[go: up one dir, main page]

WO2008133130A1 - Highly dielectric elastomer molded body and electronic component material for high frequency use - Google Patents

Highly dielectric elastomer molded body and electronic component material for high frequency use Download PDF

Info

Publication number
WO2008133130A1
WO2008133130A1 PCT/JP2008/057396 JP2008057396W WO2008133130A1 WO 2008133130 A1 WO2008133130 A1 WO 2008133130A1 JP 2008057396 W JP2008057396 W JP 2008057396W WO 2008133130 A1 WO2008133130 A1 WO 2008133130A1
Authority
WO
WIPO (PCT)
Prior art keywords
molded body
dielectric elastomer
elastomer molded
electronic component
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057396
Other languages
French (fr)
Japanese (ja)
Inventor
Kouya Oohira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTN Corp
Original Assignee
NTN Corp
NTN Toyo Bearing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007309122A external-priority patent/JP5362205B2/en
Application filed by NTN Corp, NTN Toyo Bearing Co Ltd filed Critical NTN Corp
Priority to CN2008800135020A priority Critical patent/CN101679689B/en
Priority to DE112008001026T priority patent/DE112008001026T5/en
Priority to US12/450,670 priority patent/US9376572B2/en
Publication of WO2008133130A1 publication Critical patent/WO2008133130A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Disclosed is a low-cost highly dielectric elastomer molded body excellent in dielectric characteristics, impact resistance, flexibility and workability, which can be used in UHF band, namely at 800-960 MHz. Also disclosed is an electronic component material for high frequency use. The highly dielectric elastomer molded body is obtained by molding a highly dielectric elastomer composition wherein a dielectric ceramic powder is blended in an elastomer. The highly dielectric elastomer molded body has a tensile elongation of not less than 250%, a hardness of not more than 70, and a relative dielectric constant of 4-10 and a dielectric loss tangent of not more than 0.02 as measured at a frequency of 950 MHz. The electronic component material for high frequency use is obtained by using the highly dielectric elastomer molded body.
PCT/JP2008/057396 2007-04-24 2008-04-16 Highly dielectric elastomer molded body and electronic component material for high frequency use Ceased WO2008133130A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800135020A CN101679689B (en) 2007-04-24 2008-04-16 Highly dielectric elastomer molded body and electronic component material for high frequency use
DE112008001026T DE112008001026T5 (en) 2007-04-24 2008-04-16 Shaped body of a high dielectric elastomer and electronic component material for high frequency operation
US12/450,670 US9376572B2 (en) 2007-04-24 2008-04-16 Highly dielectric elastomer molded body and electronic component material for high frequency use

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007114427 2007-04-24
JP2007-114427 2007-04-24
JP2007309122A JP5362205B2 (en) 2007-04-24 2007-11-29 High frequency electronic component materials
JP2007-309122 2007-11-29

Publications (1)

Publication Number Publication Date
WO2008133130A1 true WO2008133130A1 (en) 2008-11-06

Family

ID=39925586

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057396 Ceased WO2008133130A1 (en) 2007-04-24 2008-04-16 Highly dielectric elastomer molded body and electronic component material for high frequency use

Country Status (1)

Country Link
WO (1) WO2008133130A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115260623A (en) * 2022-08-26 2022-11-01 石家庄安耐普电缆附件有限公司 Flexible high-dielectric material and production method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000506305A (en) * 1996-02-29 2000-05-23 ミネソタ マイニング アンド マニュファクチャリング カンパニー Thermoplastic elastomer substrate material with tunable dielectric properties and laminates thereof
WO2005123841A1 (en) * 2004-06-16 2005-12-29 Ntn Corporation Highly dielectric elastomer composition and dielectric antenna
JP2006290939A (en) * 2005-04-06 2006-10-26 Ntn Corp High dielectric elastomer composition
JP2007043236A (en) * 2005-07-29 2007-02-15 Ntn Corp Dielectric antenna
JP2007063337A (en) * 2005-08-29 2007-03-15 Ntn Corp Highly dielectric elastomer composition and method for producing the same
JP2008053527A (en) * 2006-08-25 2008-03-06 Nsk Ltd Dielectric rubber laminate and manufacturing method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000506305A (en) * 1996-02-29 2000-05-23 ミネソタ マイニング アンド マニュファクチャリング カンパニー Thermoplastic elastomer substrate material with tunable dielectric properties and laminates thereof
WO2005123841A1 (en) * 2004-06-16 2005-12-29 Ntn Corporation Highly dielectric elastomer composition and dielectric antenna
JP2006290939A (en) * 2005-04-06 2006-10-26 Ntn Corp High dielectric elastomer composition
JP2007043236A (en) * 2005-07-29 2007-02-15 Ntn Corp Dielectric antenna
JP2007063337A (en) * 2005-08-29 2007-03-15 Ntn Corp Highly dielectric elastomer composition and method for producing the same
JP2008053527A (en) * 2006-08-25 2008-03-06 Nsk Ltd Dielectric rubber laminate and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115260623A (en) * 2022-08-26 2022-11-01 石家庄安耐普电缆附件有限公司 Flexible high-dielectric material and production method thereof

Similar Documents

Publication Publication Date Title
TW200706582A (en) Polyethylene molding composition for producing injection-molded finished parts
MY152101A (en) Thermosettimg resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
EP1970408A4 (en) Curable composition
WO2003079472A3 (en) Electroconductive curable resin composition, cured product thereof and process for producing the same
EP2070976A4 (en) Polyolefin resin foam and process for production thereof
JP2008169460A5 (en)
WO2009060748A1 (en) Rubber composition and rubber belt
WO2006068902A3 (en) Golf ball
WO2010144344A3 (en) Melanocortin receptor-specific peptides
WO2009024920A3 (en) High dielectric constant thermoplastic composition, methods of manufacture thereof and articles comprising the same
EP1867680A4 (en) Resin composition, molded article produced from the same, and processes for production of the composition and article
WO2008155945A1 (en) Dielectric ceramic composition, and laminated ceramic capacitor
EP2064264A4 (en) Fluorochemical composition comprising fluorinated oligomeric silane
EP1923427A4 (en) Biodegradable resin composition and molded body obtained from same
PH12012502421A1 (en) Thermoplastic elastomer composition and molded products using the same
DE502004006114D1 (en) METAL-PLASTIC-HYBRID AND FORM BODY MANUFACTURED THEREOF
WO2012051153A3 (en) Lactamic polymers containing an acetoacetate moiety
KR20040028803A (en) Rubber composition
WO2006113412A3 (en) Flexible mold comprising cured polymerizable resin composition
EA200800732A1 (en) POLYETHYLENE COMPOSITION FOR MOLDING UNDER PRESSURE, HAS AN IMPROVED RELATION RESISTANCE TO SUSPENSION UNDER VOLTAGE TO STRENGTH AND SHOCK STRENGTH
WO2010039791A8 (en) Cellular elastomer compositions
WO2011028252A3 (en) Aliphatic moisture-curable resins, coating compositions, and related processes
WO2008133130A1 (en) Highly dielectric elastomer molded body and electronic component material for high frequency use
JPS64135A (en) Moldable thermosetting molding material
WO2009063534A1 (en) Heat transfer elastic sheet and method for manufacturing the same

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880013502.0

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08740477

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 12450670

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 1120080010269

Country of ref document: DE

RET De translation (de og part 6b)

Ref document number: 112008001026

Country of ref document: DE

Date of ref document: 20100304

Kind code of ref document: P

122 Ep: pct application non-entry in european phase

Ref document number: 08740477

Country of ref document: EP

Kind code of ref document: A1