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WO2008139995A1 - 導電体の接続方法、導電体接続用部材、接続構造及び太陽電池モジュール - Google Patents

導電体の接続方法、導電体接続用部材、接続構造及び太陽電池モジュール Download PDF

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Publication number
WO2008139995A1
WO2008139995A1 PCT/JP2008/058488 JP2008058488W WO2008139995A1 WO 2008139995 A1 WO2008139995 A1 WO 2008139995A1 JP 2008058488 W JP2008058488 W JP 2008058488W WO 2008139995 A1 WO2008139995 A1 WO 2008139995A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductor
connecting conductor
solar cell
cell module
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/058488
Other languages
English (en)
French (fr)
Inventor
Naoki Fukushima
Isao Tsukagoshi
Takehiro Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to KR1020117012768A priority Critical patent/KR101248636B1/ko
Priority to CN200880013878.1A priority patent/CN101669258B/zh
Priority to JP2009514130A priority patent/JP4894920B2/ja
Priority to EP08752380A priority patent/EP2146404A1/en
Publication of WO2008139995A1 publication Critical patent/WO2008139995A1/ja
Priority to US12/615,244 priority patent/US10032952B2/en
Anticipated expiration legal-status Critical
Priority to US13/835,018 priority patent/US9660131B2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00—Individual photovoltaic cells, e.g. solar cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/906—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the materials of the structures
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Photovoltaic Devices (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

本発明の導電体の接続方法は、互いに離れている第１の導電体と第２の導電体とを電気的に接続する方法であって、金属箔、該金属箔の一方の面に設けられた第１の接着剤層、及び第１の導電体を、この順に配した状態で加熱加圧して、金属箔と第１の導電体とを電気的に接続するとともに接着し、金属箔、第１の接着剤層若しくは金属箔の他方の面に設けられた第２の接着剤層、及び第２の導電体を、この順に配した状態で加熱加圧して、金属箔と第２の導電体とを電気的に接続するとともに接着する工程を備える。
PCT/JP2008/058488 2007-05-09 2008-05-07 導電体の接続方法、導電体接続用部材、接続構造及び太陽電池モジュール Ceased WO2008139995A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020117012768A KR101248636B1 (ko) 2007-05-09 2008-05-07 도전체의 접속 방법, 도전체 접속용 부재, 접속 구조 및 태양 전지 모듈
CN200880013878.1A CN101669258B (zh) 2007-05-09 2008-05-07 导电体的连接方法、导电体连接用部件、连接结构及太阳能电池模块
JP2009514130A JP4894920B2 (ja) 2007-05-09 2008-05-07 導電体の接続方法、導電体接続用部材、接続構造及び太陽電池モジュール
EP08752380A EP2146404A1 (en) 2007-05-09 2008-05-07 Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module
US12/615,244 US10032952B2 (en) 2007-05-09 2009-11-09 Connecting structure and solar cell module
US13/835,018 US9660131B2 (en) 2007-05-09 2013-03-15 Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007124438 2007-05-09
JP2007-124438 2007-05-09
JP2007-241230 2007-09-18
JP2007241230 2007-09-18

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/615,244 Continuation US10032952B2 (en) 2007-05-09 2009-11-09 Connecting structure and solar cell module

Publications (1)

Publication Number Publication Date
WO2008139995A1 true WO2008139995A1 (ja) 2008-11-20

Family

ID=40002195

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058488 Ceased WO2008139995A1 (ja) 2007-05-09 2008-05-07 導電体の接続方法、導電体接続用部材、接続構造及び太陽電池モジュール

Country Status (7)

Country Link
US (2) US10032952B2 (ja)
EP (1) EP2146404A1 (ja)
JP (2) JP4894920B2 (ja)
KR (2) KR101081706B1 (ja)
CN (2) CN105826418B (ja)
TW (1) TWI449186B (ja)
WO (1) WO2008139995A1 (ja)

