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WO2008149853A1 - 環境制御装置、ステージ装置、露光装置、及びデバイス製造方法 - Google Patents

環境制御装置、ステージ装置、露光装置、及びデバイス製造方法 Download PDF

Info

Publication number
WO2008149853A1
WO2008149853A1 PCT/JP2008/060201 JP2008060201W WO2008149853A1 WO 2008149853 A1 WO2008149853 A1 WO 2008149853A1 JP 2008060201 W JP2008060201 W JP 2008060201W WO 2008149853 A1 WO2008149853 A1 WO 2008149853A1
Authority
WO
WIPO (PCT)
Prior art keywords
environment control
production method
device production
opening
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/060201
Other languages
English (en)
French (fr)
Inventor
Yoichi Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of WO2008149853A1 publication Critical patent/WO2008149853A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Details Of Measuring And Other Instruments (AREA)

Abstract

　環境制御装置は、第１空間を形成するとともに、少なくとも一部に形成された第１開口と第１開口の周囲に設けられた第１面とを有する第１部材と、第１開口を覆うように配置され、第１面と対向する第２面を有し、第１面にガイドされつつ第１開口との間で相対運動が可能な可動部材とを備え、第１面と第２面との間にガスシール機構が形成され、第１空間を所定状態に設定可能である。
PCT/JP2008/060201 2007-06-04 2008-06-03 環境制御装置、ステージ装置、露光装置、及びデバイス製造方法 Ceased WO2008149853A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-148051 2007-06-04
JP2007148051 2007-06-04

Publications (1)

Publication Number Publication Date
WO2008149853A1 true WO2008149853A1 (ja) 2008-12-11

Family

ID=40093669

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060201 Ceased WO2008149853A1 (ja) 2007-06-04 2008-06-03 環境制御装置、ステージ装置、露光装置、及びデバイス製造方法

Country Status (3)

Country Link
US (1) US20090015806A1 (ja)
TW (1) TW200907597A (ja)
WO (1) WO2008149853A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0817709A (ja) * 1994-06-29 1996-01-19 Jeol Ltd 荷電粒子ビーム装置
JP2005064391A (ja) * 2003-08-19 2005-03-10 Canon Inc 光学部材の冷却方法、冷却装置、露光装置、及び、デバイスの製造方法
JP2006032953A (ja) * 2004-07-12 2006-02-02 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
JP2006049815A (ja) * 2004-07-02 2006-02-16 Canon Inc 露光装置
JP2006100363A (ja) * 2004-09-28 2006-04-13 Canon Inc 露光装置、露光方法、及びデバイス製造方法。
JP2006269762A (ja) * 2005-03-24 2006-10-05 Nikon Corp 露光装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559584A (en) * 1993-03-08 1996-09-24 Nikon Corporation Exposure apparatus
US6246204B1 (en) * 1994-06-27 2001-06-12 Nikon Corporation Electromagnetic alignment and scanning apparatus
WO1998024115A1 (en) * 1996-11-28 1998-06-04 Nikon Corporation Aligner and method for exposure
USRE40043E1 (en) * 1997-03-10 2008-02-05 Asml Netherlands B.V. Positioning device having two object holders
AU7552498A (en) * 1997-06-10 1998-12-30 Nikon Corporation Optical device, method of cleaning the same, projection aligner, and method of producing the same
US6897963B1 (en) * 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
US6208407B1 (en) * 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
JP2000286189A (ja) * 1999-03-31 2000-10-13 Nikon Corp 露光装置および露光方法ならびにデバイス製造方法
TWI242112B (en) * 1999-04-19 2005-10-21 Asml Netherlands Bv Lithographic projection apparatus and method of operating a lithographic projection apparatus
TWI233535B (en) * 1999-04-19 2005-06-01 Asml Netherlands Bv Motion feed-through into a vacuum chamber and its application in lithographic projection apparatuses
JP2002151400A (ja) * 2000-11-15 2002-05-24 Canon Inc 露光装置、その保守方法並びに同装置を用いた半導体デバイス製造方法及び半導体製造工場
US6611316B2 (en) * 2001-02-27 2003-08-26 Asml Holding N.V. Method and system for dual reticle image exposure
EP1256844A1 (en) * 2001-05-09 2002-11-13 ASML Netherlands B.V. Lithographic apparatus
US6600547B2 (en) * 2001-09-24 2003-07-29 Nikon Corporation Sliding seal
JP4136363B2 (ja) * 2001-11-29 2008-08-20 キヤノン株式会社 位置決め装置及びそれを用いた露光装置
TWI338323B (en) * 2003-02-17 2011-03-01 Nikon Corp Stage device, exposure device and manufacguring method of devices
JP2005129898A (ja) * 2003-09-29 2005-05-19 Canon Inc 露光装置およびデバイス製造方法
JPWO2006068233A1 (ja) * 2004-12-24 2008-06-12 株式会社ニコン 磁気案内装置、ステージ装置、露光装置、及びデバイスの製造方法
JP2006269942A (ja) * 2005-03-25 2006-10-05 Canon Inc 露光装置及びデバイス製造方法
EP2068349A4 (en) * 2006-09-29 2011-03-30 Nikon Corp STAGE EQUIPMENT AND EXPOSURE DEVICE

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0817709A (ja) * 1994-06-29 1996-01-19 Jeol Ltd 荷電粒子ビーム装置
JP2005064391A (ja) * 2003-08-19 2005-03-10 Canon Inc 光学部材の冷却方法、冷却装置、露光装置、及び、デバイスの製造方法
JP2006049815A (ja) * 2004-07-02 2006-02-16 Canon Inc 露光装置
JP2006032953A (ja) * 2004-07-12 2006-02-02 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
JP2006100363A (ja) * 2004-09-28 2006-04-13 Canon Inc 露光装置、露光方法、及びデバイス製造方法。
JP2006269762A (ja) * 2005-03-24 2006-10-05 Nikon Corp 露光装置

Also Published As

Publication number Publication date
TW200907597A (en) 2009-02-16
US20090015806A1 (en) 2009-01-15

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