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WO2008129923A1 - 高周波回路基板、高周波回路モジュールおよびレーダ装置 - Google Patents

高周波回路基板、高周波回路モジュールおよびレーダ装置 Download PDF

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Publication number
WO2008129923A1
WO2008129923A1 PCT/JP2008/056441 JP2008056441W WO2008129923A1 WO 2008129923 A1 WO2008129923 A1 WO 2008129923A1 JP 2008056441 W JP2008056441 W JP 2008056441W WO 2008129923 A1 WO2008129923 A1 WO 2008129923A1
Authority
WO
WIPO (PCT)
Prior art keywords
high frequency
frequency circuit
circuit board
radar device
circuit module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056441
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English (en)
French (fr)
Inventor
Hajime Sasaki
Kazuki Hayata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2009510811A priority Critical patent/JP5209610B2/ja
Priority to US12/595,820 priority patent/US8179306B2/en
Priority to DE112008000985T priority patent/DE112008000985T5/de
Publication of WO2008129923A1 publication Critical patent/WO2008129923A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/02—Waveguide horns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
    • G01S7/032—Constructional details for solid-state radar subsystems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H01P3/121—Hollow waveguides integrated in a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q25/00—Antennas or antenna systems providing at least two radiating patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
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    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H01L2223/6633—Transition between different waveguide types
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    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • H01L2224/73265—Layer and wire connectors
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
    • H01L2924/19038—Structure including wave guides being a hybrid line type
    • H01L2924/19039—Structure including wave guides being a hybrid line type impedance transition between different types of wave guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Remote Sensing (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Waveguides (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

　本発明は、設計の自由度が低下することなく、実装される電子部品に生じる熱を効率的に放熱することができる高周波回路基板、およびこの高周波回路基板を備える高周波回路モジュールならびにこの高周波回路モジュールを備えるレーダ装置に関する。誘電体基板（３）には、前記誘電体基板（３）の一表面（３ａ）に設けられ、電子部品（２）が搭載される搭載部（４）と、前記誘電体基板（３）に形成される導波管（５）とが設けられる。この搭載部（４）と導波管（５）とは、誘電体基板（３）の熱伝導率よりも高い熱伝導率を有する熱伝導体（６）によって接続される。
PCT/JP2008/056441 2007-04-13 2008-03-31 高周波回路基板、高周波回路モジュールおよびレーダ装置 Ceased WO2008129923A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009510811A JP5209610B2 (ja) 2007-04-13 2008-03-31 高周波回路基板、高周波回路モジュールおよびレーダ装置
US12/595,820 US8179306B2 (en) 2007-04-13 2008-03-31 High-frequency circuit board, high-frequency circuit module, and radar apparatus
DE112008000985T DE112008000985T5 (de) 2007-04-13 2008-03-31 Hochfrequenz-Leiterplatte, Hochfrequenz-Schaltmodul und Radargerät

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-106564 2007-04-13
JP2007106564 2007-04-13

Publications (1)

Publication Number Publication Date
WO2008129923A1 true WO2008129923A1 (ja) 2008-10-30

Family

ID=39875451

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056441 Ceased WO2008129923A1 (ja) 2007-04-13 2008-03-31 高周波回路基板、高周波回路モジュールおよびレーダ装置

Country Status (4)

Country Link
US (1) US8179306B2 (ja)
JP (1) JP5209610B2 (ja)
DE (1) DE112008000985T5 (ja)
WO (1) WO2008129923A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011059582A1 (en) * 2009-11-12 2011-05-19 Sensis Corporation Light-weight, air-cooled transmit/receive unit and active phased array including same
JP2012089590A (ja) * 2010-10-18 2012-05-10 Hitachi Metals Ltd 電子部品
JP2013247495A (ja) * 2012-05-25 2013-12-09 Nippon Telegr & Teleph Corp <Ntt> ホーンアンテナ一体型ｍｍｉｃパッケージ
JP2015012161A (ja) * 2013-06-28 2015-01-19 株式会社デンソー 電子装置
JP2018195901A (ja) * 2017-05-15 2018-12-06 日本電信電話株式会社 集積回路
CN107017310B (zh) * 2017-03-17 2020-01-07 山东大学 一种高功率低噪音的平面耿氏二极管及其制备方法
WO2021240861A1 (ja) * 2020-05-26 2021-12-02 株式会社フジクラ 無線通信モジュール