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US20110017261A1 (en) * 2008-02-21 2011-01-27 Sanyo Electric Co., Ltd. Solar cell module
JP2011151246A (ja) * 2010-01-22 2011-08-04 Hitachi Chem Co Ltd 太陽電池モジュールの製造方法
WO2012165348A1 (ja) * 2011-05-27 2012-12-06 新日鐵住金株式会社 太陽電池用インターコネクタ及び太陽電池モジュール
WO2014041650A1 (ja) * 2012-09-13 2014-03-20 三洋電機株式会社 太陽電池モジュール
JP2015226899A (ja) * 2014-05-09 2015-12-17 積水化学工業株式会社 マイクロカプセル及び熱硬化性接着剤組成物
US9390829B2 (en) 2010-01-25 2016-07-12 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
JP6073681B2 (ja) * 2010-10-21 2017-02-01 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子
JP2017163161A (ja) * 2017-06-07 2017-09-14 日立化成株式会社 太陽電池及び太陽電池モジュール
WO2022030634A1 (ja) * 2020-08-07 2022-02-10 昭和電工マテリアルズ株式会社 配線形成用部材、配線形成用部材を用いた配線層の形成方法、及び、配線形成部材
JPWO2022030635A1 (ja) * 2020-08-07 2022-02-10
TWI898012B (zh) 2020-08-07 2025-09-21 日商力森諾科股份有限公司 配線形成用構件、使用了配線形成用構件之配線層之形成方法及配線形成構件

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JP2015018814A (ja) * 2010-01-25 2015-01-29 日立化成株式会社 電極用ペースト組成物及び太陽電池
JPWO2011093321A1 (ja) * 2010-01-26 2013-06-06 三洋電機株式会社 太陽電池モジュール及びその製造方法
WO2011152319A1 (ja) * 2010-05-31 2011-12-08 三洋電機株式会社 太陽電池モジュール及び太陽電池モジュールの製造方法
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JP5558940B2 (ja) * 2010-06-30 2014-07-23 三洋電機株式会社 太陽電池モジュール及びその製造方法
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KR101694553B1 (ko) * 2011-01-05 2017-01-09 엘지전자 주식회사 태양 전지 모듈
KR20140041865A (ko) * 2011-07-19 2014-04-04 히타치가세이가부시끼가이샤 n 형 확산층 형성 조성물, n 형 확산층의 제조 방법, 및 태양 전지 소자의 제조 방법
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BR112014013918A8 (pt) 2011-12-07 2017-06-13 Nuvosun Inc método para formar um módulo fotovoltaico, método para formar células fotovoltaicas e célula fotovoltaica
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US9818903B2 (en) * 2014-04-30 2017-11-14 Sunpower Corporation Bonds for solar cell metallization
WO2016051631A1 (ja) * 2014-09-29 2016-04-07 パナソニックＩｐマネジメント株式会社 太陽電池モジュール
KR101603318B1 (ko) * 2014-11-13 2016-03-14 남광현 기능성 필름, 이를 포함하는 연성회로기판, 및 기판에 대한 기능성 필름 접지 방법
US11581446B2 (en) * 2015-10-08 2023-02-14 The Boeing Company Semiconductor device including an electrically conductive adhesive layer and a bypass diode in a carrier
EP3392916A1 (de) * 2017-04-19 2018-10-24 Heraeus Deutschland GmbH & Co. KG Alterungsresistente aluminiumverbinder für solarzellen
KR102120662B1 (ko) * 2018-06-08 2020-06-11 대산전자(주) 버스바용 클래드와 버스바용 클래드 제조 방법
US11850839B2 (en) * 2018-08-08 2023-12-26 Autonetworks Technologies, Ltd. Fixing structure of wiring member
JPWO2022138619A1 (ja) * 2020-12-21 2022-06-30
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CN115732580A (zh) * 2022-12-12 2023-03-03 浙江晶科能源有限公司 光伏组件
US20240322262A1 (en) * 2023-03-26 2024-09-26 Samsung Sdi Co., Ltd. Battery pack
CN117238997B (zh) * 2023-11-10 2024-04-09 天合光能股份有限公司 导电连接件和电池片组件

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