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WO2008132852A1 - ダイシング・ダイボンディングテープ及び半導体チップの製造方法 - Google Patents

ダイシング・ダイボンディングテープ及び半導体チップの製造方法 Download PDF

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Publication number
WO2008132852A1
WO2008132852A1 PCT/JP2008/050407 JP2008050407W WO2008132852A1 WO 2008132852 A1 WO2008132852 A1 WO 2008132852A1 JP 2008050407 W JP2008050407 W JP 2008050407W WO 2008132852 A1 WO2008132852 A1 WO 2008132852A1
Authority
WO
WIPO (PCT)
Prior art keywords
die bonding
dicing
semiconductor chip
bonding tape
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050407
Other languages
English (en)
French (fr)
Inventor
Kouji Watanabe
Masateru Fukuoka
Shota Matsuda
Yoshiyuki Takebe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to KR1020097021623A priority Critical patent/KR101273871B1/ko
Priority to JP2008526309A priority patent/JPWO2008132852A1/ja
Publication of WO2008132852A1 publication Critical patent/WO2008132852A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　半導体ウェーハをダイシングし、ダイボンディングフィルムごと半導体チップをピックアップするに際し、ダイボンディングフィルムごと半導体チップを容易に剥離して、取り出すことを可能とするダイシング・ダイボンディングテープを得る。 　半導体ウェーハをダイシングし、半導体チップを得、半導体チップをダイボンディングするのに用いられるダイシング・ダイボンディングテープ１であって、ダイシング・ダイボンディングテープ１は、ダイボンディングフィルム３と、ダイボンディングフィルム３の一方の面に貼付された非粘着フィルム４とを有し、非粘着フィルム４は、（メタ）アクリル樹脂架橋体を主成分として含む。
PCT/JP2008/050407 2007-04-19 2008-01-16 ダイシング・ダイボンディングテープ及び半導体チップの製造方法 Ceased WO2008132852A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020097021623A KR101273871B1 (ko) 2007-04-19 2008-01-16 다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법
JP2008526309A JPWO2008132852A1 (ja) 2007-04-19 2008-01-16 ダイシング・ダイボンディングテープ及び半導体チップの製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-110270 2007-04-19
JP2007110270 2007-04-19
JP2007-188004 2007-07-19
JP2007188004 2007-07-19

Publications (1)

Publication Number Publication Date
WO2008132852A1 true WO2008132852A1 (ja) 2008-11-06

Family

ID=39925323

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050407 Ceased WO2008132852A1 (ja) 2007-04-19 2008-01-16 ダイシング・ダイボンディングテープ及び半導体チップの製造方法

Country Status (4)

Country Link
JP (3) JPWO2008132852A1 (ja)
KR (1) KR101273871B1 (ja)
TW (1) TWI414010B (ja)
WO (1) WO2008132852A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011190354A (ja) * 2010-03-15 2011-09-29 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
KR101159946B1 (ko) 2009-02-20 2012-06-25 후루카와 덴키 고교 가부시키가이샤 웨이퍼 가공용 필름
JP2012129473A (ja) * 2010-12-17 2012-07-05 Sekisui Chem Co Ltd ダイシング−ダイボンディングテープ
JP2013172021A (ja) * 2012-02-21 2013-09-02 Sekisui Chem Co Ltd ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法
CN109971376A (zh) * 2017-12-28 2019-07-05 日东电工株式会社 切割芯片接合薄膜
CN112694840A (zh) * 2016-03-30 2021-04-23 琳得科株式会社 半导体加工用片

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9305769B2 (en) 2009-06-30 2016-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Thin wafer handling method
US8871609B2 (en) 2009-06-30 2014-10-28 Taiwan Semiconductor Manufacturing Company, Ltd. Thin wafer handling structure and method
JP5512262B2 (ja) * 2009-12-26 2014-06-04 株式会社朝日ラバー レンズアレイシート及びそれのダイシング方法
JP6107230B2 (ja) * 2013-02-28 2017-04-05 住友ベークライト株式会社 ダイシングフィルム
US10030174B2 (en) 2013-03-27 2018-07-24 Lintec Corporation Composite sheet for forming protective film
US10529614B2 (en) 2014-08-05 2020-01-07 Uniqarta, Inc. Setting up ultra-small or ultra-thin discrete components for easy assembly
KR20160095526A (ko) 2015-02-03 2016-08-11 도레이첨단소재 주식회사 반도체용 다이싱 다이본딩 필름
CN108886023B (zh) * 2016-04-28 2023-09-08 琳得科株式会社 保护膜形成用膜及保护膜形成用复合片
JP6719489B2 (ja) * 2018-01-31 2020-07-08 古河電気工業株式会社 マスク一体型表面保護テープおよびマスク一体型表面保護テープを用いる半導体チップの製造方法
WO2025075176A1 (ja) * 2023-10-04 2025-04-10 株式会社レゾナック 重合体、硬化性樹脂組成物、樹脂硬化物、接着剤組成物、フィルム状接着剤、及び接着シート

