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WO2009041389A1 - エポキシ樹脂組成物、その硬化物及び発光ダイオード - Google Patents

エポキシ樹脂組成物、その硬化物及び発光ダイオード Download PDF

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Publication number
WO2009041389A1
WO2009041389A1 PCT/JP2008/067103 JP2008067103W WO2009041389A1 WO 2009041389 A1 WO2009041389 A1 WO 2009041389A1 JP 2008067103 W JP2008067103 W JP 2008067103W WO 2009041389 A1 WO2009041389 A1 WO 2009041389A1
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WO
WIPO (PCT)
Prior art keywords
epoxy resin
composition
mass
cured object
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/067103
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English (en)
French (fr)
Inventor
Takashi Sato
Shuichi Ueno
Takeshi Koyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP2009534319A priority Critical patent/JP5663874B2/ja
Priority to EP08834277.9A priority patent/EP2194085B1/en
Priority to US12/678,166 priority patent/US9102786B2/en
Priority to KR1020107005545A priority patent/KR101530103B1/ko
Priority to CN200880108490XA priority patent/CN101809056B/zh
Publication of WO2009041389A1 publication Critical patent/WO2009041389A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　酸無水物（A）及びエポキシ樹脂（B）を含有するエポキシ樹脂組成物であって、（ａ）酸無水物（A）の５０～９０質量％がシクロヘキサン－１，２，４－トリカルボン酸－１、２－無水物であり、（ｂ）エポキシ樹脂（B）の３０～９０質量％が脂環式エポキシ樹脂化合物、１０～５０質量％が下記一般式（１）で表されるエポキシ樹脂化合物であり、（ｃ）酸無水物（A）及びエポキシ樹脂（B）の含有量が、酸無水物とエポキシ樹脂の配合当量比が０．４～０．７の範囲であるエポキシ樹脂組成物、その硬化物及び発光ダイオードを提供する。このエポキシ樹脂組成物は、（１）調合後の粘度が低く、室温放置における増粘倍率が低くて、作業性に優れており、（２）硬化促進剤を添加しなくても硬化性が良好であり、（３）硬化物が無色透明で、耐クラック性があり、長時間の光照射および加熱下での着色が少ない特性を有し、青色ＬＥＤ、白色ＬＥＤ等の光電変換素子の封止材料として好適である。（式中、Ｒは独立に水素原子又はメチル基であり、ｍは１～３、ｎは２～８の整数である。） 【化１】
PCT/JP2008/067103 2007-09-27 2008-09-22 エポキシ樹脂組成物、その硬化物及び発光ダイオード Ceased WO2009041389A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009534319A JP5663874B2 (ja) 2007-09-27 2008-09-22 エポキシ樹脂組成物、その硬化物及び発光ダイオード
EP08834277.9A EP2194085B1 (en) 2007-09-27 2008-09-22 Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
US12/678,166 US9102786B2 (en) 2007-09-27 2008-09-22 Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
KR1020107005545A KR101530103B1 (ko) 2007-09-27 2008-09-22 에폭시 수지 조성물, 그 경화물 및 발광 다이오드
CN200880108490XA CN101809056B (zh) 2007-09-27 2008-09-22 环氧树脂组合物和环氧树脂固化物以及发光二极管

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-251050 2007-09-27
JP2007251050 2007-09-27

Publications (1)

Publication Number Publication Date
WO2009041389A1 true WO2009041389A1 (ja) 2009-04-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067103 Ceased WO2009041389A1 (ja) 2007-09-27 2008-09-22 エポキシ樹脂組成物、その硬化物及び発光ダイオード

Country Status (7)

Country Link
US (1) US9102786B2 (ja)
EP (1) EP2194085B1 (ja)
JP (1) JP5663874B2 (ja)
KR (1) KR101530103B1 (ja)
CN (1) CN101809056B (ja)
TW (1) TWI433865B (ja)
WO (1) WO2009041389A1 (ja)

