28 Akutoronikusu Kk ループ管型熱伝達装置
JPH07332881A (ja) * 1994-06-09 1995-12-22 Akutoronikusu Kk ループ型蛇行細管ヒートパイプ
JPH11201592A (ja) * 1998-01-17 1999-07-30 Tsuneo Arii 冷媒回収法およびそのための装置と工具
JP2002349975A (ja) * 2001-02-28 2002-12-04 Sony Corp 熱輸送装置
JP2004308948A (ja) * 2003-04-03 2004-11-04 Mitsubishi Electric Corp ヒートパイプ及びそれを用いた冷却装置

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010117092A1 (en) * 2009-04-10 2010-10-14 Three Eye Co., Ltd. Loop heat pipe with nozzle and diffuser
CN107084569A (zh) * 2017-05-12 2017-08-22 威海职业学院 高效制冷电冰箱
JP7161343B2 (ja) 2018-08-27 2022-10-26 新光電気工業株式会社 冷却器
JP2020034185A (ja) * 2018-08-27 2020-03-05 新光電気工業株式会社 冷却器
CN111578756A (zh) * 2020-04-02 2020-08-25 南方科技大学 梯度润湿性环路热管
EP3958432A1 (en) * 2020-08-19 2022-02-23 Nokia Technologies Oy Cooling apparatus
US12253286B2 (en) 2020-08-19 2025-03-18 Nokia Technologies Oy Cooling apparatus
CN115087295A (zh) * 2021-03-12 2022-09-20 北京小米移动软件有限公司 中框组件、中框组件的制造方法以及移动终端
JP2023046034A (ja) * 2021-09-22 2023-04-03 スタンレー電気株式会社 成形構造体
JP7734545B2 (ja) 2021-09-22 2025-09-05 スタンレー電気株式会社 成形構造体
CN114838606A (zh) * 2022-03-28 2022-08-02 华北电力大学 一种二极管相分离蒸发器
CN114857968A (zh) * 2022-05-31 2022-08-05 广州大学 一种双环结构气体单向流反重力平板热管
EP4317888A1 (en) * 2022-08-02 2024-02-07 Vast Glory Electronic & Hardware & Plastic (Hui Zhou) Ltd Heat dissipating device
US12144150B2 (en) 2022-08-02 2024-11-12 Vast Glory Electronic & Hardware & Plastic (Hui Zhou) Ltd Heat dissipating device
CN115451739A (zh) * 2022-10-20 2022-12-09 北京航空航天大学 一种换热流道及热管、换热器
CN116518761A (zh) * 2023-05-09 2023-08-01 广州大学 一种单向气流的多级分压式热二极管及其加工方法
CN119658599A (zh) * 2024-11-18 2025-03-21 南京航空航天大学 一种用于航空航天高强韧难加工材料磨削的间歇式振荡热管砂轮及其制作方法

Also Published As

Publication number Publication date
JPWO2009051001A1 (ja) 2011-03-03

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