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WO2008126078A3 - System and method for generating a finite elements model of a pcb - Google Patents

System and method for generating a finite elements model of a pcb Download PDF

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Publication number
WO2008126078A3
WO2008126078A3 PCT/IL2008/000492 IL2008000492W WO2008126078A3 WO 2008126078 A3 WO2008126078 A3 WO 2008126078A3 IL 2008000492 W IL2008000492 W IL 2008000492W WO 2008126078 A3 WO2008126078 A3 WO 2008126078A3
Authority
WO
WIPO (PCT)
Prior art keywords
finite elements
components
board
pcb
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IL2008/000492
Other languages
French (fr)
Other versions
WO2008126078A2 (en
Inventor
Abraham Varon-Weinryb
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Expert Dynamics Ltd
Original Assignee
Expert Dynamics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Expert Dynamics Ltd filed Critical Expert Dynamics Ltd
Publication of WO2008126078A2 publication Critical patent/WO2008126078A2/en
Publication of WO2008126078A3 publication Critical patent/WO2008126078A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00—Details relating to the application field
    • G06F2113/18—Chip packaging

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Complex Calculations (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)

Abstract

The invention relates to a system for producing a finite elements model of a PCB assembly, which comprises: (a) finite elements components library which comprises a collection of finite elements data sets relating to various components existing in the market; (b) a PCB layout file which comprises at least the geometry of the board and a components list containing for each component on the board the identification of that component and the component exact location and orientation on the board; and (c) a finite elements model generator for: receiving said PCB layout file; based on said components list, extracting from the library for at least a portion of the components on the board, finite elements data sets, each data set corresponds to a component; and, given said geometry details of the board, said components list, and said components data sets as extracted from the library, generating by the finite elements model generator a finite elements meshed model of the PCB assembly.
PCT/IL2008/000492 2007-04-12 2008-04-10 System and method for generating a finite elements model of a pcb Ceased WO2008126078A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL182526A IL182526A0 (en) 2007-04-12 2007-04-12 System and method for generating a finite elements model
IL182526 2007-04-12

Publications (2)

Publication Number Publication Date
WO2008126078A2 WO2008126078A2 (en) 2008-10-23
WO2008126078A3 true WO2008126078A3 (en) 2009-06-11

Family

ID=39796850

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2008/000492 Ceased WO2008126078A2 (en) 2007-04-12 2008-04-10 System and method for generating a finite elements model of a pcb

Country Status (2)

Country Link
IL (1) IL182526A0 (en)
WO (1) WO2008126078A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107784142B (en) * 2016-08-31 2021-10-19 株洲中车时代半导体有限公司 Thermal simulation method of semiconductor power component

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5986481B2 (en) * 2012-11-05 2016-09-06 住友ゴム工業株式会社 How to create a simulation model
GB201520361D0 (en) * 2015-11-18 2015-12-30 Romax Technology Ltd Driveline modeller
CN109002592B (en) * 2018-06-26 2022-09-16 安徽理工大学 Full-automatic modeling method for random pitting pits in plate solid finite element model
CN111967214A (en) * 2020-08-14 2020-11-20 上海佳研实业有限公司 Software system capable of realizing printed circuit board aided design
CN117131832B (en) * 2023-10-23 2024-02-02 巨霖科技(上海)有限公司 Method and device for constructing simulation component and storage medium
CN118114353B (en) * 2024-04-30 2024-07-23 长江空间信息技术工程有限公司(武汉) Multi-time sequence FEA data dynamic visualization method and system for dam structure security

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0892331A2 (en) * 1997-07-18 1999-01-20 Fujitsu Limited Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnace
US20020144228A1 (en) * 2000-01-04 2002-10-03 Fujitsu Limited Method and apparatus for designing printed-circuit board
US20050289497A1 (en) * 2004-06-29 2005-12-29 Sharp Kabushiki Kaisha Layout designing/characteristic analyzing apparatus for a wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0892331A2 (en) * 1997-07-18 1999-01-20 Fujitsu Limited Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnace
US20020144228A1 (en) * 2000-01-04 2002-10-03 Fujitsu Limited Method and apparatus for designing printed-circuit board
US20050289497A1 (en) * 2004-06-29 2005-12-29 Sharp Kabushiki Kaisha Layout designing/characteristic analyzing apparatus for a wiring board

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
GODFREY W M ET AL: "Interactive thermal modeling of electronic circuit boards", IEEE TRANSACTIONS ON COMPONENTS, HYBRIDS, AND MANUFACTURING TECHNOLOGY USA, vol. 16, no. 8, December 1993 (1993-12-01), pages 978 - 985, XP002499938, ISSN: 0148-6411 *
KANG E ET AL: "Intelligent finite element mesh generation", ENGINEERING WITH COMPUTERS USA, vol. 11, no. 2, 1995, pages 70 - 82, XP002500377, ISSN: 0177-0667 *
ZHOU W X ET AL: "CAD-based analysis tools for electronic packaging design. (A new modeling methodology for a virtual development environment)", PRESENTED AT ADVANCES IN ELECTRONIC PACKAGING 1997, 15 June 1997 (1997-06-15) - 19 June 1997 (1997-06-19), pages 1 - 9, XP002499939, ISBN: 0-7918-1559-5 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107784142B (en) * 2016-08-31 2021-10-19 株洲中车时代半导体有限公司 Thermal simulation method of semiconductor power component

Also Published As

Publication number Publication date
WO2008126078A2 (en) 2008-10-23
IL182526A0 (en) 2007-09-20

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