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WO2008129062A1 - Composant fonctionnant avec des ondes acoustiques - Google Patents

Composant fonctionnant avec des ondes acoustiques Download PDF

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Publication number
WO2008129062A1
WO2008129062A1 PCT/EP2008/054928 EP2008054928W WO2008129062A1 WO 2008129062 A1 WO2008129062 A1 WO 2008129062A1 EP 2008054928 W EP2008054928 W EP 2008054928W WO 2008129062 A1 WO2008129062 A1 WO 2008129062A1
Authority
WO
WIPO (PCT)
Prior art keywords
filter
ground
component according
stages
main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/054928
Other languages
German (de)
English (en)
Inventor
Andreas Detlefsen
Andreas Waldherr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of WO2008129062A1 publication Critical patent/WO2008129062A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/58—Multiple crystal filters
    • H03H9/60—Electric coupling means therefor
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/0023—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output
    • H03H9/0028—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices
    • H03H9/0047—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks
    • H03H9/0052—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks being electrically cascaded
    • H03H9/0057—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns, or networks having balanced input and output using surface acoustic wave devices having two acoustic tracks being electrically cascaded the balanced terminals being on the same side of the tracks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0557—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the other elements being buried in the substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H03H9/0571—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including bulk acoustic wave [BAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source

