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WO2008149570A1 - 音響センサ - Google Patents

音響センサ Download PDF

Info

Publication number
WO2008149570A1
WO2008149570A1 PCT/JP2008/051398 JP2008051398W WO2008149570A1 WO 2008149570 A1 WO2008149570 A1 WO 2008149570A1 JP 2008051398 W JP2008051398 W JP 2008051398W WO 2008149570 A1 WO2008149570 A1 WO 2008149570A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode plate
counter electrode
vibrating electrode
vibrating
projections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/051398
Other languages
English (en)
French (fr)
Inventor
Takashi Kasai
Kazutoshi Wakao
Takeshi Matsuo
Takayoshi Onishi
Akane Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Priority to CN2008800229687A priority Critical patent/CN101690263B/zh
Priority to KR1020097025286A priority patent/KR101101483B1/ko
Priority to EP08710642.3A priority patent/EP2164280B1/en
Priority to US12/663,130 priority patent/US8379887B2/en
Publication of WO2008149570A1 publication Critical patent/WO2008149570A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H3/00Measuring characteristics of vibrations by using a detector in a fluid
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

音圧に感応する振動電極板24が対向電極板25に対向し、静電容量型の音響センサが構成される。対向電極板25には、振動を通過させるための音響孔31が開口し、また振動電極板24と対向する面には複数の突起36が突設する。振動電極板24の柔軟性が高くて対向電極板25に局所スティックしやすい領域では、突起36どうしの間隔を小さくしている。また、振動電極板24の柔軟性が低くて対向電極板25に局所スティックしにくい領域では、突起36どうしの間隔を大きくしている。このような突起の配置により、振動電極板が対向電極板に固着して振動電極板の振動が妨げられるのを防ぐ。
PCT/JP2008/051398 2007-06-04 2008-01-30 音響センサ Ceased WO2008149570A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800229687A CN101690263B (zh) 2007-06-04 2008-01-30 音响传感器
KR1020097025286A KR101101483B1 (ko) 2007-06-04 2008-01-30 음향 센서
EP08710642.3A EP2164280B1 (en) 2007-06-04 2008-01-30 Acoustic sensor
US12/663,130 US8379887B2 (en) 2007-06-04 2008-01-30 Acoustic sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-148433 2007-06-04
JP2007148433A JP5029147B2 (ja) 2007-06-04 2007-06-04 音響センサ

Publications (1)

Publication Number Publication Date
WO2008149570A1 true WO2008149570A1 (ja) 2008-12-11

Family

ID=40093399

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051398 Ceased WO2008149570A1 (ja) 2007-06-04 2008-01-30 音響センサ

Country Status (6)

Country Link
US (1) US8379887B2 (ja)
EP (1) EP2164280B1 (ja)
JP (1) JP5029147B2 (ja)
KR (1) KR101101483B1 (ja)
CN (1) CN101690263B (ja)
WO (1) WO2008149570A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5454345B2 (ja) * 2010-05-11 2014-03-26 オムロン株式会社 音響センサ及びその製造方法
JP5402823B2 (ja) * 2010-05-13 2014-01-29 オムロン株式会社 音響センサ
TWI416388B (zh) * 2010-09-01 2013-11-21 Au Optronics Corp 具有力回饋功能之觸控裝置
KR200460138Y1 (ko) * 2011-06-14 2012-05-09 조진철 중량선별기의 선별조립체
US8625823B2 (en) 2011-07-12 2014-01-07 Robert Bosch Gmbh MEMS microphone overtravel stop structure
US8979021B2 (en) * 2011-10-17 2015-03-17 Easton Corporation Hydraulic air bleed valve system
JP5177309B1 (ja) * 2012-01-31 2013-04-03 オムロン株式会社 静電容量型センサ
US8983097B2 (en) 2012-02-29 2015-03-17 Infineon Technologies Ag Adjustable ventilation openings in MEMS structures
WO2014100012A1 (en) * 2012-12-20 2014-06-26 The Regents Of The University Of California Electrostatic graphene speaker
US9448126B2 (en) * 2014-03-06 2016-09-20 Infineon Technologies Ag Single diaphragm transducer structure
JP6264969B2 (ja) 2014-03-14 2018-01-24 オムロン株式会社 音響トランスデューサ
JP6252767B2 (ja) * 2014-03-14 2017-12-27 オムロン株式会社 静電容量型トランスデューサ
JP6311375B2 (ja) * 2014-03-14 2018-04-18 オムロン株式会社 静電容量型トランスデューサ
US9369804B2 (en) 2014-07-28 2016-06-14 Robert Bosch Gmbh MEMS membrane overtravel stop
JP6604626B2 (ja) * 2015-08-21 2019-11-13 国立大学法人東北大学 検出装置
US10067092B2 (en) 2015-12-18 2018-09-04 Mueller International, Llc Noisemaker for pipe systems
US10267774B2 (en) * 2016-02-29 2019-04-23 Mueller International, Llc External noisemaker for pipe systems
KR102371228B1 (ko) * 2016-11-24 2022-03-04 현대자동차 주식회사 마이크로폰 및 이의 제조방법
US11228844B2 (en) 2017-05-18 2022-01-18 The Johns Hopkins University Push-pull electret transducer with controlled restoring force for low frequency microphones and energy harvesting
CN109704271A (zh) * 2017-10-26 2019-05-03 中芯国际集成电路制造(上海)有限公司 一种mems器件及制备方法、电子装置
US11237043B2 (en) 2018-08-17 2022-02-01 Invensense, Inc. Stress reduced diaphragm for a micro-electro-mechanical system sensor
US11197104B2 (en) * 2019-01-25 2021-12-07 Knowles Electronics, Llc MEMS transducer including free plate diaphragm with spring members
EP3708532B1 (en) * 2019-03-15 2024-09-25 Infineon Technologies AG Mems device and method for producing the same
US12356170B2 (en) 2020-07-07 2025-07-08 Dolby Laboratories Licensing Corporation Transducer assembly and associated signal processing
US11726064B2 (en) 2020-07-22 2023-08-15 Mueller International Llc Acoustic pipe condition assessment using coherent averaging
US11609348B2 (en) 2020-12-29 2023-03-21 Mueller International, Llc High-resolution acoustic pipe condition assessment using in-bracket pipe excitation
US12269732B2 (en) * 2021-06-11 2025-04-08 Fortemedia, Inc. MEMS microphone
CN116210232A (zh) * 2021-07-16 2023-06-02 深圳市韶音科技有限公司 传感装置
US12196714B2 (en) 2021-07-19 2025-01-14 Mueller International, Llc Acoustic pipeline condition assessment at resolution down to pipe stick

