WO2009047981A1 - Procédé de fabrication de transistor en couches minces - Google Patents
Procédé de fabrication de transistor en couches minces Download PDFInfo
- Publication number
- WO2009047981A1 WO2009047981A1 PCT/JP2008/067257 JP2008067257W WO2009047981A1 WO 2009047981 A1 WO2009047981 A1 WO 2009047981A1 JP 2008067257 W JP2008067257 W JP 2008067257W WO 2009047981 A1 WO2009047981 A1 WO 2009047981A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thin film
- film transistor
- manufacturing
- manufacturing thin
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/655—Aromatic compounds comprising a hetero atom comprising only sulfur as heteroatom
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/657—Polycyclic condensed heteroaromatic hydrocarbons
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Formation Of Insulating Films (AREA)
- Thin Film Transistor (AREA)
Abstract
L'invention porte sur un procédé de fabrication d'un transistor à couches minces organique haute performance, dans lequel un film isolant de grille est formé par traitement au plasma d'une couche de revêtement à forte adhérence et un motif de film mince semi-conducteur organique est formé avec une précision élevée par maîtrise de l'énergie de surface avec un matériau de traitement de surface. Ce procédé pour fabriquer un transistor à couches minces organique est caractérisé par l'utilisation, en tant que film isolant de grille, d'une couche comportant une couche contenant de l'oxyde de silicium dans la surface qui est formée par oxydation d'une couche contenant du silicium formée sur un substrat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009536965A JP5454143B2 (ja) | 2007-10-09 | 2008-09-25 | 薄膜トランジスタの製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-263045 | 2007-10-09 | ||
| JP2007263045 | 2007-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009047981A1 true WO2009047981A1 (fr) | 2009-04-16 |
Family
ID=40549126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/067257 Ceased WO2009047981A1 (fr) | 2007-10-09 | 2008-09-25 | Procédé de fabrication de transistor en couches minces |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5454143B2 (fr) |
| WO (1) | WO2009047981A1 (fr) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2462157A (en) * | 2008-07-29 | 2010-02-03 | Korea Electronics Telecomm | Method of fabricating organic thin film transistor using surface energy control |
| JP2010263103A (ja) * | 2009-05-08 | 2010-11-18 | Konica Minolta Holdings Inc | 薄膜トランジスタ、及びその製造方法 |
| WO2012063474A1 (fr) * | 2010-11-10 | 2012-05-18 | パナソニック株式会社 | Dispositif de traitement par plasma et procédé de traitement par plasma |
| JP2012129396A (ja) * | 2010-12-16 | 2012-07-05 | Ricoh Co Ltd | 電界効果型トランジスタ及びその製造方法 |
| WO2015102110A1 (fr) * | 2014-01-06 | 2015-07-09 | コニカミノルタ株式会社 | Procédé de stratification de matériau fonctionnel, et corps stratifié de matériau fonctionnel |
| KR20190078913A (ko) * | 2017-12-27 | 2019-07-05 | (주)바이오필리아 | 산화물 박막 트랜지스터 제조 방법 및 이를 이용해서 제조되는 산화물 박막 트랜지스터 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09219525A (ja) * | 1996-02-09 | 1997-08-19 | Seiko Epson Corp | 液晶表示装置およびその製造方法 |
| JP2005191437A (ja) * | 2003-12-26 | 2005-07-14 | Ricoh Co Ltd | 半導体装置、その製造方法、および表示装置 |
| JP2006339265A (ja) * | 2005-05-31 | 2006-12-14 | Sony Corp | 電界効果型トランジスタ |
| JP2007043055A (ja) * | 2005-07-08 | 2007-02-15 | Sekisui Chem Co Ltd | 薄膜トランジスタ及びゲート絶縁膜 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007142021A (ja) * | 2005-11-16 | 2007-06-07 | Seiko Epson Corp | 順スタガ構造薄膜トランジスタの製造方法 |
-
2008
- 2008-09-25 WO PCT/JP2008/067257 patent/WO2009047981A1/fr not_active Ceased
- 2008-09-25 JP JP2009536965A patent/JP5454143B2/ja not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09219525A (ja) * | 1996-02-09 | 1997-08-19 | Seiko Epson Corp | 液晶表示装置およびその製造方法 |
| JP2005191437A (ja) * | 2003-12-26 | 2005-07-14 | Ricoh Co Ltd | 半導体装置、その製造方法、および表示装置 |
| JP2006339265A (ja) * | 2005-05-31 | 2006-12-14 | Sony Corp | 電界効果型トランジスタ |
| JP2007043055A (ja) * | 2005-07-08 | 2007-02-15 | Sekisui Chem Co Ltd | 薄膜トランジスタ及びゲート絶縁膜 |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2462157A (en) * | 2008-07-29 | 2010-02-03 | Korea Electronics Telecomm | Method of fabricating organic thin film transistor using surface energy control |
