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WO2008141878A1 - Procédé pour mettre en contact des modules photovoltaïques - Google Patents

Procédé pour mettre en contact des modules photovoltaïques Download PDF

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Publication number
WO2008141878A1
WO2008141878A1 PCT/EP2008/054637 EP2008054637W WO2008141878A1 WO 2008141878 A1 WO2008141878 A1 WO 2008141878A1 EP 2008054637 W EP2008054637 W EP 2008054637W WO 2008141878 A1 WO2008141878 A1 WO 2008141878A1
Authority
WO
WIPO (PCT)
Prior art keywords
cells
module
foil
backside
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/054637
Other languages
English (en)
Inventor
Rainer Klaus Krause
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of WO2008141878A1 publication Critical patent/WO2008141878A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H10F77/935—Interconnections for devices having potential barriers for photovoltaic devices or modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates in general to a method for the manufacture of solar modules. More particularly, the present invention relates to a method for contacting the individual cells (Si and thin film technology) on such modules.
  • a solar cell or photovoltaic cell is a semiconductor device consisting of a large-area p-n junction diode, which in the presence of sunlight is capable of generating usable electrical energy. This conversion is called the photovoltaic effect .
  • Solar cells have many applications. They are particularly well suited to, and historically used in, situations where electrical power from the grid is unavailable, such as in remote area power systems, handheld calculators, remote radiotelephones and water pumping applications. Solar cells (in the form of modules or solar panels) on building roofs can be connected through an inverter to the electricity grid in a net metering arrangement.
  • a solar module or panel is a flat collection of solar cells or solar thermal collectors used for converting solar energy into electricity or heat.
  • solar module can be applied to either solar hot water modules (usually used for providing domestic hot water) or solar photovoltaic modules (providing electricity) . In the following the main focus will be on solar photovoltaic modules.
  • Solar cells that are to be in operation for a long time need to be protected from environmental factors such as dampness.
  • the upper side of the solar cells is covered with a transparent covering layer. This can be glass or plastic sheet.
  • the covering layer is glued to the surface of the solar cells with a plastic that networks when heated.
  • Encapsulation takes place in a vacuum laminator.
  • the solar cell is placed face up inside it on a flat heater plate.
  • EVA ethyl vinyl acetate
  • the transparent protective covering glass or plastic sheet
  • the lid of the laminator is then closed.
  • this lid there is a membrane, which now rests on the solar cell, dividing the laminator chamber into two sealed parts.
  • the solar cell is heated up.
  • a predetermined temperature e.g. 80 0 C
  • air is let in to the space above the membrane. This presses the membrane onto the stack consisting of solar cell, EVA foil and covering layer, creating a continuous contact between the individual layers over the entire surface.
  • the EVA foil polymerizes, at about 150 0 C, becoming a transparent, thermally stable film and creating a strong bond between the surface of the solar cells and the covering layer.
  • the individual cells on solar modules are contacted using contact wires and a certain soldering technique. This is a difficult and complex process concerning cell handling and proper contacting.
  • the mono- and poly-crystalline silicon cells are fairly thin (200 - 330 ⁇ m) and therefore highly exposed to break during the process. Each process step which can be saved increases the process and product yield.
  • Fig. 1 depicts a generic cell example layout with backside contacts; the contacts are either pads in the corner or could be contact stripes along the edge;
  • Fig. 2 schematically shows an EVA foil used to pack and encapsulate the solar module with low voltage; the foil contains already the finished contact wiring as well as contact pads fitting the cell contact pads/stripes; the contact wiring is arranged to have the cells in one row in parallel and the rows serialized;
  • Fig. 3 schematically shows a solar module with finished contact wiring on the EVA foil for low voltage; the set up is made to have the cells per row serialized and the rows in parallel mode;
  • Fig. 4 schematically depicts an EVA foil used to pack and encapsulate the solar module with high voltage while the EVA foil contains already the contact wiring; the set up is made to have all cells in serial mode, to achieve the highest possible voltage;
  • Figs. 5A to 5D schematically depict the encapsulation process using a wired EVA foil
  • Fig. 6A schematically shows a solder concept using a tip heated stamp
  • Fig. 6B schematically depicts a glue contact concept using a UV light stamp.
  • the inventive method starts with cells having backside contacts 2, as shown in Fig. 1.
  • the cell has 3,26 V and 2,33 A.
  • a backside covering foil 4 (e.g., an EVA foil) normally used for module encapsulation can be used to connect individual cells on the glass substrate.
  • the required wiring can be included into the foil.
  • the wiring pattern on the foil determines the module's parameters like output voltage and output current, examples for different wiring patterns, low, medium and high voltage applications are shown in Figs. 2 to 4.
  • the final voltage/current is really dependent on the cell setup (patterning spaces) and on how many cells are linked parallel and/or serial on module level.
