[go: up one dir, main page]

WO2008139498A1 - A method of testing electronic circuits and related circuit - Google Patents

A method of testing electronic circuits and related circuit Download PDF

Info

Publication number
WO2008139498A1
WO2008139498A1 PCT/IT2007/000341 IT2007000341W WO2008139498A1 WO 2008139498 A1 WO2008139498 A1 WO 2008139498A1 IT 2007000341 W IT2007000341 W IT 2007000341W WO 2008139498 A1 WO2008139498 A1 WO 2008139498A1
Authority
WO
WIPO (PCT)
Prior art keywords
pul
test
electronic circuit
signals
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IT2007/000341
Other languages
French (fr)
Inventor
Antonio Callegaro
Andreas Huber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Osram SpA
Original Assignee
Osram GmbH
Osram SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH, Osram SpA filed Critical Osram GmbH
Priority to PCT/IT2007/000341 priority Critical patent/WO2008139498A1/en
Publication of WO2008139498A1 publication Critical patent/WO2008139498A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/3187Built-in tests
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2884Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test

Definitions

  • the invention relates to techniques for testing electronic circuits.
  • a conventional approach is to employ processing units such as microcontrollers programmed to generate "stimulation" signals that are applied to the ' circuit under test.
  • the results of stimulation namely the signals generated by the circuit under test as a result of the stimulation signals applied to it) are collected and processed with a view to check correct operation thereof.
  • FIG. 1 annexed herewith is generally representative of such an arrangement where a processing unit PU (such as a microcontroller) is used together with test equipment TE for testing an electronic circuit (generally designated EC) such as a printed circuit board having various components mounted thereon.
  • the processing unit PU hereinafter a microcontroller will be mostly referred to for the sake of simplicity
  • the circuit EC via a (generally huge) quantity of connecting wires/lines W in order to apply the stimulation signals and collect the resulting signals, which are then processed by the test equipment TE.
  • test process is devised as a compromise between the time required to perform it and the expected performance of the test process, namely the completeness and reliability of the results of the test technique. It will thus be appreciated that setting up an arrangement as shown in figure 1 may be time consuming, with the additional risk that some of the connections W- may turn out to be faulty or erroneous .
  • the object of the invention is to provide such a solution.
  • the solution described herein can be applied to any electronic circuit including at least one processing unit.
  • Exemplary of such circuits are electronic boards with embedded microcontrollers.
  • test time consumption is reduced, while at the same time improving reliability and performance quality by using one or more processing units (typically microcontrollers) available in the circuit under test to perform a complete or partial self-test procedure.
  • processing units typically microcontrollers
  • proper firmware is provided in the "on-board" microcontroller or microcontrollers in order to apply stimulation signals to the circuit and detect the results produced deriving from such stimulation signals being applied.
  • the "onboard" microcontroller (s ) is/are able to compare these results (in some instances, external hardware may be required in order to properly close the loop from outputs to inputs) with the test limits stored in the memory. Consequently, the test equipment has just to check the results of the test provided by the board under test to yield the final test outcome.
  • the functionalities of the onboard microcontroller (s) can be extended to processing the signals resulting from the stimulation applied up to the point of providing a test outcome proper.
  • - figure 2 is a block diagram of an exemplary embodiment of the arrangement described herein, and - figure 3 shows an alternative embodiment of the arrangement described herein.
  • the circuit in question may be any kind of circuit, save for the fact that in the case of figures 2 and 3, the electronic circuit EC includes mounted thereon (typically embedded therein) one or a plurality of processing units PUl, PU2, and so on in the form of e.g. microcontrollers.
  • the microcontroller PUl operates under the control of test equipment TE and includes firmware adapted to implement any test procedure for the circuit EC generally including the steps of applying to the elements in the circuit EC "stimulation" signals and collecting the resulting signals (possibly including "non signals" - i.e. signals missing due to a fault) from the circuit elements due to the stimulation signals being applied. These resulting signals are then processed to derive therefrom a test outcome.
  • test procedure in question may be of any type known in the art and does not constitute - per se - the subject matter of this application.
  • the microcontroller PUl includes firmware configured to implement connecting lines Wl, W2, W3... to the various elements in the circuit EC under test so that the stimulation signals can be delivered to these elements and the signals resulting from such stimulation collected therefrom.
  • external hardware may be required in order to properly close the loop from outputs to inputs.
  • test equipment TE the specific criteria for partitioning processing functions between the test equipment TE and the microcontroller PUl are dictated by the specific test procedure implemented.
  • a significant point in the embodiment of figure 2 lies in that, contrary to the wiring/connections W of figure 1 (which are positively established for performing the test procedure, with the disadvantages already outlined in the foregoing) , the wiring/connections Wl, W2, W3 may be in the form of wiring already provided in the circuit EC (e.g. when the PCB board is manufactured) and do not need to be provided just for testing to be subsequently dispensed with once the testing is completed.
  • wiring Wl, W2, W3 may be simply comprised of wiring already existing in the electronic circuit EC for functional purposes and which is temporarily used for test purposes.
  • the alternative arrangement of figure 3 refers to a situation where the electronic circuit under test, again designated EC, includes at least two processing units such as two microcontrollers PUl, PU2, e.g. in the form of microcontrollers embedded in the circuit EC.
  • Both microcontrollers PUl, PU2 include respective firmware configured to implement various connecting lines Wl, W2, W3... and Wl', W2' , W3'... to elements in the circuit EC Under these circumstances, the on-board testing procedure may be configured in such a way that the two microcontrollers PUl, PU2 cross-test each other e.g. via (common) lines included in the sets designated W2 and W2' .
  • one of the microcontrollers - for instance the microcontroller PUl - is subjected to a pre-test procedure performed by the other microcontroller PU2
  • the self-test method described herein provides a number of significant advantages. In the first place, it allows functional, dynamic testing of electronic circuits EC by reducing to a minimum, and virtually dispensing with, the need of external equipment.
  • the circuit test time is reduced since complex components can be reliably tested directly via the self-test procedure.
  • test results can be provided to the test system in different ways (output frequency of voltage, COM port, and so on) , which significantly reduces the complexity/cost of the system.
  • test results can be stored in the memory of the processing unit to allow off-line faulty part analysis and traceability.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

