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WO2008126559A1 - Film de polyimide - Google Patents

Film de polyimide Download PDF

Info

Publication number
WO2008126559A1
WO2008126559A1 PCT/JP2008/054363 JP2008054363W WO2008126559A1 WO 2008126559 A1 WO2008126559 A1 WO 2008126559A1 JP 2008054363 W JP2008054363 W JP 2008054363W WO 2008126559 A1 WO2008126559 A1 WO 2008126559A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyimide film
polyimide
group
thickness
general formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/054363
Other languages
English (en)
Japanese (ja)
Inventor
Yasuhiro Adachi
Hironori Nagaoka
Hongyuan Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Priority to JP2009508988A priority Critical patent/JP5249203B2/ja
Publication of WO2008126559A1 publication Critical patent/WO2008126559A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention porte sur un film de polyimide qui a d'excellentes propriétés de stabilité dimensionnelle, résistance à la chaleur et autres d'un polyimide, et peut présenter une excellente résistance à la déchirure même lorsque le film a une faible épaisseur. Le film de polyimide comprend un polyimide qui contient une unité constitutive représentée par la formule générale (1) dans une quantité de 60 % en moles ou plus, présente une valeur Z calculée conformément à la formule suivante : Z = Y/X1,5 [dans laquelle Y représente une valeur de résistance à la propagation de la déchirure (mN) ; et X représente une épaisseur (µm) du filmde polyimide] de 0,7 ou plus, présente une épaisseur de 5 à 40 µm et a un coefficient de dilatation thermique de 30 ppm/K ou moins. Dans la formule générale (1), Ar1 représente un groupe organique tétravalent ayant un ou plusieurs noyaux aromatiques ; et R représente un groupe alkyle inférieur ayant 1 à 6 atomes de carbone, un groupe alcoxy inférieur, un groupe phényle, un groupe phénoxy ou un halogène.
PCT/JP2008/054363 2007-03-30 2008-03-11 Film de polyimide Ceased WO2008126559A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009508988A JP5249203B2 (ja) 2007-03-30 2008-03-11 ポリイミドフィルム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-092730 2007-03-30
JP2007092730 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008126559A1 true WO2008126559A1 (fr) 2008-10-23

Family

ID=39863706

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054363 Ceased WO2008126559A1 (fr) 2007-03-30 2008-03-11 Film de polyimide

Country Status (3)

Country Link
JP (1) JP5249203B2 (fr)
TW (1) TWI422645B (fr)
WO (1) WO2008126559A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014058620A (ja) * 2012-09-18 2014-04-03 Du Pont-Toray Co Ltd タブレット端末向けｃｏｆ用基板
JP2017025214A (ja) * 2015-07-23 2017-02-02 大日本印刷株式会社 ポリイミド樹脂および積層体
JPWO2020067558A1 (ja) * 2018-09-29 2021-09-24 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5691996B2 (ja) * 2011-10-21 2015-04-01 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶表示素子

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001028767A1 (fr) * 1999-10-21 2001-04-26 Nippon Steel Chemical Co., Ltd. Lamelle et procede de production
JP2004322441A (ja) * 2003-04-24 2004-11-18 Nippon Steel Chem Co Ltd ポリイミドフィルムの製造方法
WO2005066242A1 (fr) * 2003-12-26 2005-07-21 Nippon Steel Chemical Co., Ltd. Acide de polyamide aromatique et polyimide
WO2005084088A1 (fr) * 2004-02-26 2005-09-09 Nippon Steel Chemical Co., Ltd. Stratifie pour tableau de connexion
JP2005314630A (ja) * 2004-03-30 2005-11-10 Nippon Steel Chem Co Ltd 芳香族ポリアミド酸及びポリイミド
JP2006117791A (ja) * 2004-10-21 2006-05-11 Nippon Steel Chem Co Ltd ポリイミドフィルムの製造方法
WO2006090658A1 (fr) * 2005-02-23 2006-08-31 Nippon Steel Chemical Co., Ltd. Stratifie pour panneau de cablage
JP2006269558A (ja) * 2005-03-22 2006-10-05 Nippon Steel Chem Co Ltd フレキシブル積層基板の製造方法
JP2006272626A (ja) * 2005-03-28 2006-10-12 Nippon Steel Chem Co Ltd フレキシブル積層基板の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001028767A1 (fr) * 1999-10-21 2001-04-26 Nippon Steel Chemical Co., Ltd. Lamelle et procede de production
JP2004322441A (ja) * 2003-04-24 2004-11-18 Nippon Steel Chem Co Ltd ポリイミドフィルムの製造方法
WO2005066242A1 (fr) * 2003-12-26 2005-07-21 Nippon Steel Chemical Co., Ltd. Acide de polyamide aromatique et polyimide
WO2005084088A1 (fr) * 2004-02-26 2005-09-09 Nippon Steel Chemical Co., Ltd. Stratifie pour tableau de connexion
JP2005314630A (ja) * 2004-03-30 2005-11-10 Nippon Steel Chem Co Ltd 芳香族ポリアミド酸及びポリイミド
JP2006117791A (ja) * 2004-10-21 2006-05-11 Nippon Steel Chem Co Ltd ポリイミドフィルムの製造方法
WO2006090658A1 (fr) * 2005-02-23 2006-08-31 Nippon Steel Chemical Co., Ltd. Stratifie pour panneau de cablage
JP2006269558A (ja) * 2005-03-22 2006-10-05 Nippon Steel Chem Co Ltd フレキシブル積層基板の製造方法
JP2006272626A (ja) * 2005-03-28 2006-10-12 Nippon Steel Chem Co Ltd フレキシブル積層基板の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014058620A (ja) * 2012-09-18 2014-04-03 Du Pont-Toray Co Ltd タブレット端末向けｃｏｆ用基板
JP2017025214A (ja) * 2015-07-23 2017-02-02 大日本印刷株式会社 ポリイミド樹脂および積層体
JPWO2020067558A1 (ja) * 2018-09-29 2021-09-24 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス

Also Published As

Publication number Publication date
TW200902627A (en) 2009-01-16
TWI422645B (zh) 2014-01-11
JP5249203B2 (ja) 2013-07-31
JPWO2008126559A1 (ja) 2010-07-22

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