  • the inventive method allows any range from lowest cell voltage, highest current (all parallelized) to highest cell voltage, lowest current (all serialized) .
  • Fig. 2 shows an example using an EVA foil with contact stripes for low voltage application (3 rows in serial mode with each 6 cell in parallel mode - cells are all positioned the same way, see polarity pattern) .
  • an individual cell would have 3,25 V and 2,33 A, the power for 18 cells per module would be at 136,31 W.
  • any range is possible between 3,25 V/41,94 A and 58,5 V/2,33 A, with other cell parameters the range would look different - e.g., 8 cells in parallel mode deliver a 3,25 V/41,94 A module performance and all 18 cells in serial mode deliver a 58,5 V/2,33 A module performance.
  • the application of Fig. 2 would have the following parameters:
  • Fig. 3 there is shown an example using an EVA foil with contact stripes for medium voltage application (3 rows in parallel mode with each 6 cell in serial mode - cells are all positioned the same way, see polarity pattern) .
  • the application of Fig. 3 would have the following parameters:
  • Fig. 4 depicts an example using an EVA foil with contact stripes for high voltage application (3 rows in serial mode with each 6 cell in parallel mode - cells in one row are placed alternating, see polarity pattern) .
  • the application of Fig. 4 would have the following parameters: Voltage : 58,5 V Current : 6, 99 A Power : 136,31 W
  • the different examples demonstrate the flexibility of the inventive wiring approach.
  • the approach gives maximum flexibility to customize the module performance.
  • any voltages and currents between 3,25 V - 58,5 V and 2,33 A - 41,94 A can be realized, using the module technique described here. It is clear for the skilled worker that, if the cell is designed differently, other numbers will result. Varying the cell design allows even a wider range of module performance.
  • the wiring on the foil can be a conductive polymer, metallic wires (like copper) , which are glued or printed on the foil surface, and build the final module wiring ending in the exit connector to the converter. The wire and contact pattern depends on the application and the cell size (see table above) .
  • Table 2 gives various cell performances at a specific patterning width for different cell sizes.
  • the known encapsulation process can, according to the present invention, not only be used to cover and seal the module, but also to connect the contact pads of the cell having backside contact pads .
  • connection between the contact pads on the cells and the pads and wires on the foil can be either realized through contact gluing or soldering, as shown in Fig. 5.
  • solar cells 10 are placed, e.g., by a pick-and-place process, on a glass substrate 12, which might be of a size of 60 x 120 cm 2 .
  • the cells in this case, have a size of 20 x 20 cm 2 .
  • other sizes are possible.
  • the contact paste is placed on the backside of the EVA foil, on the contact pads 2, using a mask.
  • the same technique is used in case of soldering, by placing the solder paste through a mask, like in a regular SMT process.
  • the EVA foil 16 is placed with matching contact pads 18.
  • metallic stamps 22 cf. Figs. 6A, 6B
  • the metallic stamps 22 are heated at their lower ends (arrows 24) to realize local soldering between the contact pads.
  • the cell set up remains the same and does not get changed. This allows a maximum flexibility in customization at very low effort and cost impact.
  • the foil 16 is placed on the backside using video imaging technique, to secure exact positioning of the cell contacts vs. the foil contacts and wires.
  • the contacts can be reliably secured using either a contact glue 26 or the foil contacts get solder paste 28, through a SMT like process step.
  • the soldering is achieved during a vacuum and furnace process using heated stamp tips for the individual solder joints (see Fig. 5d) during encapsulation the foil is in a vacuum process attached to the module backside, during this process the pin tip heated stamps are pressed on the solder joints, this enables a local soldering of the contact pads (see Fig. 6a) .
  • the contact glue is also put onto the foil 16 using the SMT technology, during the encapsulation process the local stamps press on the contact pads applying UV for curing (arrows 30), while the light can be provided through the stamp directly, using a quartz glass type of stamp (see Fig. 6b) .
  • the cells are once placed either always the same direction or in the second case in alternative direction.
  • the cell layout itself remains the same and is generic. This means that any technology can be used, like mono- and poly-crystalline cells as well as cells based on thin film technology, like CIGS and CdTe, etc. As long as the contacts are located in the corners of the cells, any set up can be achieved using the generic wiring technique on modules.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne un procédé pour mettre en contact des modules phtovoltaïques. Ledit procédé consiste : - à fournir des cellules photovoltaïques avec des contacts arrière; - à placer ces cellules sur un substrat en verre, ce qui forme un module; - à enfermer le câblage des cellules désiré dans une feuille de revêtement arrière utilisée pour encapsuler le module; - à placer la feuille de revêtement arrière sur le module, le câblage de la feuille correspondant aux points de contact des cellules; - à fixer les points de contact; et à encapsuler le module au moyen de la feuille de revêtement.
PCT/EP2008/054637 2007-05-24 2008-04-17 Procédé pour mettre en contact des modules photovoltaïques Ceased WO2008141878A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07108817.3 2007-05-24
EP07108817 2007-05-24

