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WO2008153128A1 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
WO2008153128A1
WO2008153128A1 PCT/JP2008/060844 JP2008060844W WO2008153128A1 WO 2008153128 A1 WO2008153128 A1 WO 2008153128A1 JP 2008060844 W JP2008060844 W JP 2008060844W WO 2008153128 A1 WO2008153128 A1 WO 2008153128A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode pad
semiconductor device
pad portion
barrier metal
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/060844
Other languages
English (en)
French (fr)
Inventor
Tadahiro Morifuji
Shigeyuki Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007159351A external-priority patent/JP5280650B2/ja
Priority claimed from JP2007159354A external-priority patent/JP5243734B2/ja
Priority to CN2008800202805A priority Critical patent/CN101681859B/zh
Priority to US12/663,563 priority patent/US8436467B2/en
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of WO2008153128A1 publication Critical patent/WO2008153128A1/ja
Anticipated expiration legal-status Critical
Priority to US13/856,905 priority patent/US8922010B2/en
Priority to US14/337,959 priority patent/US9053991B2/en
Priority to US14/491,556 priority patent/US9123628B2/en
Priority to US14/803,207 priority patent/US9466583B2/en
Priority to US15/219,912 priority patent/US9685419B2/en
Priority to US15/591,456 priority patent/US10032739B2/en
Priority to US16/018,128 priority patent/US10510700B2/en
Priority to US16/683,647 priority patent/US11037897B2/en
Ceased legal-status Critical Current

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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)

Abstract

　信頼性の低下を抑制することが可能な半導体装置を提供する。この半導体装置は、半導体基板（１）の上面上に形成された電極パッド部（２）と、電極パッド部（２）の上面を露出させる第１開口部（３ａ）を含み、半導体基板（１）の上面上に、電極パッド部（２）の一部と重なるように形成されたパッシベーション層（３）と、電極パッド部（２）上に形成されたバリアメタル層（５）と、バリアメタル層（５）上に形成された半田バンプ（６）とを備えている。そして、バリアメタル層（５）は、平面的に見て、外周端部（５ｂ）がパッシベーション層（３）の第１開口部（３ａ）の内側に位置するように形成されている。
PCT/JP2008/060844 2007-06-15 2008-06-13 半導体装置 Ceased WO2008153128A1 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
CN2008800202805A CN101681859B (zh) 2007-06-15 2008-06-13 半导体器件
US12/663,563 US8436467B2 (en) 2007-06-15 2008-06-13 Semiconductor device
US13/856,905 US8922010B2 (en) 2007-06-15 2013-04-04 Semiconductor device
US14/337,959 US9053991B2 (en) 2007-06-15 2014-07-22 Semiconductor device
US14/491,556 US9123628B2 (en) 2007-06-15 2014-09-19 Semiconductor device
US14/803,207 US9466583B2 (en) 2007-06-15 2015-07-20 Semiconductor device
US15/219,912 US9685419B2 (en) 2007-06-15 2016-07-26 Semiconductor device
US15/591,456 US10032739B2 (en) 2007-06-15 2017-05-10 Semiconductor device
US16/018,128 US10510700B2 (en) 2007-06-15 2018-06-26 Semiconductor device
US16/683,647 US11037897B2 (en) 2007-06-15 2019-11-14 Semiconductor device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007159354A JP5243734B2 (ja) 2007-06-15 2007-06-15 半導体装置
JP2007159351A JP5280650B2 (ja) 2007-06-15 2007-06-15 半導体装置
JP2007-159354 2007-06-15
JP2007-159351 2007-06-15

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US12/663,563 A-371-Of-International US8436467B2 (en) 2007-06-15 2008-06-13 Semiconductor device
US13/856,905 Division US8922010B2 (en) 2007-06-15 2013-04-04 Semiconductor device

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US10032739B2 (en) 2018-07-24
US8436467B2 (en) 2013-05-07
US20180301429A1 (en) 2018-10-18
US20140332954A1 (en) 2014-11-13
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US20200098713A1 (en) 2020-03-26
US9123628B2 (en) 2015-09-01
US20150325541A1 (en) 2015-11-12
CN101681859A (zh) 2010-03-24
US20130256881A1 (en) 2013-10-03
CN101681859B (zh) 2011-10-19
US8922010B2 (en) 2014-12-30
US20150021765A1 (en) 2015-01-22
US9053991B2 (en) 2015-06-09
US10510700B2 (en) 2019-12-17
US9466583B2 (en) 2016-10-11
US11037897B2 (en) 2021-06-15
US20160336288A1 (en) 2016-11-17

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