WO2008114337A1 - Procédé de collage sous vide et dispositif de collage sous vide - Google Patents
Procédé de collage sous vide et dispositif de collage sous vide Download PDFInfo
- Publication number
- WO2008114337A1 WO2008114337A1 PCT/JP2007/053261 JP2007053261W WO2008114337A1 WO 2008114337 A1 WO2008114337 A1 WO 2008114337A1 JP 2007053261 W JP2007053261 W JP 2007053261W WO 2008114337 A1 WO2008114337 A1 WO 2008114337A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- work
- vacuum bonding
- removal
- separated
- planar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Fluid Mechanics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
La force de retrait et la charge électrostatique de retrait d'un travail sont réduites. Puisqu'un travail planaire (B) collé dans une chambre sous vide (S) est séparé d'une plaque de soutien (2) sous vide, aucune pression atmosphérique n'est appliquée sur les travaux planaires (A, B). Ainsi, le travail est séparé avec une force minime de retrait, et puisqu'une inégalité de minutes existe sur les surfaces de celui-ci et qu'elles ne se trouvent pas en contact étroit, la génération d'électricité statique incidente du retrait est modérée. Lorsque la chambre (S) est ultérieurement ouverte sur l'atmosphère dans l'état séparé, la génération d'électricité statique est retardée entre les travaux planaires (A, B) et les surfaces latérales de travail (1a, 2a) des plaques de soutien (1, 2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/053261 WO2008114337A1 (fr) | 2007-02-22 | 2007-02-22 | Procédé de collage sous vide et dispositif de collage sous vide |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/053261 WO2008114337A1 (fr) | 2007-02-22 | 2007-02-22 | Procédé de collage sous vide et dispositif de collage sous vide |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008114337A1 true WO2008114337A1 (fr) | 2008-09-25 |
Family
ID=39765459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/053261 Ceased WO2008114337A1 (fr) | 2007-02-22 | 2007-02-22 | Procédé de collage sous vide et dispositif de collage sous vide |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2008114337A1 (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011074274A1 (fr) * | 2009-12-18 | 2011-06-23 | 株式会社ニコン | Paire de supports de substrats, procédé de fabrication de dispositif, dispositif de séparation, procédé de séparation de substrats, support de substrat et dispositif de positionnement de substrat |
| CN104071571A (zh) * | 2014-04-15 | 2014-10-01 | 友达光电股份有限公司 | 操作装置及其操作方法 |
| KR20160093539A (ko) | 2013-12-04 | 2016-08-08 | 신에츠 엔지니어링 가부시키가이샤 | 첩합 디바이스의 제조 장치 |
| WO2016163137A1 (fr) * | 2015-04-09 | 2016-10-13 | 信越エンジニアリング株式会社 | Appareil pour fabriquer un dispositif de stratification |
| JP2018109473A (ja) * | 2017-01-05 | 2018-07-12 | 東レエンジニアリング株式会社 | 減圧乾燥装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003075343A1 (fr) * | 2002-03-05 | 2003-09-12 | Sharp Kabushiki Kaisha | Procede visant a maintenir un substrat sous vide, procede de fabrication d'un dispositif d'affichage a cristaux liquides, et dispositif de support de substrat |
| WO2005109489A1 (fr) * | 2004-05-07 | 2005-11-17 | Shin-Etsu Engineering Co., Ltd. | Procédé de neutralisation de pièce d’usinage et appareil pour ce procede |
| JP3882004B2 (ja) * | 2004-04-09 | 2007-02-14 | 信越エンジニアリング株式会社 | 粘着チャック装置 |
-
2007
- 2007-02-22 WO PCT/JP2007/053261 patent/WO2008114337A1/fr not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003075343A1 (fr) * | 2002-03-05 | 2003-09-12 | Sharp Kabushiki Kaisha | Procede visant a maintenir un substrat sous vide, procede de fabrication d'un dispositif d'affichage a cristaux liquides, et dispositif de support de substrat |
| JP3882004B2 (ja) * | 2004-04-09 | 2007-02-14 | 信越エンジニアリング株式会社 | 粘着チャック装置 |
| WO2005109489A1 (fr) * | 2004-05-07 | 2005-11-17 | Shin-Etsu Engineering Co., Ltd. | Procédé de neutralisation de pièce d’usinage et appareil pour ce procede |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011074274A1 (fr) * | 2009-12-18 | 2011-06-23 | 株式会社ニコン | Paire de supports de substrats, procédé de fabrication de dispositif, dispositif de séparation, procédé de séparation de substrats, support de substrat et dispositif de positionnement de substrat |
| KR20160093539A (ko) | 2013-12-04 | 2016-08-08 | 신에츠 엔지니어링 가부시키가이샤 | 첩합 디바이스의 제조 장치 |
| CN104071571A (zh) * | 2014-04-15 | 2014-10-01 | 友达光电股份有限公司 | 操作装置及其操作方法 |
| WO2016163137A1 (fr) * | 2015-04-09 | 2016-10-13 | 信越エンジニアリング株式会社 | Appareil pour fabriquer un dispositif de stratification |
| JPWO2016163137A1 (ja) * | 2015-04-09 | 2017-08-10 | 信越エンジニアリング株式会社 | 貼合デバイスの製造装置 |
| CN107428151A (zh) * | 2015-04-09 | 2017-12-01 | 信越工程株式会社 | 贴合设备的制造装置 |
| CN115284718A (zh) * | 2015-04-09 | 2022-11-04 | 信越工程株式会社 | 贴合设备的制造装置 |
| JP2018109473A (ja) * | 2017-01-05 | 2018-07-12 | 東レエンジニアリング株式会社 | 減圧乾燥装置 |
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