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WO2008105245A1 - 発光部品およびその製造法 - Google Patents

発光部品およびその製造法 Download PDF

Info

Publication number
WO2008105245A1
WO2008105245A1 PCT/JP2008/052569 JP2008052569W WO2008105245A1 WO 2008105245 A1 WO2008105245 A1 WO 2008105245A1 JP 2008052569 W JP2008052569 W JP 2008052569W WO 2008105245 A1 WO2008105245 A1 WO 2008105245A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting component
resistor
led
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/052569
Other languages
English (en)
French (fr)
Inventor
Michiru Hatakenaka
Takeyoshi Oba
Toshiharu Takayama
Shizuo Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koa Corp
Original Assignee
Koa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007048805A external-priority patent/JP5268268B2/ja
Priority claimed from JP2007048795A external-priority patent/JP5268267B2/ja
Priority claimed from JP2007048797A external-priority patent/JP5483801B2/ja
Application filed by Koa Corp filed Critical Koa Corp
Priority to US12/449,738 priority Critical patent/US8405318B2/en
Publication of WO2008105245A1 publication Critical patent/WO2008105245A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/40—Resistors
    • H10D1/47—Resistors having no potential barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13062—Junction field-effect transistor [JFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

ＬＥＤ等の発光素子の光度のばらつきを低減すると共に、複数の発光素子を密に並べることのできる発光部品を提供する。発光部品１Ａは、光を発する発光素子（ＬＥＤ２）の光度が所定範囲となるよう抵抗値調整された抵抗素子３が基板の裏面に形成され、抵抗素子３と、トランジスタ５を構成要素とする定電流回路が、ＬＥＤ２に定電流を供給し、ＬＥＤ２、トランジスタ５は、単位絶縁基板５の表面に形成され、単位絶縁基板５は、長方形であり、その対向する１対の辺の長さをｘ、１対の辺とは異なるもう一方の対向する１対の辺の長さをｙとした場合、ｘ／ｙの比の値が１～１．２５である。またこの発光部品１Ａは、抵抗素子３を２個有し、２個の抵抗素子３の双方に対し、抵抗値調整（トリミング）が施されている。
PCT/JP2008/052569 2007-02-28 2008-02-15 発光部品およびその製造法 Ceased WO2008105245A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/449,738 US8405318B2 (en) 2007-02-28 2008-02-15 Light-emitting component and its manufacturing method

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007048805A JP5268268B2 (ja) 2007-02-28 2007-02-28 発光部品の製造法
JP2007048795A JP5268267B2 (ja) 2007-02-28 2007-02-28 発光部品およびその製造法
JP2007-048795 2007-02-28
JP2007048797A JP5483801B2 (ja) 2007-02-28 2007-02-28 発光部品
JP2007-048805 2007-02-28
JP2007-048797 2007-02-28

Publications (1)

Publication Number Publication Date
WO2008105245A1 true WO2008105245A1 (ja) 2008-09-04

Family

ID=39721082

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052569 Ceased WO2008105245A1 (ja) 2007-02-28 2008-02-15 発光部品およびその製造法

Country Status (2)