Definitions

  • a component with acoustic filters is z. B. from the document DE 100 54 968 Al and DE 102005032058 Al known.
  • a demultiplexer which comprises a reception filter and a transmission filter. Both filters are designed in ladder-type-like structure with parallel resonators in parallel branches. On the ground side, the parallel branches of both filters are interconnected via inductive elements and. In addition, the grounded connections of the parallel branches of the reception filter are electrically connected to those of the transmission filter via an inductive element.
  • An object to be solved is to specify a working with acoustic waves device that has a small footprint.
  • acoustic waves device comprising at least two different frequency bands associated filter specified.
  • the device has ground connections which are galvanically connected to ground of the filter stages and provided as external terminals of the device.
  • Each filter stage is associated with a main ground terminal connected to the respective ground via a main ground path. At least parts of a main mass path are used simultaneously by at least two filter stages of different filters.
  • the main ground path of a filter stage is understood to mean the ground path or the connection of the respective ground with a main ground connection which forms the "path of least resistance", in particular the ground path having the lowest inductance, even if connections of the respective ground to several ground connections are present
  • there is one main ground path connected to the corresponding ground ground terminal and if there are several ground paths with the same lowest inductance per filter stage, connecting the ground to a ground terminal, these are all considered to be the main ground terminals.
  • ground connections are main ground connections.
  • each filter stage with only one ground path can be connected to only one ground terminal, so that a distinction between main ground connections and other ground connections is unnecessary. So it is possible, at least to design a ground connection as the main ground connection of at least two filter stages of different filters.
  • At least one ground connection as the main ground connection of at least two filter stages of the same filter.
  • the total number of ground connections can be smaller than the total number of filter stages. However, it is also possible to provide, in addition to the at least one main ground connection connected to a main ground path, at least one further ground connection which is not connected to a main ground path. One or more such “minor ground connections” can increase the number of ground connections again.
  • the z. B. may be one octave apart.
  • one filter may be assigned to a frequency band of approximately 1 GHz and the other filter to a frequency band of approximately 2 GHz.
  • the latter frequency band includes transmission bands between 1640 MHz and 2.45 GHz
  • all the filters of the component are provided as receive filters. In a further variant, all the filters of the component are provided as transmission filters. In a further variant, the filters of the component are provided as a transmission-receiving filter.
  • the component can also have multiplexed, ie interconnected, signal-carrying connections which at least in sections have the same signal path. - A -
  • the respective filter is electrically connected to at least two signal-carrying terminals, which are provided as external terminals of the component.
  • One port serves as the input and the other port as the output of the filter.
  • the area of the respective ground terminal is preferably not greater than twice the area of the respective signal-carrying terminal.
  • the ratio of the area is a maximum of 1.5.
  • all external connections of the component are the same size.
  • the arrangement or the pattern of all external connections of the component is referred to below as a footprint.
  • the external connections can be solderable or bondable surfaces. But they can also be realized as bumps, or provided with bumps.
  • the filter stages of a filter comprising several stages are preferably connected in an electrically cascaded manner.
  • Each filter stage has, in principle, a high frequency filter function, can be a full filter and can be used e.g. have a pass band and stop bands.
  • Different filter stages as well as different filters can be constructed the same or different, i. H. be realized as the same or different types of filters.
  • At least one of the filter stages comprises transducers operating in a variant with surface acoustic waves.
  • at least one of the filter stages comprises resonators operating with bulk acoustic waves.
  • At least one of the filter stages comprises, in a further variant, transducers operating with acoustic interface waves (GBAW Component).
  • GBAW Component acoustic interface waves
  • At least one filter stage may be formed by a single SAW or BAW parallel resonator.
  • the resonator is then connected to another filter stage, the z. B. is formed by a DMS track connected.
  • Two resonators, which together form a basic element of a ladder-type arrangement, are considered together as a filter stage, but not individual resonators of a fundamental element.
  • the acoustic track of the respective SAW or GBAW filter stage may be formed as a DMS track.
  • DMS stands for Double-Mode Surface Acoustic Wave.
  • At least one input transducer and at least one output transducer may be arranged in the strain gauge track.
  • output transducers and / or input transducers can each be replaced by coupling transducers.
  • Two by means of coupling transducers with each other e.g. Cascaded DMS traces, both of which are associated with the same filter, are preferably considered to be different filter stages.
  • At least two ground paths of the filters are connected to at least one common main ground path, which is connected to the corresponding associated main ground connection.
  • the masses of the different filter stages of the same filter are preferably conductively connected to different ground terminals.
  • the masses of the different filter stages of the respective filter are independently - in a variant galvanically separated from each other - led to the respective ground terminal.
  • it is also possible to de different filter stages of the same filter to merge into a common main ground path and connect to a common main ground connection.
  • the galvanic connection between these masses is possible outside of the device.
  • the respective filter has an input-side filter stage and an output-side filter stage. Masses of the input-side filter stages of different filters are combined to form a common main ground path, which is connected to a first ground terminal. Masses of the output-side filter stages of different filters can likewise be combined to form a common ground path, which is connected to a second main ground terminal.
  • the mass of an input-side filter stage of a first filter and the mass of an output-side filter stage of a second filter are combined to form a common main ground path, which is connected to a first main ground terminal.
  • the ground paths of an output-side filter stage of the first filter and a Input-side filter stage of the second filter are combined to form a common main ground path, which is connected to a second ground terminal.
  • the filters are preferably realized at least partially in at least one acoustic chip. Each filter can be realized in a separate chip. It is also possible to realize at least two filters in or on a common chip.
