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WO2008102603A1 - Appareil de traitement de substrat et procédé de traitement de substrat - Google Patents

Appareil de traitement de substrat et procédé de traitement de substrat Download PDF

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Publication number
WO2008102603A1
WO2008102603A1 PCT/JP2008/051153 JP2008051153W WO2008102603A1 WO 2008102603 A1 WO2008102603 A1 WO 2008102603A1 JP 2008051153 W JP2008051153 W JP 2008051153W WO 2008102603 A1 WO2008102603 A1 WO 2008102603A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
substrate processing
transfer unit
processing apparatus
receives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/051153
Other languages
English (en)
Japanese (ja)
Inventor
Yuji Kamikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of WO2008102603A1 publication Critical patent/WO2008102603A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

L'invention concerne un appareil de traitement de substrat comportant un conteneur de traitement de substrat (30) ayant une chambre à l'intérieur pour stocker un substrat (W) devant être traité ; une première unité de transfert (40) qui reçoit et transfère le substrat (W) au conteneur de traitement de substrat (30) ; et une seconde unité de transfert qui reçoit et transfère le substrat (W) à la première unité de transfert (40) et reçoit le substrat (W) à partir de la première unité de transfert (40). La première unité de transfert (40) est d'un type sans contact et maintient le substrat (W) du dessus sans être en contact avec la surface supérieure du substrat (W). La seconde unité de transfert est d'un type à contact et maintient le substrat (W) en contact avec le substrat (W).
PCT/JP2008/051153 2007-02-23 2008-01-28 Appareil de traitement de substrat et procédé de traitement de substrat Ceased WO2008102603A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-043918 2007-02-23
JP2007043918A JP2010114101A (ja) 2007-02-23 2007-02-23 基板処理装置および基板処理方法

Publications (1)

Publication Number Publication Date
WO2008102603A1 true WO2008102603A1 (fr) 2008-08-28

Family

ID=39709882

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051153 Ceased WO2008102603A1 (fr) 2007-02-23 2008-01-28 Appareil de traitement de substrat et procédé de traitement de substrat

Country Status (2)

Country Link
JP (1) JP2010114101A (fr)
WO (1) WO2008102603A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9330898B2 (en) 2010-08-23 2016-05-03 Tokyo Electron Limited Separation system, separation method, program and computer storage medium
EP3655352A4 (fr) * 2017-07-21 2021-04-21 Electro Scientific Industries, Inc. Manipulateur sans contact et procédé de manipulation de pièces utilisant celui-ci

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012238762A (ja) * 2011-05-12 2012-12-06 Tokyo Electron Ltd 基板搬送装置、これを備える塗布現像装置、及び基板搬送方法
JP2013004845A (ja) * 2011-06-20 2013-01-07 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP6161061B2 (ja) * 2013-04-04 2017-07-12 サムコ株式会社 ワーク搬送装置
KR101987822B1 (ko) * 2017-07-05 2019-06-12 (주)소닉스 디스플레이모듈에 관련된 검사대상물을 검사하기 위한 인라인 검사시스템

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071702A (ja) * 2002-08-02 2004-03-04 Toshiba Ceramics Co Ltd 半導体ウェーハ枚葉洗浄装置
JP2005011917A (ja) * 2003-06-18 2005-01-13 Disco Abrasive Syst Ltd 半導体ウエーハの加工装置
JP2005340522A (ja) * 2004-05-27 2005-12-08 Shin Etsu Handotai Co Ltd ベルヌーイチャック

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071702A (ja) * 2002-08-02 2004-03-04 Toshiba Ceramics Co Ltd 半導体ウェーハ枚葉洗浄装置
JP2005011917A (ja) * 2003-06-18 2005-01-13 Disco Abrasive Syst Ltd 半導体ウエーハの加工装置
JP2005340522A (ja) * 2004-05-27 2005-12-08 Shin Etsu Handotai Co Ltd ベルヌーイチャック

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9330898B2 (en) 2010-08-23 2016-05-03 Tokyo Electron Limited Separation system, separation method, program and computer storage medium
EP3655352A4 (fr) * 2017-07-21 2021-04-21 Electro Scientific Industries, Inc. Manipulateur sans contact et procédé de manipulation de pièces utilisant celui-ci
US11254014B2 (en) 2017-07-21 2022-02-22 Electro Scientific Industries, Inc. Non-contact handler and method of handling workpieces using the same

Also Published As

Publication number Publication date
JP2010114101A (ja) 2010-05-20

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