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008129923A1 (ja) * 2007-04-13 2008-10-30 Kyocera Corporation 高周波回路基板、高周波回路モジュールおよびレーダ装置
DE102007034329A1 (de) * 2007-07-24 2009-01-29 Robert Bosch Gmbh Radarvorrichtung
KR101070022B1 (ko) * 2009-09-16 2011-10-04 삼성전기주식회사 다층 세라믹 회로 기판, 다층 세라믹 회로 기판 제조방법 및 이를 이용한 전자 디바이스 모듈
GB2499792B (en) * 2012-02-28 2016-05-04 Canon Kk Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package
KR101442475B1 (ko) * 2012-03-08 2014-09-23 주식회사 한라홀딩스 레이더 장치
US9219041B2 (en) * 2012-03-29 2015-12-22 International Business Machines Corporation Electronic package for millimeter wave semiconductor dies
US9620854B2 (en) * 2013-01-09 2017-04-11 Nxp Usa, Inc. Electronic high frequency device and manufacturing method
ITMI20130872A1 (it) * 2013-05-29 2013-08-28 Mavel Srl Dispositivo elettronico comprendente un circuito stampato
US9667290B2 (en) * 2015-04-17 2017-05-30 Apple Inc. Electronic device with millimeter wave antennas
CN108293295B (zh) * 2015-10-01 2020-09-04 奥特斯奥地利科技与系统技术有限公司 用于发热电子部件的承载和散热的电子部件载体
US11830831B2 (en) * 2016-09-23 2023-11-28 Intel Corporation Semiconductor package including a modular side radiating waveguide launcher
US10782388B2 (en) * 2017-02-16 2020-09-22 Magna Electronics Inc. Vehicle radar system with copper PCB
US10516207B2 (en) 2017-05-17 2019-12-24 Nxp B.V. High frequency system, communication link
US11031699B2 (en) 2018-02-09 2021-06-08 Intel IP Corporation Antenna with graded dielectirc and method of making the same
CN115732943A (zh) 2021-09-01 2023-03-03 深南电路股份有限公司 用于相控阵天线收发组件的印制线路板、收发组件及雷达
JP2024117490A (ja) * 2023-02-17 2024-08-29 新光電気工業株式会社 導波路基板及び導波路基板の製造方法
DE102023205139A1 (de) 2023-06-01 2024-12-05 Robert Bosch Gesellschaft mit beschränkter Haftung Leiterplatte mit einem Hohlwellenleiterkanal
JP2025064739A (ja) * 2023-10-06 2025-04-17 新光電気工業株式会社 配線基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002084208A (ja) * 2000-09-07 2002-03-22 Mitsubishi Electric Corp 高周波モジュールおよび高周波無線装置
JP2003188610A (ja) * 2001-12-18 2003-07-04 Mitsubishi Electric Corp 高周波回路
JP2003318319A (ja) * 2002-04-23 2003-11-07 Kyocera Corp 高周波モジュール
JP2005311337A (ja) * 2004-03-26 2005-11-04 Mitsubishi Electric Corp 高周波パッケージ、送受信モジュールおよび無線装置
JP2006229073A (ja) * 2005-02-18 2006-08-31 Fujitsu Ltd 半導体パッケージおよびその作製方法
JP2007053440A (ja) * 2005-08-15 2007-03-01 Murata Mfg Co Ltd サスペンデッド線路装置および送受信装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330696A (ja) 1995-05-26 1996-12-13 Japan Radio Co Ltd 高放熱効果のコプレーナ型ｍｍｉｃ回路
US5929518A (en) * 1997-07-20 1999-07-27 Motorola, Inc. Circuit board and method