  • the filter stages of the same filter are preferably realized in or on a common chip. Different filter levels of the same filter used in different technologies, eg. B. SAW / BAW, may also be implemented in or on different substrates.
  • the device comprises e.g. a carrier substrate on which the chip is mounted or a plurality of chips are mounted.
  • the outer terminals of the device including the ground terminals, are arranged on the underside or the front side of the carrier substrate.
  • At least one of the filter stages comprises an acoustic track with at least two acoustically coupled transducers.
  • At least one of the filter stages may also be designed as a ladder-type arrangement of transducers.
  • the ladder type arrangement has at least one series branch and at least one shunt branch connected to the series branch, a series converter being arranged in the series branch and a parallel converter being arranged in the shunt branch.
  • BAW bulk acoustic wave.
  • a ladder type arrangement of BAW resonators is also possible.
  • at least one of the filter stages has at least one series branch and at least one shunt branch connected to the series branch, wherein a series resonator is arranged in the series branch and a parallel resonator is arranged in the transverse branch, which together form a basic element that represents a filter stage.
  • An input-side matching network for adapting the input impedance of the respective filter to a specific impedance level can be arranged in the carrier substrate.
  • An output matching network for adapting the output impedance of the respective filter to a specific impedance level can be arranged in the carrier substrate.
  • the respective matching network has at least one passive element selected from a series capacitance, shunt capacitance, series inductance and a shunt inductance.
  • the input and / or the output of the respective filter can be single-ended.
  • the entrance and / or the output of the respective filter can also be differential (balanced).
  • Figure 1 shows the equivalent circuit of a device with two filters, in which the masses of the input and output side filter stages are brought together;
  • FIG. 2 shows the equivalent circuit diagram of a component with two filters, in which the masses of the input and output filter stages of different filters are combined;
  • FIG. 4 shows the equivalent circuit diagram of a component with two filters, in which the conductor sections which contribute to the ground paths, together with the associated inductances, are shown;
  • Figures 5, 6 each show the view of an exemplary footprint of the device.
  • Figures 1, 2 each show a component with two filters Fl, F2, which are arranged in a common housing or on a common carrier substrate TS.
  • the first filter Fl has an input-side filter stage Al and an output-side filter stage A2.
  • the second FiI- ter F2 has an input-side filter stage Bl and an output-side filter stage B2.
  • the input-side filter stage Al of the first filter Fl is connected in FIG. 1 to an input terminal IN a and in FIG. 2 to two input terminals IN a i, IN a2 .
  • the output-side filter stage A2 of the first filter Fl is connected in FIG. 1 to an output terminal OUT a and in FIG. 2 to two output terminals OUT a i, OUT a2 .
  • the masses of the input-side filter stages A1, B1 are combined and connected to a common ground terminal GND1.
  • the masses of the output-side filter stages A2, B2 are merged and connected to a common ground terminal GND2.
  • the mass of the input-side filter stage A1 of the first filter F1 is combined with the mass of the output-side filter stage B2 of the second filter F2 and connected to a common ground terminal GND1.
  • the mass of the input-side filter stage Bl of the second filter F2 is merged with the ground of the output-side filter stage A2 of the first filter Fl and connected to a common ground terminal GND2.
  • the corresponding filter stages are connected via the same ground path to a ground terminal, which represents the main terminal for the corresponding filter stages.
  • the total number of filter stages of the device is four. In both variants shown, the number of ground connections is two and is thus smaller than the total number of filter stages of the component.
  • the carrier substrate TS comprises at least two dielectric layers and metallization planes arranged alternately therewith. On the underside of the substrate are external terminals of the device and on top of the substrate contacts for contacting of at least one chip, in which the filters Fl, F2 are realized arranged.
  • FIG. 3 shows a variant in which the filters F1, F2 are implemented in separate acoustic chips. The merging of the masses of the filter stages takes place in an inner plane of the carrier substrate TS.
  • the component is preferably suitable for SMD mounting and has the outer terminals in the form of a metal layer applied to the underside of the carrier substrate.
  • FIG. 4 shows the equivalent circuit diagram of a component with two filters F1, F2, of which two filter stages A1, A2 or B1, B2 are shown here and one third filter stage A3, B3 each is indicated.
  • the picture explains the definition of the main mass paths and main ground connections.
  • Each ground path consists of conductor sections and also includes all electrical connections between the ground on the filter structure and the respective ground terminal on the underside of the substrate. These include, for example, bumps and through-contacts and other elements. For simplicity, these elements are in the equivalent circuit diagram as inductors Ll to L5. shown. For the sake of clarity, only the ground paths of the first two filter stages Al and Bl are considered. The other ground paths may be similarly constructed and interconnected.
  • Ground paths for the filter stage Al e.g. are all possible rungs between Al and a ground connection.
  • the main ground path is the one having the least total inductance in the sum of the single inductances. For the filter stage Al, this may be the path through Ll, L2 and L3 to GND2, if (L2 + L3) is less than L5. Then, the main ground path for the filter stage Bl via L4 and L3 also goes to the ground terminal, since L5> (L2 + L3). GND2 is then the main ground connection for the two filter stages Al and Bl.
  • FIGS. 5 and 6 Various variants of a footprint of the above-described device with four filter stages are shown in FIGS. 5 and 6.
  • the ground connection GND1 is arranged between the input connections IN a , IN b of the first and second filters F1, F2.
  • Ground terminal GND2 is between the output terminals OUT a , OUT b of the first and second filters Fl, F2 arranged.
  • the ground terminal GNDL between the terminals IN a, a OUT is disposed the first filter Fl and the ground terminal GND2 between the terminals in B, OUT b of the second filter F2.
  • the surface of the respective ground connection can, in all variants, as indicated in FIG. 5, be equal to the area of the signal-carrying connections.
  • the area of the ground connections may be slightly larger than the area of the signal-carrying terminals.
  • the ratio of these areas is preferably at most 1.5. This has the advantage that the dosage of the solder mass and thus the quality of the solder joint of the respective terminal z. B. can be controlled particularly well with a circuit board.
  • the number of filters and filter stages in the component is not limited to the variants explained in the figures.
  • the number of dielectric layers in the carrier substrate can also be arbitrary.

