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WO2008143010A1 - Adhesive, adhesive sheet, method for producing adhesive sheet, and active energy ray-curable resin composition - Google Patents

Adhesive, adhesive sheet, method for producing adhesive sheet, and active energy ray-curable resin composition Download PDF

Info

Publication number
WO2008143010A1
WO2008143010A1 PCT/JP2008/058560 JP2008058560W WO2008143010A1 WO 2008143010 A1 WO2008143010 A1 WO 2008143010A1 JP 2008058560 W JP2008058560 W JP 2008058560W WO 2008143010 A1 WO2008143010 A1 WO 2008143010A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive sheet
adhesive
resin composition
active energy
energy ray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/058560
Other languages
French (fr)
Japanese (ja)
Inventor
Akira Yamabayashi
Ryoichi Torisaki
Toshifumi Akui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Nippon Synthetic Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Synthetic Chemical Industry Co Ltd filed Critical Nippon Synthetic Chemical Industry Co Ltd
Publication of WO2008143010A1 publication Critical patent/WO2008143010A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

Disclosed is a resin composition which is suitable for production of an adhesive of an adhesive sheet for electrostatic charge prevention. This resin composition is excellent in adhesive properties and anti-contaminating property for an object to which it is adhered, and does not require a long time for aging. Specifically disclosed is an adhesive characterized by being obtained by irradiating a thermoplastic resin (A) having a hydrophilic structure or a resin composition [I] containing the thermoplastic resin (A) having a hydrophilic structure with an active energy ray. Also specifically disclosed are an adhesive sheet and a method for producing an adhesive sheet.
PCT/JP2008/058560 2007-05-11 2008-05-08 Adhesive, adhesive sheet, method for producing adhesive sheet, and active energy ray-curable resin composition Ceased WO2008143010A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-126832 2007-05-11
JP2007126832 2007-05-11

Publications (1)

Publication Number Publication Date
WO2008143010A1 true WO2008143010A1 (en) 2008-11-27

Family

ID=40031722

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058560 Ceased WO2008143010A1 (en) 2007-05-11 2008-05-08 Adhesive, adhesive sheet, method for producing adhesive sheet, and active energy ray-curable resin composition

Country Status (2)

Country Link
JP (1) JP5306699B2 (en)
WO (1) WO2008143010A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011043269A1 (en) * 2009-10-06 2011-04-14 藤森工業株式会社 Process for production of pressure-sensitive adhesive composition, process for production of pressure-sensitive adhesive film, raw material composition for pressure-sensitive adhesive, and pressure-sensitive adhesive film
WO2011115224A1 (en) * 2010-03-18 2011-09-22 積水化学工業株式会社 Pressure-sensitive adhesive composition for optical members and pressure-sensitive adhesive tape for optical members
WO2012157630A1 (en) * 2011-05-17 2012-11-22 綜研化学株式会社 Pressure-sensitive adhesive composition for optical component and processed product thereof
CN115397941A (en) * 2020-03-31 2022-11-25 株式会社寺冈制作所 Cross-linking adhesive composition and adhesive tape
US11613677B2 (en) 2017-12-15 2023-03-28 Lg Chem, Ltd. Water-based acrylic pressure-sensitive adhesive for clothing, and preparation method thereof

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5599177B2 (en) * 2009-10-27 2014-10-01 リンテック株式会社 Optical pressure-sensitive adhesive composition, optical pressure-sensitive adhesive, and optical film
WO2013040014A2 (en) * 2011-09-14 2013-03-21 3M Innovative Properties Company Methods of modulating tackiness
JP6062759B2 (en) * 2013-02-15 2017-01-18 日東電工株式会社 Adhesive composition, optical adhesive sheet, optical film, and display device
JP5889365B2 (en) * 2014-05-26 2016-03-22 リンテック株式会社 Adhesive composition, adhesive and adhesive sheet
JP2014194033A (en) * 2014-05-26 2014-10-09 Lintec Corp Tackifier composition, tackifier, and tacky sheet
KR101772613B1 (en) 2014-12-01 2017-08-29 주식회사 엘지화학 Coating composition, coating layer and film having self-healing property
JP2021138909A (en) * 2019-11-27 2021-09-16 三菱ケミカル株式会社 Active energy ray-curable resin composition, pressure-sensitive adhesive composition and pressure-sensitive adhesive

