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WO2008140016A1 - Composition de résine photosensible, élément photosensible, procédé de formation d'un motif de réserve, et procédé de fabrication d'une carte de câblage imprimé - Google Patents

Composition de résine photosensible, élément photosensible, procédé de formation d'un motif de réserve, et procédé de fabrication d'une carte de câblage imprimé Download PDF

Info

Publication number
WO2008140016A1
WO2008140016A1 PCT/JP2008/058551 JP2008058551W WO2008140016A1 WO 2008140016 A1 WO2008140016 A1 WO 2008140016A1 JP 2008058551 W JP2008058551 W JP 2008058551W WO 2008140016 A1 WO2008140016 A1 WO 2008140016A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
wiring board
printed wiring
resist pattern
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/058551
Other languages
English (en)
Japanese (ja)
Inventor
Kuniaki Sato
Toshizumi Yoshino
Masaya Ookawa
Takahiro Hidaka
Hideyasu Tsuiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to KR1020097021752A priority Critical patent/KR101139561B1/ko
Priority to JP2009514137A priority patent/JP4985767B2/ja
Priority to CN2008800142486A priority patent/CN101675388B/zh
Publication of WO2008140016A1 publication Critical patent/WO2008140016A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

La présente invention se rapporte à une composition de résine photosensible comprenant (A) une résine époxy contenant du vinyle modifiée à l'acide, (B) un initiateur de photopolymérisation contenant un composé possédant une liaison d'ester d'oxime et un sensibilisateur contenant l'un quelconque des composés coumariniques de la formule générale suivante (1) :
PCT/JP2008/058551 2007-05-11 2008-05-08 Composition de résine photosensible, élément photosensible, procédé de formation d'un motif de réserve, et procédé de fabrication d'une carte de câblage imprimé Ceased WO2008140016A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097021752A KR101139561B1 (ko) 2007-05-11 2008-05-08 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
JP2009514137A JP4985767B2 (ja) 2007-05-11 2008-05-08 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN2008800142486A CN101675388B (zh) 2007-05-11 2008-05-08 光敏性树脂组合物、光敏性元件、抗蚀剂图案的形成方法及印刷电路板的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-127217 2007-05-11
JP2007127217 2007-05-11

Publications (1)

Publication Number Publication Date
WO2008140016A1 true WO2008140016A1 (fr) 2008-11-20

Family

ID=40002216

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058551 Ceased WO2008140016A1 (fr) 2007-05-11 2008-05-08 Composition de résine photosensible, élément photosensible, procédé de formation d'un motif de réserve, et procédé de fabrication d'une carte de câblage imprimé

Country Status (5)

Country Link
JP (1) JP4985767B2 (fr)
KR (1) KR101139561B1 (fr)
CN (2) CN102621810B (fr)
TW (1) TWI398728B (fr)
WO (1) WO2008140016A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011043565A (ja) * 2009-08-19 2011-03-03 Taiyo Holdings Co Ltd 光硬化性樹脂組成物
JP2014074927A (ja) * 2013-12-26 2014-04-24 Taiyo Holdings Co Ltd 光硬化性樹脂組成物
WO2014136897A1 (fr) * 2013-03-07 2014-09-12 日立化成株式会社 Composition de résine photosensible, film sec utilisant cette composition, carte de circuit imprimé, et procédé de fabrication d'une carte de circuit imprimé
JP2016105164A (ja) * 2014-11-19 2016-06-09 三洋化成工業株式会社 感光性樹脂組成物

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102329943B1 (ko) * 2016-03-16 2021-11-22 동우 화인켐 주식회사 네가티브 감광형 수지 조성물 및 이로부터 제조된 광경화 패턴
KR101910734B1 (ko) * 2017-03-28 2018-10-22 동우 화인켐 주식회사 착색 감광성 수지 조성물, 이를 사용하여 제조된 컬러필터, 및 상기 컬러필터를 포함하는 표시장치