Publications (1)

Publication Number Publication Date
WO2008141878A1 true WO2008141878A1 (fr) 2008-11-27

Family

ID=39651009

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/054637 Ceased WO2008141878A1 (fr) 2007-05-24 2008-04-17 Procédé pour mettre en contact des modules photovoltaïques

Country Status (2)

Country Link
TW (1) TW200903825A (fr)
WO (1) WO2008141878A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013043375A1 (fr) * 2011-09-20 2013-03-28 General Electric Company Encapsulation étanche de grande surface d'un dispositif optoélectronique à l'aide d'une stratification sous vide

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4128766A1 (de) * 1991-08-29 1993-03-04 Flachglas Ag Solarmodul sowie verfahren zu dessen herstellung
US5951786A (en) * 1997-12-19 1999-09-14 Sandia Corporation Laminated photovoltaic modules using back-contact solar cells
WO2000046860A1 (fr) * 1999-02-01 2000-08-10 Kurth Glas + Spiegel Ag Module solaire
FR2853993A1 (fr) * 2003-04-16 2004-10-22 Dgtec Procede de realisation d'un module photovoltaique et module photovoltaique realise par ce procede
US20060272699A1 (en) * 2003-04-16 2006-12-07 Apollon Solar Photovoltaic module and method for production thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4128766A1 (de) * 1991-08-29 1993-03-04 Flachglas Ag Solarmodul sowie verfahren zu dessen herstellung
US5951786A (en) * 1997-12-19 1999-09-14 Sandia Corporation Laminated photovoltaic modules using back-contact solar cells
WO2000046860A1 (fr) * 1999-02-01 2000-08-10 Kurth Glas + Spiegel Ag Module solaire
FR2853993A1 (fr) * 2003-04-16 2004-10-22 Dgtec Procede de realisation d'un module photovoltaique et module photovoltaique realise par ce procede
US20060272699A1 (en) * 2003-04-16 2006-12-07 Apollon Solar Photovoltaic module and method for production thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013043375A1 (fr) * 2011-09-20 2013-03-28 General Electric Company Encapsulation étanche de grande surface d'un dispositif optoélectronique à l'aide d'une stratification sous vide
US8865487B2 (en) 2011-09-20 2014-10-21 General Electric Company Large area hermetic encapsulation of an optoelectronic device using vacuum lamination

Also Published As

Publication number Publication date
TW200903825A (en) 2009-01-16

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