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WO2008126455A1 - Photosensitive resin composition, photosensitive film, method for forming pattern by using the photosensitive film, and printed board - Google Patents

Photosensitive resin composition, photosensitive film, method for forming pattern by using the photosensitive film, and printed board Download PDF

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Publication number
WO2008126455A1
WO2008126455A1 PCT/JP2008/051805 JP2008051805W WO2008126455A1 WO 2008126455 A1 WO2008126455 A1 WO 2008126455A1 JP 2008051805 W JP2008051805 W JP 2008051805W WO 2008126455 A1 WO2008126455 A1 WO 2008126455A1
Authority
WO
WIPO (PCT)
Prior art keywords
photosensitive
photosensitive film
resin composition
printed board
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/051805
Other languages
French (fr)
Japanese (ja)
Inventor
Kimi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of WO2008126455A1 publication Critical patent/WO2008126455A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Disclosed is a photosensitive resin composition having good plating resistance, sensitivity, developability and adhesive force. Also disclosed are a photosensitive film, a method for forming a pattern using the photosensitive film, and a printed board. The photosensitive resin composition is characterized by containing a binder, a polymerizable compound, a photopolymerization initiator, an inorganic filler and an adhesion accelerator. The photosensitive film is characterized in that it is obtained by arranging a photosensitive layer, which is composed of the photosensitive resin composition, on a supporting body. The method for forming a pattern is characterized by comprising at least a step wherein the photosensitive layer of the photosensitive film is exposed to light. The printed board is characterized by having a permanent pattern formed by the pattern forming method.
PCT/JP2008/051805 2007-03-30 2008-02-05 Photosensitive resin composition, photosensitive film, method for forming pattern by using the photosensitive film, and printed board Ceased WO2008126455A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007095053A JP2010145425A (en) 2007-03-30 2007-03-30 Photosensitive resin composition, photosensitive film, method for forming pattern by using the photosensitive film, and printed board
JP2007-095053 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008126455A1 true WO2008126455A1 (en) 2008-10-23

Family

ID=39863613

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051805 Ceased WO2008126455A1 (en) 2007-03-30 2008-02-05 Photosensitive resin composition, photosensitive film, method for forming pattern by using the photosensitive film, and printed board

Country Status (4)

Country Link
JP (1) JP2010145425A (en)
KR (1) KR20100014433A (en)
CN (1) CN101652716A (en)
WO (1) WO2008126455A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040299A1 (en) * 2009-09-30 2011-04-07 富士フイルム株式会社 Photosensitive composition, photosensitive solder resist composition, photosensitive solder resist film, and permanent pattern, method for forming same, and printed substrate
CN102399352A (en) * 2010-09-15 2012-04-04 南开大学 Thermoplastic elastomer containing energy and its synthetic method

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2447773B1 (en) * 2010-11-02 2013-07-10 Fujifilm Corporation Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure
JP6348419B2 (en) * 2012-09-18 2018-06-27 旭化成株式会社 Photosensitive resin composition
KR101434659B1 (en) * 2012-10-15 2014-08-28 금호석유화학 주식회사 Photoacid generator and resist composition comprising same
KR101361623B1 (en) * 2012-10-15 2014-02-11 금호석유화학주식회사 Photoacid generator and resist composition comprising same
JP6495214B2 (en) * 2016-09-23 2019-04-03 株式会社タムラ製作所 Photosensitive resin composition
CN106768052B (en) * 2016-12-27 2023-12-15 江苏大学 Intelligent carbon fiber composite sensing element and manufacturing method thereof
CN118900505A (en) * 2024-08-14 2024-11-05 中山芯承半导体有限公司 A PCB laser drilling process

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0411261A (en) * 1990-04-27 1992-01-16 Mitsubishi Kasei Corp photosensitive composition
JPH05249670A (en) * 1992-03-05 1993-09-28 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using the same
JP2001235858A (en) * 1999-12-15 2001-08-31 Ciba Specialty Chem Holding Inc Photosensitive resin composition
JP2004272203A (en) * 2002-09-23 2004-09-30 E I Du Pont De Nemours & Co Halo-resistant photoimageable coverlay composition having advantageous application and removal property, and method relating to same
JP2005122048A (en) * 2003-10-20 2005-05-12 Mitsubishi Chemicals Corp Photocurable composition, and photocurable image forming material, photocurable image forming material, and image forming method using the same
JP2006251385A (en) * 2005-03-10 2006-09-21 Fuji Photo Film Co Ltd Pattern forming material, pattern forming apparatus and pattern forming method
JP2006285179A (en) * 2005-03-09 2006-10-19 Fuji Photo Film Co Ltd Photosensitive permanent resist film and permanent pattern forming method
JP2007003807A (en) * 2005-06-23 2007-01-11 Sumitomo Bakelite Co Ltd Photosensitive resin composition and solder resist using the composition
JP2007025176A (en) * 2005-07-14 2007-02-01 Fujifilm Holdings Corp Pattern forming material, pattern forming apparatus, and method for forming permanent pattern

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0411261A (en) * 1990-04-27 1992-01-16 Mitsubishi Kasei Corp photosensitive composition
JPH05249670A (en) * 1992-03-05 1993-09-28 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using the same
JP2001235858A (en) * 1999-12-15 2001-08-31 Ciba Specialty Chem Holding Inc Photosensitive resin composition
JP2004272203A (en) * 2002-09-23 2004-09-30 E I Du Pont De Nemours & Co Halo-resistant photoimageable coverlay composition having advantageous application and removal property, and method relating to same
JP2005122048A (en) * 2003-10-20 2005-05-12 Mitsubishi Chemicals Corp Photocurable composition, and photocurable image forming material, photocurable image forming material, and image forming method using the same
JP2006285179A (en) * 2005-03-09 2006-10-19 Fuji Photo Film Co Ltd Photosensitive permanent resist film and permanent pattern forming method
JP2006251385A (en) * 2005-03-10 2006-09-21 Fuji Photo Film Co Ltd Pattern forming material, pattern forming apparatus and pattern forming method
JP2007003807A (en) * 2005-06-23 2007-01-11 Sumitomo Bakelite Co Ltd Photosensitive resin composition and solder resist using the composition
JP2007025176A (en) * 2005-07-14 2007-02-01 Fujifilm Holdings Corp Pattern forming material, pattern forming apparatus, and method for forming permanent pattern

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040299A1 (en) * 2009-09-30 2011-04-07 富士フイルム株式会社 Photosensitive composition, photosensitive solder resist composition, photosensitive solder resist film, and permanent pattern, method for forming same, and printed substrate
JP2011095705A (en) * 2009-09-30 2011-05-12 Fujifilm Corp Photosensitive composition, photosensitive solder resist composition, photosensitive solder resist film, and permanent pattern, method for forming the same, and printed board
CN102399352A (en) * 2010-09-15 2012-04-04 南开大学 Thermoplastic elastomer containing energy and its synthetic method
CN102399352B (en) * 2010-09-15 2013-05-22 南开大学 A kind of energetic thermoplastic elastomer and its synthesis method

Also Published As

Publication number Publication date
KR20100014433A (en) 2010-02-10
JP2010145425A (en) 2010-07-01
CN101652716A (en) 2010-02-17

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