| GB2462157B (en) * | 2008-07-29 | 2011-05-18 | Korea Electronics Telecomm | Method of fabricating organic thin film transistor using surface energy control |
| US8058115B2 (en) | 2008-07-29 | 2011-11-15 | Electronics And Telecommunications Research Institute | Method of fabricating organic thin film transistor using surface energy control |
| JP2010263103A (ja) * | 2009-05-08 | 2010-11-18 | Konica Minolta Holdings Inc | 薄膜トランジスタ、及びその製造方法 |
| WO2012063474A1 (fr) * | 2010-11-10 | 2012-05-18 | パナソニック株式会社 | Dispositif de traitement par plasma et procédé de traitement par plasma |
| JP5271456B2 (ja) * | 2010-11-10 | 2013-08-21 | パナソニック株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP2012129396A (ja) * | 2010-12-16 | 2012-07-05 | Ricoh Co Ltd | 電界効果型トランジスタ及びその製造方法 |
| WO2015102110A1 (fr) * | 2014-01-06 | 2015-07-09 | コニカミノルタ株式会社 | Procédé de stratification de matériau fonctionnel, et corps stratifié de matériau fonctionnel |
| JPWO2015102110A1 (ja) * | 2014-01-06 | 2017-03-23 | コニカミノルタ株式会社 | 機能材料の積層方法及び機能材料積層体 |
| KR20190078913A (ko) * | 2017-12-27 | 2019-07-05 | (주)바이오필리아 | 산화물 박막 트랜지스터 제조 방법 및 이를 이용해서 제조되는 산화물 박막 트랜지스터 |
| KR102045027B1 (ko) | 2017-12-27 | 2019-11-21 | (주)바이오필리아 | 산화물 박막 트랜지스터 제조 방법 및 이를 이용해서 제조되는 산화물 박막 트랜지스터 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5454143B2 (ja) | 2014-03-26 |
| JPWO2009047981A1 (ja) | 2011-02-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2009044659A1 (fr) | Procédé de formation de motif | |
| TWI373142B (en) | Manufacturing method of thin film transistor using oxide semiconductor | |
| TW200743162A (en) | Method for fabricating a gate dielectric of a field effect transistor | |
| WO2008008753A3 (fr) | Procédé de formation d'une couche électrique utilisée dans une structure de grille | |
| WO2007130188A3 (fr) | Cellule solaire dotÉe de contacts à hÉtÉrojonction de semi-conducteurs dopÉs | |
| WO2008064246A3 (fr) | Procédé de traitement séquentiel groupé pour structure d'empilement de portes | |
| WO2008078516A1 (fr) | Appareil de fabrication d'un film fin d'oxyde de silicium et procédé de formation du film fin d'oxyde de silicium | |
| TW200618117A (en) | Thin film transistor and fabrication method thereof | |
| TW200729343A (en) | Method for fabricating controlled stress silicon nitride films | |
| WO2009075075A1 (fr) | Dispositif électroluminescent organique, panneau d'affichage électroluminescent, procédé de fabrication du dispositif électroluminescent organique et procédé de fabrication du panneau d'affichage électroluminescent | |
| WO2011059675A3 (fr) | Cuisson de pellicules cvd fluides non carbonées | |
| TW200605356A (en) | Method for fabricating a thin film transistor and related circuits | |
| WO2009047981A1 (fr) | Procédé de fabrication de transistor en couches minces | |
| WO2008042732A3 (fr) | Sti en retrait pour transistors larges | |
| WO2008081724A1 (fr) | Procédé de formation de film isolant et procédé de fabrication de dispositif à semi-condcteur | |
| WO2008105360A1 (fr) | Procédé de fabrication d'un dispositif semi-conducteur et appareil de fabrication d'un dispositif semi-conducteur | |
| WO2007130729A3 (fr) | Procédé de fabrication de dispositif à semiconducteur et structure de celui-ci | |
| WO2009006284A3 (fr) | Dé semi-conducteur doté d'une couche de redistribution | |
| WO2009028314A1 (fr) | Procédé de fabrication de dispositif à semi-conducteurs | |
| WO2007019277A3 (fr) | Procede de formation de couches semiconductrices sur des substrats de manipulation | |
| WO2010065457A3 (fr) | Procédé de formation d'un dispositif à semi-conducteurs pourvu d'une couche diélectrique et dispositif à semi-conducteurs obtenu | |
| TW200607094A (en) | Semiconductor device and method of manufacturing thereof | |
| WO2010088348A3 (fr) | Procédés de formation de couches d'oxyde conformes sur des dispositifs à semi-conducteurs | |
| WO2009022853A3 (fr) | Cellule solaire à film mince et son procédé de fabrication | |
| TW200745710A (en) | Organic transistor and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08838375 Country of ref document: EP Kind code of ref document: A1 |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2009536965 Country of ref document: JP |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 08838375 Country of ref document: EP Kind code of ref document: A1 |