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WO2008139643A1 - 露光方法および露光装置 - Google Patents

露光方法および露光装置 Download PDF

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Publication number
WO2008139643A1
WO2008139643A1 PCT/JP2007/065712 JP2007065712W WO2008139643A1 WO 2008139643 A1 WO2008139643 A1 WO 2008139643A1 JP 2007065712 W JP2007065712 W JP 2007065712W WO 2008139643 A1 WO2008139643 A1 WO 2008139643A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
pattern
photomask
supporting member
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/065712
Other languages
English (en)
French (fr)
Inventor
Ken Miyake
Toshihiro Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanei Giken Co Ltd
Original Assignee
Sanei Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanei Giken Co Ltd filed Critical Sanei Giken Co Ltd
Priority to KR1020097025058A priority Critical patent/KR101118854B1/ko
Priority to JP2007555408A priority patent/JP4176819B1/ja
Priority to CN2007800529259A priority patent/CN101663619B/zh
Publication of WO2008139643A1 publication Critical patent/WO2008139643A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

　基板（１）を、四角い基板支持部材（１１）の主面に固定支持させる。パターンが描かれたフォトマスク（２）を、基板（１）の感光層を覆う位置に配置する。フォトマスク（２）を通して基板（１）の感光層に光を照射することによりパターンを基板に転写する。露光の際、フォトマスク（２）と基板（１）とが互いに均一に接触しており、且つ、基板支持部材（１１）および基板（１）が所望の湾曲形状に変形された状態とされている。基板支持部材（１１）は、互いに対向する第一の対の側縁部と同じ方向に延びる第一の軸、又は、互いに対向する第二の対の側縁部と同じ方向に延びる第二の軸を中心として、個別に湾曲量を制御されながら、基板（１）と共に湾曲される。これにより、パターンの寸法は実質的に変化されて基板（１）に転写される。
PCT/JP2007/065712 2007-05-10 2007-08-10 露光方法および露光装置 Ceased WO2008139643A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097025058A KR101118854B1 (ko) 2007-05-10 2007-08-10 노광방법 및 노광장치
JP2007555408A JP4176819B1 (ja) 2007-05-10 2007-08-10 露光方法および露光装置
CN2007800529259A CN101663619B (zh) 2007-05-10 2007-08-10 曝光方法及曝光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007125805 2007-05-10
JP2007-125805 2007-05-10

Publications (1)

Publication Number Publication Date
WO2008139643A1 true WO2008139643A1 (ja) 2008-11-20

Family

ID=40001872

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/065712 Ceased WO2008139643A1 (ja) 2007-05-10 2007-08-10 露光方法および露光装置

Country Status (5)

Country Link
JP (1) JP4176819B1 (ja)
KR (1) KR101118854B1 (ja)
CN (1) CN101663619B (ja)
TW (1) TWI430048B (ja)
WO (1) WO2008139643A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011102834A (ja) * 2009-11-10 2011-05-26 Toppan Printing Co Ltd 基板露光装置
US8883380B2 (en) 2010-11-10 2014-11-11 V Technology Co., Ltd. Film exposure method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101260221B1 (ko) * 2011-12-01 2013-05-06 주식회사 엘지화학 마스크
KR20140080772A (ko) * 2012-12-18 2014-07-01 주식회사 원익아이피에스 얼라인 장치 및 이를 이용한 얼라인 방법
CN103616803B (zh) * 2013-11-25 2015-09-09 中国科学院长春光学精密机械与物理研究所 光栅尺真空复制曝光设备
CN104749894B (zh) * 2013-12-30 2017-08-29 上海微电子装备有限公司 一种改善掩模垂向重力弯曲的掩模台
JP6308877B2 (ja) * 2014-06-06 2018-04-11 キヤノントッキ株式会社 成膜装置
JP6399093B2 (ja) * 2014-08-01 2018-10-03 株式会社村田製作所 直描型露光装置
KR102357577B1 (ko) * 2014-08-28 2022-01-28 가부시키가이샤 오크세이사쿠쇼 투영 노광 장치, 투영 노광 방법, 투영 노광 장치용 포토마스크, 및 기판의 제조 방법
CN108467008B (zh) * 2018-03-12 2020-10-23 中国科学院光电技术研究所 一种柔性薄膜基底上微纳米结构的高精度制备方法
DE102020204941A1 (de) * 2020-04-20 2020-10-29 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren und Vorrichtung zum Herstellen eines mit einer aushärtbaren Vergussmasse versehenen Substrats
WO2022083111A1 (zh) * 2020-10-19 2022-04-28 北京航空航天大学杭州创新研究院 高密度图案化加工的衬底-掩模板原位保持装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211231A (ja) * 1985-06-25 1987-01-20 Hitachi Electronics Eng Co Ltd ウエハとマスクとの密着方法
JPH0272362A (ja) * 1988-09-07 1990-03-12 Hitachi Ltd 拡大投影露光方法及びその装置
JPH07115055A (ja) * 1993-10-15 1995-05-02 Dainippon Screen Mfg Co Ltd 基板露光装置
JPH07245259A (ja) * 1994-03-03 1995-09-19 Topcon Corp 露光装置
JPH11312635A (ja) * 1998-04-28 1999-11-09 Ushio Inc コンタクト露光方法
JP2002091010A (ja) * 2000-09-13 2002-03-27 Dainippon Printing Co Ltd 密着露光装置
JP2002367895A (ja) * 2001-06-11 2002-12-20 Fuji Photo Film Co Ltd フォトレジストの露光方法および装置並びに基板
WO2006137396A1 (ja) * 2005-06-21 2006-12-28 Sanei Giken Co., Ltd. 露光方法および露光装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010075605A (ko) * 1998-11-06 2001-08-09 오노 시게오 노광방법 및 노광장치

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211231A (ja) * 1985-06-25 1987-01-20 Hitachi Electronics Eng Co Ltd ウエハとマスクとの密着方法
JPH0272362A (ja) * 1988-09-07 1990-03-12 Hitachi Ltd 拡大投影露光方法及びその装置
JPH07115055A (ja) * 1993-10-15 1995-05-02 Dainippon Screen Mfg Co Ltd 基板露光装置
JPH07245259A (ja) * 1994-03-03 1995-09-19 Topcon Corp 露光装置
JPH11312635A (ja) * 1998-04-28 1999-11-09 Ushio Inc コンタクト露光方法
JP2002091010A (ja) * 2000-09-13 2002-03-27 Dainippon Printing Co Ltd 密着露光装置
JP2002367895A (ja) * 2001-06-11 2002-12-20 Fuji Photo Film Co Ltd フォトレジストの露光方法および装置並びに基板
WO2006137396A1 (ja) * 2005-06-21 2006-12-28 Sanei Giken Co., Ltd. 露光方法および露光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011102834A (ja) * 2009-11-10 2011-05-26 Toppan Printing Co Ltd 基板露光装置
US8883380B2 (en) 2010-11-10 2014-11-11 V Technology Co., Ltd. Film exposure method

Also Published As

Publication number Publication date
KR20100025520A (ko) 2010-03-09
CN101663619A (zh) 2010-03-03
CN101663619B (zh) 2012-03-07
TW200912551A (en) 2009-03-16
JP4176819B1 (ja) 2008-11-05
KR101118854B1 (ko) 2012-03-22
JPWO2008139643A1 (ja) 2010-07-29
TWI430048B (zh) 2014-03-11

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