Country Link
US (1) US8405318B2 (ja)
WO (1) WO2008105245A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110006312A1 (en) * 2009-07-07 2011-01-13 Epistar Corporation Light-emitting device
CN102334201A (zh) * 2009-03-03 2012-01-25 夏普株式会社 发光装置、发光装置单元、以及发光装置制造方法
EP2290690A3 (en) * 2009-08-31 2014-02-19 LG Innotek Co., Ltd. Light emitting device
US9240526B2 (en) 2010-04-23 2016-01-19 Cree, Inc. Solid state light emitting diode packages with leadframes and ceramic material
WO2020026919A1 (ja) * 2018-07-31 2020-02-06 京セラ株式会社 セラミック部材
CN112449458A (zh) * 2019-09-05 2021-03-05 东芝泰格有限公司 Led驱动电路和驱动方法以及液体喷出观察装置和方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8319114B2 (en) * 2008-04-02 2012-11-27 Densel Lambda K.K. Surface mount power module dual footprint
WO2010070964A1 (ja) * 2008-12-16 2010-06-24 株式会社村田製作所 回路モジュール及びその管理方法
US10098197B2 (en) * 2011-06-03 2018-10-09 Cree, Inc. Lighting devices with individually compensating multi-color clusters
US10178723B2 (en) 2011-06-03 2019-01-08 Cree, Inc. Systems and methods for controlling solid state lighting devices and lighting apparatus incorporating such systems and/or methods
KR20130025718A (ko) * 2011-09-02 2013-03-12 삼성전자주식회사 엘이디 램프
US10043960B2 (en) 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
JP5288082B1 (ja) * 2011-11-28 2013-09-11 コニカミノルタ株式会社 発光モジュール
TWI481008B (zh) * 2012-11-22 2015-04-11 隆達電子股份有限公司 發光裝置
US9273995B2 (en) 2014-02-04 2016-03-01 Excelitas Technologies Philippines, Inc. Light emitting diode output power control
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
CN117316973A (zh) 2018-09-07 2023-12-29 株式会社半导体能源研究所 显示装置、显示模块及电子设备
US20210074880A1 (en) * 2018-12-18 2021-03-11 Bolb Inc. Light-output-power self-awareness light-emitting device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0263133A (ja) * 1988-08-29 1990-03-02 Fujitsu Ltd 発光ダイオードの輝度可変試験回路
JPH1154804A (ja) * 1997-07-30 1999-02-26 Rohm Co Ltd チップ型発光素子
JP2001272938A (ja) * 2000-03-28 2001-10-05 Sharp Corp 色調調整回路およびその回路を備えたバックライトモジュールおよび発光ダイオード表示装置
JP2005064445A (ja) * 2003-08-08 2005-03-10 Macroblock Inc 発光半導体パッケージ素子
JP2005252211A (ja) * 2004-03-05 2005-09-15 Nippon Precision Circuits Inc Ｌｅｄ輝度調整回路
JP2006237409A (ja) * 2005-02-28 2006-09-07 Citizen Electronics Co Ltd 発光ダイオード及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6636003B2 (en) * 2000-09-06 2003-10-21 Spectrum Kinetics Apparatus and method for adjusting the color temperature of white semiconduct or light emitters
JP4463024B2 (ja) * 2004-06-21 2010-05-12 シャープ株式会社 発光装置
JP2006100633A (ja) * 2004-09-30 2006-04-13 Toyoda Gosei Co Ltd Ｌｅｄ照明装置
EP1874097B1 (en) * 2006-06-28 2010-06-16 Osram Gesellschaft mit Beschränkter Haftung LED circuit with current control

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0263133A (ja) * 1988-08-29 1990-03-02 Fujitsu Ltd 発光ダイオードの輝度可変試験回路
JPH1154804A (ja) * 1997-07-30 1999-02-26 Rohm Co Ltd チップ型発光素子
JP2001272938A (ja) * 2000-03-28 2001-10-05 Sharp Corp 色調調整回路およびその回路を備えたバックライトモジュールおよび発光ダイオード表示装置
JP2005064445A (ja) * 2003-08-08 2005-03-10 Macroblock Inc 発光半導体パッケージ素子
JP2005252211A (ja) * 2004-03-05 2005-09-15 Nippon Precision Circuits Inc Ｌｅｄ輝度調整回路
JP2006237409A (ja) * 2005-02-28 2006-09-07 Citizen Electronics Co Ltd 発光ダイオード及びその製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102334201A (zh) * 2009-03-03 2012-01-25 夏普株式会社 发光装置、发光装置单元、以及发光装置制造方法
CN102334201B (zh) * 2009-03-03 2013-08-21 夏普株式会社 发光装置、发光装置单元、以及发光装置制造方法
US8575630B2 (en) 2009-03-03 2013-11-05 Sharp Kabushiki Kaisha Light emitting device, light emitting device unit, and method for fabricating light emitting device
US20110006312A1 (en) * 2009-07-07 2011-01-13 Epistar Corporation Light-emitting device
US8987017B2 (en) 2009-07-07 2015-03-24 Epistar Corporation Light-emitting device
EP2290690A3 (en) * 2009-08-31 2014-02-19 LG Innotek Co., Ltd. Light emitting device
US9240526B2 (en) 2010-04-23 2016-01-19 Cree, Inc. Solid state light emitting diode packages with leadframes and ceramic material
WO2020026919A1 (ja) * 2018-07-31 2020-02-06 京セラ株式会社 セラミック部材
JPWO2020026919A1 (ja) * 2018-07-31 2021-06-03 京セラ株式会社 セラミック部材
JP7101246B2 (ja) 2018-07-31 2022-07-14 京セラ株式会社 セラミック部材
CN112449458A (zh) * 2019-09-05 2021-03-05 东芝泰格有限公司 Led驱动电路和驱动方法以及液体喷出观察装置和方法

Also Published As

Publication number Publication date
US20100039044A1 (en) 2010-02-18
US8405318B2 (en) 2013-03-26

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