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WO2008108146A1 - Porte-substrat électrostatique - Google Patents

Porte-substrat électrostatique Download PDF

Info

Publication number
WO2008108146A1
WO2008108146A1 PCT/JP2008/052408 JP2008052408W WO2008108146A1 WO 2008108146 A1 WO2008108146 A1 WO 2008108146A1 JP 2008052408 W JP2008052408 W JP 2008052408W WO 2008108146 A1 WO2008108146 A1 WO 2008108146A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
electrostatic chuck
polyimide
attraction
dielectric layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/052408
Other languages
English (en)
Japanese (ja)
Inventor
Yoshiaki Tatsumi
Kinya Miyashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Creative Technology Corp
Original Assignee
Creative Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Technology Corp filed Critical Creative Technology Corp
Priority to JP2009502492A priority Critical patent/JPWO2008108146A1/ja
Publication of WO2008108146A1 publication Critical patent/WO2008108146A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un porte-substrat électrostatique dont le plan d'attraction peut être remplacé, et comprenant une feuille de résine flexible remplaçable permettant d'améliorer l'adhérence sur un substrat tel qu'une tranche de silicium, retenu par attraction. Une électrode d'attraction (6) en cuivre, aluminium ou analogue, est placée entre les premières couches diélectriques isolantes (3,4) en résine telle que polyimide, ou en caoutchouc de silicone tel que ferrosilicone. Une seconde couche diélectrique (5) constituée d'une feuille de résine telle qu'une résine polyimide, est fixée sur la couche supérieure (4) des premières couches de diélectriques isolantes de façon à rendre possible son remplacement.
PCT/JP2008/052408 2007-03-01 2008-02-14 Porte-substrat électrostatique Ceased WO2008108146A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009502492A JPWO2008108146A1 (ja) 2007-03-01 2008-02-14 静電チャック

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007089383 2007-03-01
JP2007-089383 2007-03-01

Publications (1)

Publication Number Publication Date
WO2008108146A1 true WO2008108146A1 (fr) 2008-09-12

Family

ID=39738043

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052408 Ceased WO2008108146A1 (fr) 2007-03-01 2008-02-14 Porte-substrat électrostatique

Country Status (2)

Country Link
JP (1) JPWO2008108146A1 (fr)
WO (1) WO2008108146A1 (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010148177A (ja) * 2008-12-16 2010-07-01 Advanced Display Process Engineering Co Ltd 静電チャック及びそれを備えた基板合着装置
JP2012216691A (ja) * 2011-03-31 2012-11-08 Shibaura Mechatronics Corp 載置台およびプラズマ処理装置
JP2015536568A (ja) * 2012-11-02 2015-12-21 インテグリス・インコーポレーテッド 光パターン化可能な軟質突出部接触面を有する静電チャック
WO2018017192A1 (fr) 2016-07-22 2018-01-25 Applied Materials, Inc. Plaquette traitée en tant que plaque supérieure d'un support de pièce dans un traitement mécanique et de semi-conducteurs
CN109285806A (zh) * 2017-07-21 2019-01-29 株式会社迪思科 静电卡盘板的制造方法
CN109768008A (zh) * 2017-11-10 2019-05-17 Ｓｊ股份有限公司 静电吸盘的制造方法及静电吸盘
CN117052818A (zh) * 2023-08-09 2023-11-14 南京航空航天大学 面向冲击附着任务的大角度静电吸附柔顺缓冲装置
KR102632324B1 (ko) * 2023-11-09 2024-02-01 주식회사 이에스티 멀티레이어 탈거필름 구조를 포함하는 다중 레이어 정전척
KR102668954B1 (ko) * 2023-11-09 2024-05-24 주식회사 이에스티 효율적인 리페어구조를 포함하는 다중 레이어 정전척
KR102668953B1 (ko) * 2023-11-09 2024-05-24 주식회사 이에스티 정전척 지그 리페어 방법
KR102669549B1 (ko) * 2023-11-09 2024-05-27 주식회사 이에스티 탈거필름을 이용하는 정전척 지그 리페어 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101964631B1 (ko) * 2018-04-06 2019-04-02 (주)아폴로테크 완충력이 우수한 정전척

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11297805A (ja) * 1998-04-13 1999-10-29 Tomoegawa Paper Co Ltd 静電チャック装置、静電チャック用積層シート、および静電チャック用接着剤

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11297805A (ja) * 1998-04-13 1999-10-29 Tomoegawa Paper Co Ltd 静電チャック装置、静電チャック用積層シート、および静電チャック用接着剤

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010148177A (ja) * 2008-12-16 2010-07-01 Advanced Display Process Engineering Co Ltd 静電チャック及びそれを備えた基板合着装置
JP2012216691A (ja) * 2011-03-31 2012-11-08 Shibaura Mechatronics Corp 載置台およびプラズマ処理装置
JP2015536568A (ja) * 2012-11-02 2015-12-21 インテグリス・インコーポレーテッド 光パターン化可能な軟質突出部接触面を有する静電チャック
EP3488465A4 (fr) * 2016-07-22 2020-03-18 Applied Materials, Inc. Plaquette traitée en tant que plaque supérieure d'un support de pièce dans un traitement mécanique et de semi-conducteurs
WO2018017192A1 (fr) 2016-07-22 2018-01-25 Applied Materials, Inc. Plaquette traitée en tant que plaque supérieure d'un support de pièce dans un traitement mécanique et de semi-conducteurs
CN109478529A (zh) * 2016-07-22 2019-03-15 应用材料公司 作为半导体和机械处理中的工件载体的顶板的处理晶片
CN109285806B (zh) * 2017-07-21 2023-12-19 株式会社迪思科 静电卡盘板的制造方法
CN109285806A (zh) * 2017-07-21 2019-01-29 株式会社迪思科 静电卡盘板的制造方法
CN109768008A (zh) * 2017-11-10 2019-05-17 Ｓｊ股份有限公司 静电吸盘的制造方法及静电吸盘
CN117052818A (zh) * 2023-08-09 2023-11-14 南京航空航天大学 面向冲击附着任务的大角度静电吸附柔顺缓冲装置
KR102632324B1 (ko) * 2023-11-09 2024-02-01 주식회사 이에스티 멀티레이어 탈거필름 구조를 포함하는 다중 레이어 정전척
KR102668954B1 (ko) * 2023-11-09 2024-05-24 주식회사 이에스티 효율적인 리페어구조를 포함하는 다중 레이어 정전척
KR102668953B1 (ko) * 2023-11-09 2024-05-24 주식회사 이에스티 정전척 지그 리페어 방법
KR102669549B1 (ko) * 2023-11-09 2024-05-27 주식회사 이에스티 탈거필름을 이용하는 정전척 지그 리페어 방법

Also Published As

Publication number Publication date
JPWO2008108146A1 (ja) 2010-06-10

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