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CN101831143A (zh) * 2010-05-06 2010-09-15 宁波德洲精密电子有限公司 一种led封装用高性能液体环氧树脂组合物
WO2011019003A1 (ja) * 2009-08-10 2011-02-17 三菱瓦斯化学株式会社 表面保護層用熱硬化性樹脂組成物
JP2011094004A (ja) * 2009-10-29 2011-05-12 Shin Kobe Electric Mach Co Ltd エポキシ樹脂組成物並びにプリプレグ、積層板及び金属箔張り積層板
WO2014073621A1 (ja) * 2012-11-09 2014-05-15 三菱瓦斯化学株式会社 エポキシ樹脂組成物、その硬化物および発光ダイオード
JP2014141584A (ja) * 2013-01-24 2014-08-07 Toyama Prefecture 熱硬化性樹脂組成物
US9024455B2 (en) 2010-05-26 2015-05-05 Hitachi Chemical Company, Ltd. Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
JPWO2014103759A1 (ja) * 2012-12-28 2017-01-12 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及びフィルム

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CN101817969A (zh) * 2010-04-08 2010-09-01 长兴华强电子有限公司 节能灯用电容器浸渍料
JP2012036320A (ja) * 2010-08-10 2012-02-23 Daicel Corp 硬化性樹脂組成物及びその硬化物
CN102690621A (zh) * 2012-06-15 2012-09-26 江苏泰特尔化工有限公司 一种新型的纳米氧化锌掺杂脂环族环氧树脂led封装胶
CN102719213A (zh) * 2012-07-06 2012-10-10 江苏泰特尔化工有限公司 一种改性纳米氧化锌掺杂脂环族环氧树脂led封装胶
WO2014072216A1 (de) * 2012-11-08 2014-05-15 Basf Se Diglycidylether von 2-phenyl-1,3-propandiol-derivaten und deren oligomere als härtbare epoxidharze
CN104072946B (zh) * 2013-03-28 2017-03-22 太阳油墨（苏州）有限公司 热固性树脂组合物及填充有该树脂组合物的印刷电路板
US9464224B2 (en) * 2013-12-18 2016-10-11 Rohm And Haas Electronic Materials Llc Transformative wavelength conversion medium
KR101731495B1 (ko) * 2015-01-08 2017-04-28 한국과학기술연구원 폴리오르가노―실세스퀴옥산 및 파장변환제를 포함하는 코팅 조성물, 및 이를 이용한 파장변환 시트
EP3476877A4 (en) * 2016-06-24 2020-01-01 Toray Industries, Inc. TWO-COMPONENT EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL
EP4155335A4 (en) * 2020-05-21 2024-05-22 Daicel Corporation CURABLE EPOXY COMPOSITION FOR ELECTRIC LATHE
KR102448613B1 (ko) * 2020-11-23 2022-09-28 솔루스첨단소재 주식회사 수지 조성물

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Cited By (15)

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Publication number Priority date Publication date Assignee Title
US9129898B2 (en) 2007-10-22 2015-09-08 Hitachi Chemical Company, Ltd. Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
US9028911B2 (en) 2009-08-10 2015-05-12 Mitsubishi Gas Chemical Company, Inc. Thermosetting resin composition for surface protection layers
WO2011019003A1 (ja) * 2009-08-10 2011-02-17 三菱瓦斯化学株式会社 表面保護層用熱硬化性樹脂組成物
CN102471463A (zh) * 2009-08-10 2012-05-23 三菱瓦斯化学株式会社 表面保护层用热固性树脂组合物
JP2011094004A (ja) * 2009-10-29 2011-05-12 Shin Kobe Electric Mach Co Ltd エポキシ樹脂組成物並びにプリプレグ、積層板及び金属箔張り積層板
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TW200922961A (en) 2009-06-01
EP2194085A1 (en) 2010-06-09
EP2194085B1 (en) 2018-01-03
CN101809056A (zh) 2010-08-18
EP2194085A4 (en) 2012-02-22
CN101809056B (zh) 2013-06-05
TWI433865B (zh) 2014-04-11
JPWO2009041389A1 (ja) 2011-01-27
US20100193831A1 (en) 2010-08-05

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