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WO2008132832A1 - Composition de pâte conductrice pour un remplissage de trou d'interconnexion, carte de circuit imprimé utilisant celle-ci, et procédé de fabrication de la carte de circuit imprimé - Google Patents

Composition de pâte conductrice pour un remplissage de trou d'interconnexion, carte de circuit imprimé utilisant celle-ci, et procédé de fabrication de la carte de circuit imprimé Download PDF

Info

Publication number
WO2008132832A1
WO2008132832A1 PCT/JP2008/001043 JP2008001043W WO2008132832A1 WO 2008132832 A1 WO2008132832 A1 WO 2008132832A1 JP 2008001043 W JP2008001043 W JP 2008001043W WO 2008132832 A1 WO2008132832 A1 WO 2008132832A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed board
via hole
conductive paste
paste composition
hole filling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/001043
Other languages
English (en)
Japanese (ja)
Inventor
Masaaki Katsumata
Katsunori Hashiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to CN2008800133735A priority Critical patent/CN101669410B/zh
Priority to JP2009511681A priority patent/JP5310545B2/ja
Publication of WO2008132832A1 publication Critical patent/WO2008132832A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne la composition d'une pâte conductrice pour un remplissage de trou de l'interconnexion, qui contient 30-70 % en volume de particules conductrices ayant un diamètre de particule moyen de 0,5-20 µm et une aire de surface spécifique de 0,05-1,5 m<SUP>2</SUP>/g, et 70-30 % en volume d'une résine qui contient pas moins de 10 % en poids d'un composé époxy ayant un ou plusieurs groupe époxy dans une molécule, la quantité totale de groupe hydroxy, groupe amino et groupe carboxyle n'étant pas supérieure à 5 % en mole des groupes époxy et l'équivalent en époxy est 100-350 g/eq. Cette composition de pâte conductrice pour un remplissage de trou d'interconnexion contient du chlore dans une quantité de 20-2000 ppm.
PCT/JP2008/001043 2007-04-23 2008-04-22 Composition de pâte conductrice pour un remplissage de trou d'interconnexion, carte de circuit imprimé utilisant celle-ci, et procédé de fabrication de la carte de circuit imprimé Ceased WO2008132832A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800133735A CN101669410B (zh) 2007-04-23 2008-04-22 过孔填充用导电体糊组合物、使用其的印制基板及其制造方法
JP2009511681A JP5310545B2 (ja) 2007-04-23 2008-04-22 ビアホール充填用導電体ペースト組成物と、それを用いたプリント基板並びにその製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-112546 2007-04-23
JP2007112546 2007-04-23
JP2007112545 2007-04-23
JP2007-112545 2007-04-23

Publications (1)

Publication Number Publication Date
WO2008132832A1 true WO2008132832A1 (fr) 2008-11-06

Family

ID=39925303

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001043 Ceased WO2008132832A1 (fr) 2007-04-23 2008-04-22 Composition de pâte conductrice pour un remplissage de trou d'interconnexion, carte de circuit imprimé utilisant celle-ci, et procédé de fabrication de la carte de circuit imprimé

Country Status (4)

Country Link
JP (1) JP5310545B2 (fr)
CN (1) CN101669410B (fr)
TW (1) TWI405519B (fr)
WO (1) WO2008132832A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012042847A1 (fr) * 2010-09-27 2012-04-05 太陽ホールディングス株式会社 Charge de résine thermodurcissable

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5465453B2 (ja) 2009-03-26 2014-04-09 パナソニック株式会社 光導波路形成用エポキシ樹脂組成物、光導波路形成用硬化性フィルム、光伝送用フレキシブルプリント配線板、及び電子情報機器
CN105304160B (zh) * 2014-06-03 2018-09-14 太阳油墨制造株式会社 导电性粘接剂以及使用其的电子部件
JP6383183B2 (ja) * 2014-06-03 2018-08-29 太陽インキ製造株式会社 導電性接着剤およびそれを用いた電子部品
KR102507434B1 (ko) * 2015-05-11 2023-03-07 에이지씨 가부시키가이샤 프린트 기판용 재료, 금속 적층판, 그들의 제조 방법 및 프린트 기판의 제조 방법
TWI620253B (zh) * 2016-04-26 2018-04-01 Method for manufacturing conductive substrate
CN112018030A (zh) * 2020-08-11 2020-12-01 安徽蓝讯通信技术有限公司 一种基板通孔的填充方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000030533A (ja) * 1998-05-08 2000-01-28 Matsushita Electric Ind Co Ltd ビアホ―ル充填用導電体ペ―スト組成物並びにそれを用いた両面及び多層プリント基板とその製造方法
WO2005095486A1 (fr) * 2004-03-31 2005-10-13 Asahi Kasei Chemicals Corporation Durcisseur pour résine d'époxy et composition de la résine d'époxy
JP2006348225A (ja) * 2005-06-17 2006-12-28 Hitachi Chem Co Ltd 複合体、これを用いたプリプレグ、金属箔張積層板、プリント配線基板及びプリント配線基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6139777A (en) * 1998-05-08 2000-10-31 Matsushita Electric Industrial Co., Ltd. Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same
JP2000169821A (ja) * 1998-09-30 2000-06-20 Three Bond Co Ltd 紫外線硬化性異方導電接着剤
JP2001002982A (ja) * 1999-06-22 2001-01-09 Noriko Ito コーティング剤
DE60017710T2 (de) * 1999-11-10 2005-12-22 Mitsui Mining & Smelting Co., Ltd. Verfahren zur herstellung eines nickelpulvers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000030533A (ja) * 1998-05-08 2000-01-28 Matsushita Electric Ind Co Ltd ビアホ―ル充填用導電体ペ―スト組成物並びにそれを用いた両面及び多層プリント基板とその製造方法
WO2005095486A1 (fr) * 2004-03-31 2005-10-13 Asahi Kasei Chemicals Corporation Durcisseur pour résine d'époxy et composition de la résine d'époxy
JP2006348225A (ja) * 2005-06-17 2006-12-28 Hitachi Chem Co Ltd 複合体、これを用いたプリプレグ、金属箔張積層板、プリント配線基板及びプリント配線基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012042847A1 (fr) * 2010-09-27 2012-04-05 太陽ホールディングス株式会社 Charge de résine thermodurcissable

Also Published As

Publication number Publication date
CN101669410A (zh) 2010-03-10
CN101669410B (zh) 2011-08-03
TWI405519B (zh) 2013-08-11
JP5310545B2 (ja) 2013-10-09
JPWO2008132832A1 (ja) 2010-07-22
TW200908847A (en) 2009-02-16

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