JP3129288B2 (ja) * 1998-05-28 2001-01-29 日本電気株式会社 マイクロ波集積回路マルチチップモジュール、マイクロ波集積回路マルチチップモジュールの実装構造
JP2001284803A (ja) 2000-03-30 2001-10-12 Nec Corp 高周波用プリント配線板の実装方法、高周波用プリント配線板実装体及びその製造方法
JP3827535B2 (ja) 2001-03-22 2006-09-27 京セラ株式会社 配線基板モジュール
JP4623850B2 (ja) * 2001-03-27 2011-02-02 京セラ株式会社 高周波半導体素子収納用パッケージおよびその実装構造
JP2003209411A (ja) * 2001-10-30 2003-07-25 Matsushita Electric Ind Co Ltd 高周波モジュールおよび高周波モジュールの製造方法
JP2003179181A (ja) 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 樹脂製配線基板
US6873529B2 (en) * 2002-02-26 2005-03-29 Kyocera Corporation High frequency module
JP4446785B2 (ja) * 2003-08-27 2010-04-07 京セラ株式会社 高周波送受信器およびそれを具備するレーダ装置ならびにそれを搭載したレーダ装置搭載車両およびレーダ装置搭載小型船舶
DE102005008733A1 (de) * 2004-02-26 2005-10-13 Kyocera Corp. Sende-/Empfangsantenne, Isolator, Hochfrequenzoszillator und dieselben verwendender Hochfrequenz-Sender/Empfänger
EP1729340B1 (en) * 2004-03-26 2017-09-06 Mitsubishi Denki Kabushiki Kaisha High frequency package, transmitting and receiving module and wireless equipment
WO2008129923A1 (ja) * 2007-04-13 2008-10-30 Kyocera Corporation 高周波回路基板、高周波回路モジュールおよびレーダ装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002084208A (ja) * 2000-09-07 2002-03-22 Mitsubishi Electric Corp 高周波モジュールおよび高周波無線装置
JP2003188610A (ja) * 2001-12-18 2003-07-04 Mitsubishi Electric Corp 高周波回路
JP2003318319A (ja) * 2002-04-23 2003-11-07 Kyocera Corp 高周波モジュール
JP2005311337A (ja) * 2004-03-26 2005-11-04 Mitsubishi Electric Corp 高周波パッケージ、送受信モジュールおよび無線装置
JP2006229073A (ja) * 2005-02-18 2006-08-31 Fujitsu Ltd 半導体パッケージおよびその作製方法
JP2007053440A (ja) * 2005-08-15 2007-03-01 Murata Mfg Co Ltd サスペンデッド線路装置および送受信装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011059582A1 (en) * 2009-11-12 2011-05-19 Sensis Corporation Light-weight, air-cooled transmit/receive unit and active phased array including same
US8937574B2 (en) 2009-11-12 2015-01-20 Saab Sensis Corporation Lightweight air-cooled transmit/receive unit and active phased array including same
JP2012089590A (ja) * 2010-10-18 2012-05-10 Hitachi Metals Ltd 電子部品
JP2013247495A (ja) * 2012-05-25 2013-12-09 Nippon Telegr & Teleph Corp <Ntt> ホーンアンテナ一体型ｍｍｉｃパッケージ
JP2015012161A (ja) * 2013-06-28 2015-01-19 株式会社デンソー 電子装置
CN107017310B (zh) * 2017-03-17 2020-01-07 山东大学 一种高功率低噪音的平面耿氏二极管及其制备方法
JP2018195901A (ja) * 2017-05-15 2018-12-06 日本電信電話株式会社 集積回路
WO2021240861A1 (ja) * 2020-05-26 2021-12-02 株式会社フジクラ 無線通信モジュール
JP6982219B1 (ja) * 2020-05-26 2021-12-17 株式会社フジクラ 無線通信モジュール
US11431080B2 (en) 2020-05-26 2022-08-30 Fujikura Ltd. Radio communication module

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US8179306B2 (en) 2012-05-15

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