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

L'invention concerne un composant fonctionnant avec des ondes acoustiques comprenant au moins deux filtres (F1, F2) affectés à des bandes de fréquences différentes. Les filtres présentent respectivement au moins un étage de filtrage (A1, A2, B1, B2) et, selon l'invention, des étages de filtrage différents sont réalisés dans des voies acoustiques séparées ou sous la forme de piles de résonateurs séparées. Le composant présente des bornes de masse (GND1, GND2) qui sont reliées galvaniquement avec la masse des étages de filtrage et qui sont réalisées sous la forme de bornes extérieures du composant. À chaque étage de filtrage est affectée une borne de masse principale qui est reliée avec la masse correspondante par le biais d'un trajet de masse principal. Selon l'invention, au moins des parties d'un trajet de masse principal sont utilisées simultanément par au moins deux étages de filtrage de filtres différents.
PCT/EP2008/054928 2007-04-24 2008-04-23 Composant fonctionnant avec des ondes acoustiques Ceased WO2008129062A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710019325 DE102007019325B4 (de) 2007-04-24 2007-04-24 Mit akustischen Wellen arbeitendes Bauelement
DE102007019325.6 2007-04-24

Publications (1)

Publication Number Publication Date
WO2008129062A1 true WO2008129062A1 (fr) 2008-10-30

Family

ID=39620166

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/054928 Ceased WO2008129062A1 (fr) 2007-04-24 2008-04-23 Composant fonctionnant avec des ondes acoustiques

Country Status (2)

Country Link
DE (1) DE102007019325B4 (fr)
WO (1) WO2008129062A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012013431A1 (fr) * 2010-07-29 2012-02-02 Epcos Ag Boîtier à puce retournée pour deux topologies de filtre

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05167389A (ja) * 1991-12-16 1993-07-02 Fujitsu Ltd 分波器
EP1076414A2 (fr) * 1999-08-11 2001-02-14 Fujitsu Media Devices Limited Dispositif à ondes acoustiques de surface pour montage à flip-chip
DE10317969A1 (de) * 2003-04-17 2004-11-18 Epcos Ag Duplexer mit erweiterter Funktionalität
EP1519485A1 (fr) * 2003-09-25 2005-03-30 Murata Manufacturing Co., Ltd. Demulitplexeur et dispositif de communication
EP1675262A2 (fr) * 2004-12-22 2006-06-28 Fujitsu Media Devices Limited Duplexeur
DE102005032058A1 (de) * 2005-07-08 2007-01-18 Epcos Ag HF-Filter mit verbesserter Gegenbandunterdrückung
US20070111674A1 (en) * 2005-11-15 2007-05-17 Fujitsu Media Devices Limited Duplexer
JP2007258832A (ja) * 2006-03-20 2007-10-04 Kyocera Corp 弾性表面波素子、弾性表面波装置、弾性表面波装置の製造方法、通信装置、送信装置および受信装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09121138A (ja) * 1995-08-24 1997-05-06 Fujitsu Ltd フィルタ装置及びこれを用いた無線装置
DE10054968A1 (de) 2000-11-06 2002-05-08 Epcos Ag Frontend-Schaltung mit Duplexer für ein Kommunikationssystem

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05167389A (ja) * 1991-12-16 1993-07-02 Fujitsu Ltd 分波器
EP1076414A2 (fr) * 1999-08-11 2001-02-14 Fujitsu Media Devices Limited Dispositif à ondes acoustiques de surface pour montage à flip-chip
DE10317969A1 (de) * 2003-04-17 2004-11-18 Epcos Ag Duplexer mit erweiterter Funktionalität
EP1519485A1 (fr) * 2003-09-25 2005-03-30 Murata Manufacturing Co., Ltd. Demulitplexeur et dispositif de communication
EP1675262A2 (fr) * 2004-12-22 2006-06-28 Fujitsu Media Devices Limited Duplexeur
DE102005032058A1 (de) * 2005-07-08 2007-01-18 Epcos Ag HF-Filter mit verbesserter Gegenbandunterdrückung
US20070111674A1 (en) * 2005-11-15 2007-05-17 Fujitsu Media Devices Limited Duplexer
JP2007258832A (ja) * 2006-03-20 2007-10-04 Kyocera Corp 弾性表面波素子、弾性表面波装置、弾性表面波装置の製造方法、通信装置、送信装置および受信装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012013431A1 (fr) * 2010-07-29 2012-02-02 Epcos Ag Boîtier à puce retournée pour deux topologies de filtre

Also Published As

Publication number Publication date
DE102007019325B4 (de) 2008-12-24
DE102007019325A1 (de) 2008-11-06

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