Testing an electronic circuit (EC) includes the steps of applying to the electronic circuit (EC) stimulation signals, and collecting from the electronic circuit (EC) test signals resulting from the application of the stimulation signals. At least one processing unit (PUl) such as a microcontroller is included in the electronic circuit (EC) - i.e. by embedding it into the circuit - in order to apply the stimulation signals and collect the resulting signals, and possibly process them to yield a test outcome.

Description

"A method of testing electronic circuits and related circuit"
* * * Field of the invention
The invention relates to techniques for testing electronic circuits.
Description of the related art
Automated testing of electronic circuits, e.g. electronic circuits mounted on a board, is usually performed by resorting to a mix of different test capabilities, namely:
- optical inspection,
- in-circuit parametric or functional testing, and
- functional (i.e. operational) testing with real and simulated loads. In this context, a conventional approach is to employ processing units such as microcontrollers programmed to generate "stimulation" signals that are applied to the' circuit under test. The results of stimulation (namely the signals generated by the circuit under test as a result of the stimulation signals applied to it) are collected and processed with a view to check correct operation thereof.
Figure 1 annexed herewith is generally representative of such an arrangement where a processing unit PU (such as a microcontroller) is used together with test equipment TE for testing an electronic circuit (generally designated EC) such as a printed circuit board having various components mounted thereon. To that end, the processing unit PU (hereinafter a microcontroller will be mostly referred to for the sake of simplicity) is connected to the circuit EC via a (generally huge) quantity of connecting wires/lines W in order to apply the stimulation signals and collect the resulting signals, which are then processed by the test equipment TE.
In general terms, the test process is devised as a compromise between the time required to perform it and the expected performance of the test process, namely the completeness and reliability of the results of the test technique. It will thus be appreciated that setting up an arrangement as shown in figure 1 may be time consuming, with the additional risk that some of the connections W- may turn out to be faulty or erroneous .
Object and summary of the invention
In view of the foregoing, the need exists for solutions that may simplify the test procedures as described in the foregoing, especially as regards reducing the time involved in performing the test, while maintaining (and possibly improving) the quality of testing in terms of reliability and general performance . The object of the invention is to provide such a solution.
According to the present invention, that object is achieved by means of a method having the features set forth in the claims that follow. The invention also relates to a corresponding circuit.
The claims are an integral part of the disclosure of the invention provided herein.
The solution described herein can be applied to any electronic circuit including at least one processing unit. Exemplary of such circuits are electronic boards with embedded microcontrollers.
In a preferred embodiment of the arrangement described herein, test time consumption is reduced, while at the same time improving reliability and performance quality by using one or more processing units (typically microcontrollers) available in the circuit under test to perform a complete or partial self-test procedure. In an embodiment, proper firmware is provided in the "on-board" microcontroller or microcontrollers in order to apply stimulation signals to the circuit and detect the results produced deriving from such stimulation signals being applied. The "onboard" microcontroller (s ) is/are able to compare these results (in some instances, external hardware may be required in order to properly close the loop from outputs to inputs) with the test limits stored in the memory. Consequently, the test equipment has just to check the results of the test provided by the board under test to yield the final test outcome. In certain embodiments, however, the functionalities of the onboard microcontroller (s) can be extended to processing the signals resulting from the stimulation applied up to the point of providing a test outcome proper.
Brief description of the annexed drawings
The invention will now be described, by way of example only, with reference to the enclosed figures of drawing, wherein: figure 1 has been already described in the foregoing,
