[go: up one dir, main page]

WO2008143259A1 - スリットコータ - Google Patents

スリットコータ Download PDF

Info

Publication number
WO2008143259A1
WO2008143259A1 PCT/JP2008/059247 JP2008059247W WO2008143259A1 WO 2008143259 A1 WO2008143259 A1 WO 2008143259A1 JP 2008059247 W JP2008059247 W JP 2008059247W WO 2008143259 A1 WO2008143259 A1 WO 2008143259A1
Authority
WO
WIPO (PCT)
Prior art keywords
transfer
work
transfer path
slit coater
transferring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/059247
Other languages
English (en)
French (fr)
Inventor
Akira Uehara
Masayuki Toda
Masaru Umeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Watanabe Shoko KK
M Watanabe and Co Ltd
Original Assignee
Watanabe Shoko KK
M Watanabe and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Watanabe Shoko KK, M Watanabe and Co Ltd filed Critical Watanabe Shoko KK
Publication of WO2008143259A1 publication Critical patent/WO2008143259A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Manipulator (AREA)

Abstract

　ワーク受け渡し用の接触式搬送ロボットアームを用いることなく、一連の製造工程における搬送経路上もしくは搬送経路に隣接して表面処理工程を行うことができるスリットコータを提供する。 ワークＷの搬送経路の一部を構成する浮上搬送部兼表面処理部としての浮上搬送フレーム１０２にワークＷが直接搬送されるため、ワークＷの受け渡し用の接触式搬送ロボットアームを用いることなく、一連の製造工程における搬送経路上もしくは搬送経路に隣接して表面処理工程を行う。
PCT/JP2008/059247 2007-05-22 2008-05-20 スリットコータ Ceased WO2008143259A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-135980 2007-05-22
JP2007135980A JP2008289966A (ja) 2007-05-22 2007-05-22 スリットコータ

Publications (1)

Publication Number Publication Date
WO2008143259A1 true WO2008143259A1 (ja) 2008-11-27

Family

ID=40031955

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059247 Ceased WO2008143259A1 (ja) 2007-05-22 2008-05-20 スリットコータ

Country Status (2)

Country Link
JP (1) JP2008289966A (ja)
WO (1) WO2008143259A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113365741A (zh) * 2019-02-25 2021-09-07 东丽工程株式会社 涂布装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108480140A (zh) * 2018-05-30 2018-09-04 青岛北洋天青数联智能股份有限公司 干衣机门体涂胶设备及其涂胶工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198657A (ja) * 1992-01-23 1993-08-06 Hitachi Ltd 基板搬送装置
JP2002346463A (ja) * 2001-05-24 2002-12-03 Toppan Printing Co Ltd 単板塗布装置
JP2003037145A (ja) * 2001-07-23 2003-02-07 Nec Kansai Ltd ウエハ搬送装置
WO2006003876A1 (ja) * 2004-06-30 2006-01-12 Hirata Corporation 基板塗布装置
JP2006281091A (ja) * 2005-03-31 2006-10-19 Toray Eng Co Ltd 塗布装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI226303B (en) * 2002-04-18 2005-01-11 Olympus Corp Substrate carrying device
JP2006186251A (ja) * 2004-12-28 2006-07-13 Kumamoto Technology & Industry Foundation 塗布装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198657A (ja) * 1992-01-23 1993-08-06 Hitachi Ltd 基板搬送装置
JP2002346463A (ja) * 2001-05-24 2002-12-03 Toppan Printing Co Ltd 単板塗布装置
JP2003037145A (ja) * 2001-07-23 2003-02-07 Nec Kansai Ltd ウエハ搬送装置
WO2006003876A1 (ja) * 2004-06-30 2006-01-12 Hirata Corporation 基板塗布装置
JP2006281091A (ja) * 2005-03-31 2006-10-19 Toray Eng Co Ltd 塗布装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113365741A (zh) * 2019-02-25 2021-09-07 东丽工程株式会社 涂布装置

Also Published As

Publication number Publication date
JP2008289966A (ja) 2008-12-04

Similar Documents

Publication Publication Date Title
WO2009065831A3 (de) Roboter, medizinischer arbeitsplatz und verfahren zum projizieren eines bildes auf die oberfläche eines objekts
FR2930137B1 (fr) Materiel de traitement d'une valve cardiaque, en particulier d'une valve mitrale.
WO2009059128A3 (en) Crystalline-thin-film photovoltaic structures and methods for forming the same
WO2010081003A3 (en) Systems, apparatus and methods for moving substrates
TW200715448A (en) Vacuum processing apparatus, semiconductor device manufacturing method and semiconductor device manufacturing system
MY143591A (en) Method and apparatus for the placement of electronic components, in particular semiconductor chips on a substrate
WO2007061603A3 (en) Methods and apparatus for transferring substrates during electronic device manufacturing
TW200620664A (en) Semicomductor device and method for manufacturing the same
WO2007103870A3 (en) Bypass thermal adjuster for vacuum semiconductor processing
WO2009011100A1 (ja) Iii族窒化物半導体基板およびその洗浄方法
FR2950633B1 (fr) Solution et procede d'activation de la surface oxydee d'un substrat semi-conducteur.
EP2175479A4 (en) METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE SURFACE AND CHEMICAL PROCESSING DEVICE FOR THE SEMICONDUCTOR SUBSTRATE SURFACE
DE602006016008D1 (de) Prozess zum herstellen eines photovoltaischen dünnfilmbauelements
EP1788618A4 (en) SUBSTRATE PROCESSING
DE502006009104D1 (de) Transporteinrichtung, insbesondere zum transport flächiger substrate durch eine beschichtungsanlage
WO2008143259A1 (ja) スリットコータ
WO2003085453A3 (en) Mid-frame for an imaging apparatus
EP2224472B8 (en) Substrate and method for manufacturing the same
WO2008076092A3 (en) Semiconductor device and method for forming the same
WO2008008301A3 (en) Adjustable gripper pad with eccentric bore
WO2009063825A1 (ja) ウェーハ処理装置
SG134255A1 (en) Process for adjusting the strain on the surface or inside a substrate made of a semiconductor material
TW200735271A (en) Semiconductor device fabrication method
GB2415292B (en) A field effect transistor,compound semiconductor substrate and process for forming a recess therein
ITMO20020329A1 (it) Gruppo di derivazione per tubi di trasporto di fluidi, particolarmente per trattamenti agricoli o simili.

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08764406

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08764406

Country of ref document: EP

Kind code of ref document: A1