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WO2009048095A1 - 伝送線路を有する回路装置及びプリント回路基板 - Google Patents

伝送線路を有する回路装置及びプリント回路基板 Download PDF

Info

Publication number
WO2009048095A1
WO2009048095A1 PCT/JP2008/068346 JP2008068346W WO2009048095A1 WO 2009048095 A1 WO2009048095 A1 WO 2009048095A1 JP 2008068346 W JP2008068346 W JP 2008068346W WO 2009048095 A1 WO2009048095 A1 WO 2009048095A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conductive
convex
transmission line
concave
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/068346
Other languages
English (en)
French (fr)
Inventor
Naoya Tamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2009537020A priority Critical patent/JPWO2009048095A1/ja
Publication of WO2009048095A1 publication Critical patent/WO2009048095A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Waveguides (AREA)

Abstract

　伝送線路を有する回路装置において、簡便な構造で不要なモードの影響を抑制し、伝播特性の劣化を抑制する回路装置を提供する。回路装置は、伝送線路を構成する導電性ストリップと、導電性ストリップに平行に対向配置された導電性プレーンとを有する。導電性プレーンの周囲外形の少なくとも一部が、凹部及び凸部から成る連続的な凸凹形状で構成される。好適には、導電性プレーンに発生させたくない伝播モードの波長をλとしたとき、導電性プレーンの凹凸形状の隣り合う凹部の間隔がλのｎ／４倍（ｎは奇数）である。導電性プレーンの凹部の長さについて、λの成分が凹部の長さ方向に伝播する場合のモード波長のｎ／４倍（ｎは奇数）、あるいは導電性プレーンの凸部の長さについて、λの成分が凸部の長さ方向に伝播する場合のモード波長のｎ／４倍（ｎは奇数）である。
PCT/JP2008/068346 2007-10-09 2008-10-09 伝送線路を有する回路装置及びプリント回路基板 Ceased WO2009048095A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009537020A JPWO2009048095A1 (ja) 2007-10-09 2008-10-09 伝送線路を有する回路装置及びプリント回路基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007263484 2007-10-09
JP2007-263484 2007-10-09

Publications (1)

Publication Number Publication Date
WO2009048095A1 true WO2009048095A1 (ja) 2009-04-16

Family

ID=40549238

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068346 Ceased WO2009048095A1 (ja) 2007-10-09 2008-10-09 伝送線路を有する回路装置及びプリント回路基板

Country Status (2)

Country Link
JP (1) JPWO2009048095A1 (ja)
WO (1) WO2009048095A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015080018A (ja) * 2013-10-15 2015-04-23 富士通株式会社 半導体装置
JP2017201754A (ja) * 2016-05-06 2017-11-09 株式会社デンソーウェーブ 無線装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3297093B1 (de) * 2016-09-16 2019-01-02 Rosenberger Hochfrequenztechnik GmbH & Co. KG Steckverbinder zum verbinden einer optischen faser und eines elektrischen leiters

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09219607A (ja) * 1996-02-13 1997-08-19 Murata Mfg Co Ltd 伝送線路
WO2001067540A1 (en) * 2000-03-06 2001-09-13 Fujitsu Limited Shielding metal plate and circuit device comprising the same
JP2001352204A (ja) * 2000-06-08 2001-12-21 Murata Mfg Co Ltd 伝送線路およびそれを用いた回路素子およびそれらを用いた電子回路およびそれを用いた電子装置
US20020084876A1 (en) * 2000-12-29 2002-07-04 Wright Mitchel E. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09219607A (ja) * 1996-02-13 1997-08-19 Murata Mfg Co Ltd 伝送線路
WO2001067540A1 (en) * 2000-03-06 2001-09-13 Fujitsu Limited Shielding metal plate and circuit device comprising the same
JP2001352204A (ja) * 2000-06-08 2001-12-21 Murata Mfg Co Ltd 伝送線路およびそれを用いた回路素子およびそれらを用いた電子回路およびそれを用いた電子装置
US20020084876A1 (en) * 2000-12-29 2002-07-04 Wright Mitchel E. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
T.H.LOH ET AL.: "Photonic bandgap surfaces with interdigitated corrugations", ELECTRONICS LETTERS, vol. 40, no. 18, 22 September 2004 (2004-09-22), pages 1123 - 1125 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015080018A (ja) * 2013-10-15 2015-04-23 富士通株式会社 半導体装置
JP2017201754A (ja) * 2016-05-06 2017-11-09 株式会社デンソーウェーブ 無線装置

Also Published As

Publication number Publication date
JPWO2009048095A1 (ja) 2011-02-24

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