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448857A (en) * 1987-08-19 1989-02-23 Asahi Chemical Ind Novel photosensitive composition
JPH07278214A (ja) * 1994-02-15 1995-10-24 Hitachi Chem Co Ltd 光開始剤、感光性組成物、感光材料およびパターンの製造法
JP2006010793A (ja) * 2004-06-23 2006-01-12 Jsr Corp 着色層形成用感放射線性組成物およびカラーフィルタ
JP2006243648A (ja) * 2005-03-07 2006-09-14 Fujifilm Electronic Materials Co Ltd 光硬化性組成物及びそれから得られるカラーフィルタ
WO2006129697A1 (fr) * 2005-05-31 2006-12-07 Taiyo Ink Manufacturing Co., Ltd. Composition de resine photodurcissable/thermodurcissable, produit durci/solidifie correspondant et carte de circuit imprime obtenue en l’utilisant
JP2007033467A (ja) * 2005-06-22 2007-02-08 Tokyo Ohka Kogyo Co Ltd 感光性組成物およびブラックマトリクス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811218A (en) * 1993-07-28 1998-09-22 Hitachi Chemical Company, Ltd. Photoinitiator compositions including amino acids, coumarin and titanocene and photosensitive materials using the same
JP4165473B2 (ja) * 2004-08-17 2008-10-15 東洋紡績株式会社 ネガ型感光性ポリイミド前駆体組成物
JP2007256845A (ja) * 2006-03-24 2007-10-04 Fujifilm Corp 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板
JP5031578B2 (ja) * 2006-03-29 2012-09-19 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
JP4660826B2 (ja) * 2006-08-18 2011-03-30 山栄化学株式会社 レジストパターンの形成方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448857A (en) * 1987-08-19 1989-02-23 Asahi Chemical Ind Novel photosensitive composition
JPH07278214A (ja) * 1994-02-15 1995-10-24 Hitachi Chem Co Ltd 光開始剤、感光性組成物、感光材料およびパターンの製造法
JP2006010793A (ja) * 2004-06-23 2006-01-12 Jsr Corp 着色層形成用感放射線性組成物およびカラーフィルタ
JP2006243648A (ja) * 2005-03-07 2006-09-14 Fujifilm Electronic Materials Co Ltd 光硬化性組成物及びそれから得られるカラーフィルタ
WO2006129697A1 (fr) * 2005-05-31 2006-12-07 Taiyo Ink Manufacturing Co., Ltd. Composition de resine photodurcissable/thermodurcissable, produit durci/solidifie correspondant et carte de circuit imprime obtenue en l’utilisant
JP2007033467A (ja) * 2005-06-22 2007-02-08 Tokyo Ohka Kogyo Co Ltd 感光性組成物およびブラックマトリクス

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011043565A (ja) * 2009-08-19 2011-03-03 Taiyo Holdings Co Ltd 光硬化性樹脂組成物
WO2014136897A1 (fr) * 2013-03-07 2014-09-12 日立化成株式会社 Composition de résine photosensible, film sec utilisant cette composition, carte de circuit imprimé, et procédé de fabrication d'une carte de circuit imprimé
JPWO2014136897A1 (ja) * 2013-03-07 2017-02-16 日立化成株式会社 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法
US10111328B2 (en) 2013-03-07 2018-10-23 Htachi Chemical Company, Ltd. Photosensitive resin composition, dry film using same, printed wiring board, and method for producing printed wiring board
JP2014074927A (ja) * 2013-12-26 2014-04-24 Taiyo Holdings Co Ltd 光硬化性樹脂組成物
JP2016105164A (ja) * 2014-11-19 2016-06-09 三洋化成工業株式会社 感光性樹脂組成物

Also Published As

Publication number Publication date
CN101675388A (zh) 2010-03-17
CN101675388B (zh) 2012-07-18
TW200910007A (en) 2009-03-01
CN102621810B (zh) 2014-05-28
CN102621810A (zh) 2012-08-01
KR20100009548A (ko) 2010-01-27
JPWO2008140016A1 (ja) 2010-08-05
KR101139561B1 (ko) 2012-05-02
JP4985767B2 (ja) 2012-07-25
TWI398728B (zh) 2013-06-11

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