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WO2008108018A1 - 基板保持装置、ターゲット保持装置、及び真空成膜装置 - Google Patents

基板保持装置、ターゲット保持装置、及び真空成膜装置 Download PDF

Info

Publication number
WO2008108018A1
WO2008108018A1 PCT/JP2007/068894 JP2007068894W WO2008108018A1 WO 2008108018 A1 WO2008108018 A1 WO 2008108018A1 JP 2007068894 W JP2007068894 W JP 2007068894W WO 2008108018 A1 WO2008108018 A1 WO 2008108018A1
Authority
WO
WIPO (PCT)
Prior art keywords
holding device
vacuum film
forming apparatus
substrate holding
driving members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/068894
Other languages
English (en)
French (fr)
Inventor
Kouichi Nose
Koichi Sasagawa
Yasuhiro Koizumi
Yasukuni Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinmaywa Industries Ltd
Original Assignee
Shinmaywa Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2007/054412 external-priority patent/WO2007111097A1/ja
Application filed by Shinmaywa Industries Ltd filed Critical Shinmaywa Industries Ltd
Publication of WO2008108018A1 publication Critical patent/WO2008108018A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

　本発明の基板保持装置(10)は、真空成膜槽（1）に用いられる基板保持装置であって、前記真空成膜槽の外部に設けられた３以上の駆動源(14a，14b，14c)と、往復動自在な３以上の駆動部材(13a，13b，13c)と、該駆動部材のそれぞれに回動自在に支持され、側面視において実質的に平板状に形成された基板ホルダ(11)と、を備え、前記駆動源が、前記駆動部材を往復動させることにより、前記基板ホルダをその厚み方向に揺動させる。
PCT/JP2007/068894 2007-03-07 2007-09-27 基板保持装置、ターゲット保持装置、及び真空成膜装置 Ceased WO2008108018A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPPCT/JP2007/054412 2007-03-07
PCT/JP2007/054412 WO2007111097A1 (ja) 2006-03-27 2007-03-07 基材保持装置

Publications (1)

Publication Number Publication Date
WO2008108018A1 true WO2008108018A1 (ja) 2008-09-12

Family

ID=39790073

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/068894 Ceased WO2008108018A1 (ja) 2007-03-07 2007-09-27 基板保持装置、ターゲット保持装置、及び真空成膜装置

Country Status (1)

Country Link
WO (1) WO2008108018A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012057241A (ja) * 2010-09-13 2012-03-22 Kaneka Corp 蒸着装置
CN115398029A (zh) * 2020-09-17 2022-11-25 株式会社爱发科 溅射装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01164756U (ja) * 1988-04-30 1989-11-17
JPH01168551U (ja) * 1988-05-16 1989-11-28
JPH08199354A (ja) * 1995-01-30 1996-08-06 Aneruba Kk スパッタリングカソード
JPH0925574A (ja) * 1995-07-07 1997-01-28 Nissin Electric Co Ltd 基体保持装置
JP2004339547A (ja) * 2003-05-14 2004-12-02 Cyg Gijutsu Kenkyusho Kk スパッタ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01164756U (ja) * 1988-04-30 1989-11-17
JPH01168551U (ja) * 1988-05-16 1989-11-28
JPH08199354A (ja) * 1995-01-30 1996-08-06 Aneruba Kk スパッタリングカソード
JPH0925574A (ja) * 1995-07-07 1997-01-28 Nissin Electric Co Ltd 基体保持装置
JP2004339547A (ja) * 2003-05-14 2004-12-02 Cyg Gijutsu Kenkyusho Kk スパッタ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012057241A (ja) * 2010-09-13 2012-03-22 Kaneka Corp 蒸着装置
CN115398029A (zh) * 2020-09-17 2022-11-25 株式会社爱发科 溅射装置

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