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08111535A (ja) * 1994-08-18 1996-04-30 Nippondenso Co Ltd 半導体力学量センサ及びその製造方法
JPH0918021A (ja) * 1995-06-29 1997-01-17 Nippondenso Co Ltd 半導体力学量センサ及びその製造方法
JP2004506394A (ja) * 2000-08-11 2004-02-26 ノールズ エレクトロニクス,リミテッド ライアビリティ カンパニー 小型ブロードバンド変換器
JP2004096543A (ja) * 2002-09-02 2004-03-25 Sumitomo Metal Ind Ltd 音響検出機構
JP2004128957A (ja) * 2002-10-03 2004-04-22 Sumitomo Metal Ind Ltd 音響検出機構
WO2006049100A1 (ja) * 2004-11-04 2006-05-11 Omron Corporation 容量型振動センサ及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6958255B2 (en) * 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
DE10247487A1 (de) * 2002-10-11 2004-05-06 Infineon Technologies Ag Membran und Verfahren zu deren Herstellung
US20060004289A1 (en) * 2004-06-30 2006-01-05 Wei-Cheng Tian High sensitivity capacitive micromachined ultrasound transducer
US7961897B2 (en) * 2005-08-23 2011-06-14 Analog Devices, Inc. Microphone with irregular diaphragm
TWI293851B (en) * 2005-12-30 2008-02-21 Ind Tech Res Inst Capacitive microphone and method for making the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08111535A (ja) * 1994-08-18 1996-04-30 Nippondenso Co Ltd 半導体力学量センサ及びその製造方法
JPH0918021A (ja) * 1995-06-29 1997-01-17 Nippondenso Co Ltd 半導体力学量センサ及びその製造方法
JP2004506394A (ja) * 2000-08-11 2004-02-26 ノールズ エレクトロニクス,リミテッド ライアビリティ カンパニー 小型ブロードバンド変換器
JP2004096543A (ja) * 2002-09-02 2004-03-25 Sumitomo Metal Ind Ltd 音響検出機構
JP2004128957A (ja) * 2002-10-03 2004-04-22 Sumitomo Metal Ind Ltd 音響検出機構
WO2006049100A1 (ja) * 2004-11-04 2006-05-11 Omron Corporation 容量型振動センサ及びその製造方法

Also Published As

Publication number Publication date
KR20100006164A (ko) 2010-01-18
JP2008301430A (ja) 2008-12-11
JP5029147B2 (ja) 2012-09-19
EP2164280A4 (en) 2014-02-19
EP2164280B1 (en) 2017-11-01
CN101690263A (zh) 2010-03-31
CN101690263B (zh) 2013-03-20
US20100175477A1 (en) 2010-07-15
EP2164280A1 (en) 2010-03-17
KR101101483B1 (ko) 2012-01-03
US8379887B2 (en) 2013-02-19

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