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WO2008108179A1 - Poudre d'étain, pâte d'étain et procédé de fabrication de poudre d'étain - Google Patents

Poudre d'étain, pâte d'étain et procédé de fabrication de poudre d'étain Download PDF

Info

Publication number
WO2008108179A1
WO2008108179A1 PCT/JP2008/052954 JP2008052954W WO2008108179A1 WO 2008108179 A1 WO2008108179 A1 WO 2008108179A1 JP 2008052954 W JP2008052954 W JP 2008052954W WO 2008108179 A1 WO2008108179 A1 WO 2008108179A1
Authority
WO
WIPO (PCT)
Prior art keywords
tin
tin powder
paste
powder
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/052954
Other languages
English (en)
Japanese (ja)
Inventor
Takuya Sasaki
Katsuhiko Yoshimaru
Takahiko Sakaue
Taku Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of WO2008108179A1 publication Critical patent/WO2008108179A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)

Abstract

L'invention concerne une poudre d'étain qui présente une excellente stabilité de forme lorsqu'elle est traitée en une pâte d'étain et a également une excellente stabilité de liaison, l'invention concernant également une pâte d'étain et un procédé de fabrication de poudre d'étain. La poudre d'étain est caractérisée par le fait que la particule a une forme de flocon, et un diamètre équivalent à celui d'un cercle moyen dans la direction plane de la particule est de 1 μm-10 μm. La pâte d'étain utilise une telle poudre d'étain. Au moment de la fabrication de la poudre d'étain, la poudre d'étain ayant une forme de particules est dispersée dans un milieu de dispersion, et le coulis dispersé est traité dans un broyeur de milieu.
PCT/JP2008/052954 2007-03-01 2008-02-21 Poudre d'étain, pâte d'étain et procédé de fabrication de poudre d'étain Ceased WO2008108179A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-051869 2007-03-01
JP2007051869A JP2008214678A (ja) 2007-03-01 2007-03-01 錫粉、錫ペースト及び錫粉の製造方法

Publications (1)

Publication Number Publication Date
WO2008108179A1 true WO2008108179A1 (fr) 2008-09-12

Family

ID=39738076

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052954 Ceased WO2008108179A1 (fr) 2007-03-01 2008-02-21 Poudre d'étain, pâte d'étain et procédé de fabrication de poudre d'étain

Country Status (3)

Country Link
JP (1) JP2008214678A (fr)
TW (1) TW200848181A (fr)
WO (1) WO2008108179A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111432980A (zh) * 2017-12-22 2020-07-17 积水化学工业株式会社 焊锡粒子、导电材料、焊锡粒子的保管方法、导电材料的保管方法、导电材料的制造方法、连接结构体以及连接结构体的制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5478193B2 (ja) * 2009-09-01 2014-04-23 Ｄｏｗａホールディングス株式会社 はんだ粉の製造方法
JP5756694B2 (ja) * 2011-07-07 2015-07-29 三井金属鉱業株式会社 扁平金属粒子
CN115709349A (zh) * 2021-08-20 2023-02-24 北京小米移动软件有限公司 锡粉、锡粉的制备方法、锡膏、电路板的焊接方法及电路板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005076058A (ja) * 2003-08-29 2005-03-24 Fukuda Metal Foil & Powder Co Ltd 片状金属粉末の製造方法
JP2006118032A (ja) * 2004-10-25 2006-05-11 Mitsui Mining & Smelting Co Ltd 銅酸化物コート層を備えたフレーク銅粉及び銅酸化物コート層を備えたフレーク銅粉の製造方法並びに銅酸化物コート層を備えたフレーク銅粉を含む導電性スラリー
JP2006307264A (ja) * 2005-04-27 2006-11-09 Mitsui Mining & Smelting Co Ltd スズ粉及びスズ粉の製造方法並びにスズ粉を含む導電性ペースト

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005076058A (ja) * 2003-08-29 2005-03-24 Fukuda Metal Foil & Powder Co Ltd 片状金属粉末の製造方法
JP2006118032A (ja) * 2004-10-25 2006-05-11 Mitsui Mining & Smelting Co Ltd 銅酸化物コート層を備えたフレーク銅粉及び銅酸化物コート層を備えたフレーク銅粉の製造方法並びに銅酸化物コート層を備えたフレーク銅粉を含む導電性スラリー
JP2006307264A (ja) * 2005-04-27 2006-11-09 Mitsui Mining & Smelting Co Ltd スズ粉及びスズ粉の製造方法並びにスズ粉を含む導電性ペースト

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111432980A (zh) * 2017-12-22 2020-07-17 积水化学工业株式会社 焊锡粒子、导电材料、焊锡粒子的保管方法、导电材料的保管方法、导电材料的制造方法、连接结构体以及连接结构体的制造方法

Also Published As

Publication number Publication date
TW200848181A (en) 2008-12-16
JP2008214678A (ja) 2008-09-18

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