- figure 2 is a block diagram of an exemplary embodiment of the arrangement described herein, and - figure 3 shows an alternative embodiment of the arrangement described herein.
Detailed description of preferred embodiments
In figures 2 and 3 (as in figure 1) the designation EC indicates an electronic circuit under test .
The circuit in question may be any kind of circuit, save for the fact that in the case of figures 2 and 3, the electronic circuit EC includes mounted thereon (typically embedded therein) one or a plurality of processing units PUl, PU2, and so on in the form of e.g. microcontrollers. In the embodiment of figure 2, the microcontroller PUl operates under the control of test equipment TE and includes firmware adapted to implement any test procedure for the circuit EC generally including the steps of applying to the elements in the circuit EC "stimulation" signals and collecting the resulting signals (possibly including "non signals" - i.e. signals missing due to a fault) from the circuit elements due to the stimulation signals being applied. These resulting signals are then processed to derive therefrom a test outcome.
The test procedure in question may be of any type known in the art and does not constitute - per se - the subject matter of this application.
This also applies the possible partitioning of the related functions between the microcontroller PUl and the test equipment TE.
In a presently preferred embodiment, the microcontroller PUl includes firmware configured to implement connecting lines Wl, W2, W3... to the various elements in the circuit EC under test so that the stimulation signals can be delivered to these elements and the signals resulting from such stimulation collected therefrom.
As indicated, in some instances, external hardware (not shown) may be required in order to properly close the loop from outputs to inputs.
Also, the specific criteria for partitioning processing functions between the test equipment TE and the microcontroller PUl are dictated by the specific test procedure implemented.
A significant point in the embodiment of figure 2 lies in that, contrary to the wiring/connections W of figure 1 (which are positively established for performing the test procedure, with the disadvantages already outlined in the foregoing) , the wiring/connections Wl, W2, W3 may be in the form of wiring already provided in the circuit EC (e.g. when the PCB board is manufactured) and do not need to be provided just for testing to be subsequently dispensed with once the testing is completed.
Also, at least part of the wiring Wl, W2, W3 may be simply comprised of wiring already existing in the electronic circuit EC for functional purposes and which is temporarily used for test purposes. The alternative arrangement of figure 3 refers to a situation where the electronic circuit under test, again designated EC, includes at least two processing units such as two microcontrollers PUl, PU2, e.g. in the form of microcontrollers embedded in the circuit EC.
Both microcontrollers PUl, PU2 include respective firmware configured to implement various connecting lines Wl, W2, W3... and Wl', W2' , W3'... to elements in the circuit EC Under these circumstances, the on-board testing procedure may be configured in such a way that the two microcontrollers PUl, PU2 cross-test each other e.g. via (common) lines included in the sets designated W2 and W2' .
For instance, after, or preferably before, being used for testing the other elements in the circuit EC one of the microcontrollers - for instance the microcontroller PUl - is subjected to a pre-test procedure performed by the other microcontroller PU2
(which is in turn tested by means of the microcontroller PUl) .
The self-test method described herein provides a number of significant advantages. In the first place, it allows functional, dynamic testing of electronic circuits EC by reducing to a minimum, and virtually dispensing with, the need of external equipment.
The circuit test time is reduced since complex components can be reliably tested directly via the self-test procedure.
Additionally, the test results can be provided to the test system in different ways (output frequency of voltage, COM port, and so on) , which significantly reduces the complexity/cost of the system.
Finally, the test results can be stored in the memory of the processing unit to allow off-line faulty part analysis and traceability.
Of course, without prejudice to the underlying principle of the invention, the details and embodiments may vary, even significantly, with respect to what has been described by way of example only, without departing from the scope of the invention as defined in the annexed claims.

