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WO2008111176A1 - 記憶媒体駆動装置およびプリント基板ユニット - Google Patents

記憶媒体駆動装置およびプリント基板ユニット Download PDF

Info

Publication number
WO2008111176A1
WO2008111176A1 PCT/JP2007/054971 JP2007054971W WO2008111176A1 WO 2008111176 A1 WO2008111176 A1 WO 2008111176A1 JP 2007054971 W JP2007054971 W JP 2007054971W WO 2008111176 A1 WO2008111176 A1 WO 2008111176A1
Authority
WO
WIPO (PCT)
Prior art keywords
opening
piece
printed board
storage medium
board unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/054971
Other languages
English (en)
French (fr)
Inventor
Shigeru Kagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to PCT/JP2007/054971 priority Critical patent/WO2008111176A1/ja
Priority to JP2009503817A priority patent/JPWO2008111176A1/ja
Publication of WO2008111176A1 publication Critical patent/WO2008111176A1/ja
Priority to US12/500,858 priority patent/US20090268417A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4833—Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4846—Constructional details of the electrical connection between arm and support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Moving Of Heads (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

　フレキシブルプリント基板（３２）の取り付けにあたって、ねじ（３５）は第１開口（６１）および第２開口（６２）を通ってベース（１３）にねじ込まれる。第１開口（６１）は第２開口（６２）の第２径よりも大きい第１径を有することから、上側片（４２）に対して下側片（４１）の相対変位は許容される。コネクタ（５３）が開口（５４）内で規定の位置からずれて配置されても、コネクタ（５３）のずれは下側片（４１）の変位で吸収される。しかも、下側片（４１）の相対変位にも拘わらず、ねじ（３５）および第２開口（６２）の働きで上側片（４２）はベース（１３）の規定の位置に正確に固定される。上側片（４２）に接続される可動片（３３）のテンションは設計通りに設定される。可動片（３３）の突っ張りや弛みは阻止される。可動片（３３）に連結されるキャリッジブロック（２２）は設計通りに回転することができる。
PCT/JP2007/054971 2007-03-13 2007-03-13 記憶媒体駆動装置およびプリント基板ユニット Ceased WO2008111176A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2007/054971 WO2008111176A1 (ja) 2007-03-13 2007-03-13 記憶媒体駆動装置およびプリント基板ユニット
JP2009503817A JPWO2008111176A1 (ja) 2007-03-13 2007-03-13 記憶媒体駆動装置およびプリント基板ユニット
US12/500,858 US20090268417A1 (en) 2007-03-13 2009-07-10 Storage apparatus and printed wiring board unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/054971 WO2008111176A1 (ja) 2007-03-13 2007-03-13 記憶媒体駆動装置およびプリント基板ユニット

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/500,858 Continuation US20090268417A1 (en) 2007-03-13 2009-07-10 Storage apparatus and printed wiring board unit

Publications (1)

Publication Number Publication Date
WO2008111176A1 true WO2008111176A1 (ja) 2008-09-18

Family

ID=39759127

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/054971 Ceased WO2008111176A1 (ja) 2007-03-13 2007-03-13 記憶媒体駆動装置およびプリント基板ユニット

Country Status (3)

Country Link
US (1) US20090268417A1 (ja)
JP (1) JPWO2008111176A1 (ja)
WO (1) WO2008111176A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8526141B2 (en) 2009-12-14 2013-09-03 HGST Netherlands B.V. Magnetic disk device and guide member for guiding a flexible wiring board

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6677674B2 (ja) 2017-05-19 2020-04-08 株式会社東芝 電子機器
CN114008768B (zh) * 2019-07-04 2025-04-01 松下知识产权经营株式会社 存储装置单元
US11074943B2 (en) * 2019-11-11 2021-07-27 Seagate Technology Llc Methods and devices for alleviating thermal boil off in immersion-cooled electronic devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252650A (ja) * 1999-02-25 2000-09-14 Fujitsu Ltd プリント配線基板ユニットおよび基板用矯正部品
JP2004095055A (ja) * 2002-08-30 2004-03-25 Toshiba Corp フレキシブル基板アッセンブリおよびディスク装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993010535A1 (en) * 1991-11-22 1993-05-27 Fujitsu Limited Disc device
JP2744889B2 (ja) * 1994-09-29 1998-04-28 インターナショナル・ビジネス・マシーンズ・コーポレイション 磁気ディスク装置のフレキシブルケーブル構造
DE69626598T2 (de) * 1995-11-02 2004-03-25 Fujitsu Ltd., Kawasaki Trägerstruktur für Plattenspeicher
JP2006049751A (ja) * 2004-08-09 2006-02-16 Hitachi Global Storage Technologies Netherlands Bv 磁気ディスク装置と、その配線接続構造及び端子構造
US20070169136A1 (en) * 2005-12-08 2007-07-19 Hiromichi Hiramatsu Optical disc drive apparatus, flexible printed circuit board joint structure, and joint structure of flexible printed circuit boards for optical pickup
JP2008287809A (ja) * 2007-05-18 2008-11-27 Fujitsu Ltd 記憶装置およびフレキシブルプリント基板ユニット
JP2009238271A (ja) * 2008-03-26 2009-10-15 Fujitsu Ltd ディスク装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252650A (ja) * 1999-02-25 2000-09-14 Fujitsu Ltd プリント配線基板ユニットおよび基板用矯正部品
JP2004095055A (ja) * 2002-08-30 2004-03-25 Toshiba Corp フレキシブル基板アッセンブリおよびディスク装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8526141B2 (en) 2009-12-14 2013-09-03 HGST Netherlands B.V. Magnetic disk device and guide member for guiding a flexible wiring board

Also Published As

Publication number Publication date
JPWO2008111176A1 (ja) 2010-06-24
US20090268417A1 (en) 2009-10-29

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