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06128539A (en) * 1992-10-14 1994-05-10 Nitto Denko Corp Adhesive tape or sheet
JPH10226776A (en) * 1997-02-14 1998-08-25 Lintec Corp Pressure-sensitive adhesive composition and method for utilizing the same
JP2000212526A (en) * 1999-01-25 2000-08-02 Lintec Corp Adhesive sheet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06128539A (en) * 1992-10-14 1994-05-10 Nitto Denko Corp Adhesive tape or sheet
JPH10226776A (en) * 1997-02-14 1998-08-25 Lintec Corp Pressure-sensitive adhesive composition and method for utilizing the same
JP2000212526A (en) * 1999-01-25 2000-08-02 Lintec Corp Adhesive sheet

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101378451B1 (en) 2009-10-06 2014-03-26 후지모리 고교 가부시키가이샤 Process for production of pressure-sensitive adhesive composition, process for production of pressure-sensitive adhesive film, raw material composition for pressure-sensitive adhesive, and pressure-sensitive adhesive film
JP2011079931A (en) * 2009-10-06 2011-04-21 Fujimori Kogyo Co Ltd Method for producing adhesive composition, method for producing adhesive film, adhesive raw material composition and adhesive film
CN102549098A (en) * 2009-10-06 2012-07-04 藤森工业株式会社 Process for production of pressure-sensitive adhesive composition, process for production of pressure-sensitive adhesive film, raw material composition for pressure-sensitive adhesive, and pressure-sensitive adhesive film
WO2011043269A1 (en) * 2009-10-06 2011-04-14 藤森工業株式会社 Process for production of pressure-sensitive adhesive composition, process for production of pressure-sensitive adhesive film, raw material composition for pressure-sensitive adhesive, and pressure-sensitive adhesive film
WO2011115224A1 (en) * 2010-03-18 2011-09-22 積水化学工業株式会社 Pressure-sensitive adhesive composition for optical members and pressure-sensitive adhesive tape for optical members
CN102791817A (en) * 2010-03-18 2012-11-21 积水化学工业株式会社 Pressure-sensitive adhesive composition for optical members and pressure-sensitive adhesive tape for optical members
JP5727371B2 (en) * 2010-03-18 2015-06-03 積水化学工業株式会社 Optical member pressure-sensitive adhesive composition and optical member pressure-sensitive adhesive tape
JP2012242473A (en) * 2011-05-17 2012-12-10 Soken Chem & Eng Co Ltd Adhesive composition for optical component and processed product thereof
WO2012157630A1 (en) * 2011-05-17 2012-11-22 綜研化学株式会社 Pressure-sensitive adhesive composition for optical component and processed product thereof
US9080085B2 (en) 2011-05-17 2015-07-14 Soken Chemical & Engineering Co., Ltd. Pressure-sensitive adhesive composition for optical member and processed product thereof
US11613677B2 (en) 2017-12-15 2023-03-28 Lg Chem, Ltd. Water-based acrylic pressure-sensitive adhesive for clothing, and preparation method thereof
EP3650513B1 (en) * 2017-12-15 2024-01-31 Lg Chem, Ltd. Water-based acrylic pressure-sensitive adhesive for clothing, and preparation method thereof
CN115397941A (en) * 2020-03-31 2022-11-25 株式会社寺冈制作所 Cross-linking adhesive composition and adhesive tape
TWI871454B (en) * 2020-03-31 2025-02-01 日商寺岡製作所股份有限公司 Cross-linked adhesive composition and adhesive tape
US12441913B2 (en) 2020-03-31 2025-10-14 Teraoka Seisakusho Co., Ltd. Crosslinking adhesive composition and adhesive tape

Also Published As

Publication number Publication date
JP5306699B2 (en) 2013-10-02
JP2008308670A (en) 2008-12-25

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