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09266183A (ja) * 1996-01-22 1997-10-07 Texas Instr Japan Ltd ウェハダイシング・接着用シートおよび半導体装置の製造方法
JP2002203816A (ja) * 2000-12-28 2002-07-19 Nitto Denko Corp ダイシング用粘着シート
JP2003142505A (ja) * 2001-10-31 2003-05-16 Lintec Corp ウエハダイシング・接着用シートおよび半導体装置の製造方法
JP2004134689A (ja) * 2002-10-15 2004-04-30 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005268434A (ja) * 2004-03-17 2005-09-29 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005303275A (ja) * 2004-03-15 2005-10-27 Hitachi Chem Co Ltd ダイシングダイボンドシート
JP2007012670A (ja) * 2005-06-28 2007-01-18 Furukawa Electric Co Ltd:The 粘接着テープ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019841A (ja) * 2003-06-27 2005-01-20 Nitto Denko Corp 紫外線硬化型粘着テープの貼付け方法およびその装置並びにそれを用いて形成した物品
KR20070004100A (ko) * 2004-04-20 2007-01-05 히다치 가세고교 가부시끼가이샤 접착시트, 반도체장치, 및 반도체장치의 제조방법
JP2006165074A (ja) 2004-12-03 2006-06-22 Sumitomo Bakelite Co Ltd ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法
JP2006203000A (ja) * 2005-01-20 2006-08-03 Sekisui Chem Co Ltd ダイシング用粘着テープおよび半導体チップの製造方法
JP2006216773A (ja) * 2005-02-03 2006-08-17 Lintec Corp ダイシングシートおよび電子部品の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09266183A (ja) * 1996-01-22 1997-10-07 Texas Instr Japan Ltd ウェハダイシング・接着用シートおよび半導体装置の製造方法
JP2002203816A (ja) * 2000-12-28 2002-07-19 Nitto Denko Corp ダイシング用粘着シート
JP2003142505A (ja) * 2001-10-31 2003-05-16 Lintec Corp ウエハダイシング・接着用シートおよび半導体装置の製造方法
JP2004134689A (ja) * 2002-10-15 2004-04-30 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005303275A (ja) * 2004-03-15 2005-10-27 Hitachi Chem Co Ltd ダイシングダイボンドシート
JP2005268434A (ja) * 2004-03-17 2005-09-29 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2007012670A (ja) * 2005-06-28 2007-01-18 Furukawa Electric Co Ltd:The 粘接着テープ

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101159946B1 (ko) 2009-02-20 2012-06-25 후루카와 덴키 고교 가부시키가이샤 웨이퍼 가공용 필름
JP2011190354A (ja) * 2010-03-15 2011-09-29 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2012129473A (ja) * 2010-12-17 2012-07-05 Sekisui Chem Co Ltd ダイシング−ダイボンディングテープ
JP2013172021A (ja) * 2012-02-21 2013-09-02 Sekisui Chem Co Ltd ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法
CN112694840A (zh) * 2016-03-30 2021-04-23 琳得科株式会社 半导体加工用片
CN109971376A (zh) * 2017-12-28 2019-07-05 日东电工株式会社 切割芯片接合薄膜
CN109971376B (zh) * 2017-12-28 2022-05-10 日东电工株式会社 切割芯片接合薄膜

Also Published As

Publication number Publication date
JP2009065191A (ja) 2009-03-26
JP5268575B2 (ja) 2013-08-21
TWI414010B (zh) 2013-11-01
JP2011176327A (ja) 2011-09-08
JPWO2008132852A1 (ja) 2010-07-22
KR101273871B1 (ko) 2013-06-11
KR20100015636A (ko) 2010-02-12
TW200842957A (en) 2008-11-01

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