Claims

1. A method of testing an electronic circuit (EC) including the steps of: - applying to said electronic circuit (EC) stimulation signals, and collecting from said electronic circuit (EC) test signals resulting from the application of said stimulation signals, characterized in that the method includes:
- including in said electronic circuit (EC) at least one processing unit (PUl), and
- performing said steps of applying said stimulation signals and collecting said resulting signals by utilizing said at least one processing unit (PUl, PU2) included in said electronic circuit (EC).
2. The method of claim 1, further including the step of processing said resulting signals to derive therefrom a test outcome by utilizing, for at least part of said processing, said at least one processing unit (PUl, PU2) included in said electronic circuit (EC) .
3. The method of either of claims 1 or 2, including the step of selecting a microcontroller as said at least one processing unit (PUl, PU2).
4. The method of any of the previous claims, wherein said at least one processing unit (PUl, PU2) is embedded in said electronic circuit (EC) .
5. The method of any of the previous claims, including the step of providing at least two said processing units (PUl, PU2) in said electronic circuit (EC) and causing one (PU2 resp. PUl) of the said two processing units to apply stimulation signals to the other (PUl resp. PU2) of said at least two processing units and collecting therefrom the test signals deriving from said stimulation signals being applied.
6. An electronic circuit (EC) including at least one processing unit (PUl, PU2) configured for performing the method of any of claims 1 to 5.
PCT/IT2007/000341 2007-05-10 2007-05-10 A method of testing electronic circuits and related circuit Ceased WO2008139498A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/IT2007/000341 WO2008139498A1 (en) 2007-05-10 2007-05-10 A method of testing electronic circuits and related circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IT2007/000341 WO2008139498A1 (en) 2007-05-10 2007-05-10 A method of testing electronic circuits and related circuit

Publications (1)

Publication Number Publication Date
WO2008139498A1 true WO2008139498A1 (en) 2008-11-20

Family

ID=38962011

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IT2007/000341 Ceased WO2008139498A1 (en) 2007-05-10 2007-05-10 A method of testing electronic circuits and related circuit

Country Status (1)

Country Link
WO (1) WO2008139498A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030149948A1 (en) * 2002-02-01 2003-08-07 Jiing Lin Circuit configuration of a chip with a graphic controller integrated and method for testing the same
US6625688B1 (en) * 1999-05-10 2003-09-23 Delphi Technologies, Inc. Method and circuit for analysis of the operation of a microcontroller using signature analysis of memory
US6681359B1 (en) * 2000-08-07 2004-01-20 Cypress Semiconductor Corp. Semiconductor memory self-test controllable at board level using standard interface

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6625688B1 (en) * 1999-05-10 2003-09-23 Delphi Technologies, Inc. Method and circuit for analysis of the operation of a microcontroller using signature analysis of memory
US6681359B1 (en) * 2000-08-07 2004-01-20 Cypress Semiconductor Corp. Semiconductor memory self-test controllable at board level using standard interface
US20030149948A1 (en) * 2002-02-01 2003-08-07 Jiing Lin Circuit configuration of a chip with a graphic controller integrated and method for testing the same

Similar Documents

Publication Publication Date Title
DE60100754T2 (en) SYSTEM AND METHOD FOR TESTING SIGNAL CONNECTIONS USING A BUILT-IN SELF-TEST FUNCTION
US11442095B2 (en) Cable harness test system and test method for checking cable harnesses
CN102901621B (en) Method and apparatus for testing solenoid valve
JP5443921B2 (en) Automatic test equipment self-test
JP2009204329A (en) Circuit board inspecting system and inspection method
KR20070074558A (en) Low cost testing of integrated circuits or electrical modules using standard reconfigurable logic devices
JP2020507764A (en) Functional tester for printed circuit boards, related systems and methods
CN108804261A (en) The test method and device of connector
US20200225279A1 (en) Smart decision feedback device and method for inspecting circuit board
RU2504828C1 (en) System of automatic operability control and fault diagnostics of electronics
US20100171510A1 (en) Testing apparatus and testing method
RU2488872C1 (en) Method for automatic performance monitoring and diagnosing faults in communication electronic equipment
EP4097042B1 (en) Method and devices for acoustically testing mems components
US8093921B2 (en) Monitoring of interconnect reliability using a programmable device
US20030079165A1 (en) Effective use of parallel scan for identically instantiated sequential blocks
JP3200565B2 (en) Microprocessor and inspection method thereof
WO2008139498A1 (en) A method of testing electronic circuits and related circuit
KR101336345B1 (en) A device for controlling event signal of module unit test in the semiconductor test systems
MX2007005251A (en) Parallel programming of flash memory during in-circuit test.
CN114325547B (en) Detection device and method for ATE (automatic test equipment) test channel
CN113687219B (en) Online detection method of test board
CN108051619A (en) A kind of TR components ripple control circuit fast quantification test verification system and method
US9341668B1 (en) Integrated circuit package testing
JP2011022104A (en) Method and device for inspecting opening/short-circuit of external terminal in integrated circuit
CN112462246A (en) Boundary scan test system and method thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07736844

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07736844

Country of ref document: EP

Kind code of ref document: A1