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WO2008140093A1 - 搬送装置及びこれを用いた真空処理装置 - Google Patents

搬送装置及びこれを用いた真空処理装置 Download PDF

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Publication number
WO2008140093A1
WO2008140093A1 PCT/JP2008/058811 JP2008058811W WO2008140093A1 WO 2008140093 A1 WO2008140093 A1 WO 2008140093A1 JP 2008058811 W JP2008058811 W JP 2008058811W WO 2008140093 A1 WO2008140093 A1 WO 2008140093A1
Authority
WO
WIPO (PCT)
Prior art keywords
transfer unit
transfer
guide
body portion
apparatus body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/058811
Other languages
English (en)
French (fr)
Inventor
Hirofumi Minami
Kazuhiro Fujimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Sowa MD Center Co Ltd
Original Assignee
Ulvac Inc
Sowa MD Center Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc, Sowa MD Center Co Ltd filed Critical Ulvac Inc
Priority to KR1020097023692A priority Critical patent/KR101191074B1/ko
Priority to CN2008800163196A priority patent/CN101730613B/zh
Priority to JP2009514169A priority patent/JPWO2008140093A1/ja
Publication of WO2008140093A1 publication Critical patent/WO2008140093A1/ja
Priority to US12/617,270 priority patent/US20100111649A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J17/00—Joints
    • B25J17/02—Wrist joints
    • B25J17/0258—Two-dimensional joints
    • B25J17/0266—Two-dimensional joints comprising more than two actuating or connecting rods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/003—Programme-controlled manipulators having parallel kinematics
    • B25J9/0045—Programme-controlled manipulators having parallel kinematics with kinematics chains having a rotary joint at the base
    • B25J9/0048—Programme-controlled manipulators having parallel kinematics with kinematics chains having a rotary joint at the base with kinematics chains of the type rotary-rotary-rotary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/003—Programme-controlled manipulators having parallel kinematics
    • B25J9/0072—Programme-controlled manipulators having parallel kinematics of the hybrid type, i.e. having different kinematics chains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/046—Revolute coordinate type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

　本発明は、グリースやダスト等による真空装置等の汚染の問題を生じない搬送装置を提供するとともに、装置の設置面積が小さく、既存技術で容易に耐腐食処理が可能な搬送装置を提供するものである。本発明の搬送装置１は、搬送物（２０）を支持して搬送する搬送部（２１）と、装置本体部２からの動力を搬送部（２１）に伝達して当該搬送部（２１）を水平面方向へ移動させるためのリンク（１６）と、装置本体部２と搬送部（２１）との間に配設され、搬送部（２１）の移動方向を案内するためのガイド機構（３０）とを有する。ガイド機構（３０）は、軸支連結された第１及び第２ガイドアーム（３１、３２）を有し、当該ガイド機構（３０）の一端部側の第１ガイドアーム（３１）が装置本体部（２）に取り付けられるとともに他端部側の第２ガイドアーム（３２）が搬送部（２１）に取り付けられている。第１及び第２ガイドアーム（３１、３２）は、それぞれが鉛直面方向に回転するように構成されている。
PCT/JP2008/058811 2007-05-15 2008-05-14 搬送装置及びこれを用いた真空処理装置 Ceased WO2008140093A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097023692A KR101191074B1 (ko) 2007-05-15 2008-05-14 반송 장치 및 이것을 사용한 진공 처리 장치
CN2008800163196A CN101730613B (zh) 2007-05-15 2008-05-14 搬送装置及使用该搬送装置的真空处理装置
JP2009514169A JPWO2008140093A1 (ja) 2007-05-15 2008-05-14 搬送装置及びこれを用いた真空処理装置
US12/617,270 US20100111649A1 (en) 2007-05-15 2009-11-12 Transfer device and vacuum processing apparatus using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007128904 2007-05-15
JP2007-128904 2007-05-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/617,270 Continuation US20100111649A1 (en) 2007-05-15 2009-11-12 Transfer device and vacuum processing apparatus using the same

Publications (1)

Publication Number Publication Date
WO2008140093A1 true WO2008140093A1 (ja) 2008-11-20

Family

ID=40002281

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058811 Ceased WO2008140093A1 (ja) 2007-05-15 2008-05-14 搬送装置及びこれを用いた真空処理装置

Country Status (6)

Country Link
US (1) US20100111649A1 (ja)
JP (2) JPWO2008140093A1 (ja)
KR (1) KR101191074B1 (ja)
CN (1) CN101730613B (ja)
TW (1) TWI408765B (ja)
WO (1) WO2008140093A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101080333B1 (ko) 2009-12-18 2011-11-04 주식회사 나래나노텍 전극 공급 장치
JP2017504492A (ja) * 2014-01-17 2017-02-09 ブルックス オートメーション インコーポレイテッド 基板搬送装置
CN115042165A (zh) * 2021-03-08 2022-09-13 北华大学 拮抗式双向回转柔性驱动器

Families Citing this family (15)

* Cited by examiner, † Cited by third party
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JP5185853B2 (ja) * 2009-02-16 2013-04-17 アテル株式会社 基板搬送装置
KR101505062B1 (ko) * 2010-05-25 2015-03-23 시스테만틱스 인디아 피브이티. 엘티디 직렬-병렬 링크 기구 기반의 하이브리드 6 자유도 로봇 매니퓰레이터
CN102569140A (zh) * 2010-12-17 2012-07-11 北京北方微电子基地设备工艺研究中心有限责任公司 真空机械手和晶片处理系统
JP5995404B2 (ja) * 2011-01-26 2016-09-21 ナブテスコ株式会社 ウエハ搬送ロボット
US20130309048A1 (en) * 2012-05-16 2013-11-21 Lam Research Ag Apparatus and method for transporting wafer-shaped articles
CN102897536B (zh) * 2012-11-02 2015-04-15 深圳市华星光电技术有限公司 用于搬运平板的传输系统及其机械装置和搬运方法
JP2017064900A (ja) * 2015-09-30 2017-04-06 株式会社ダイヘン 搬送装置
US10788264B2 (en) * 2016-04-12 2020-09-29 Vanrx Pharmasystems, Inc. Method and apparatus for loading a lyophilization system
CN105789098B (zh) * 2016-05-10 2018-11-02 黄剑鸿 一种半导体硅片提升装置
CN106426133B (zh) * 2016-10-24 2021-06-08 上海邦邦机器人有限公司 一种可锁定的角度保持机构
JP6802724B2 (ja) 2017-02-10 2020-12-16 株式会社東芝 検査装置及び検査方法
NL2020044B1 (en) * 2017-12-08 2019-06-19 Vdl Enabling Tech Group B V A planar multi-joint robot arm system
CN110091340B (zh) * 2019-05-07 2020-10-20 芯导精密(北京)设备有限公司 一种晶圆取放机械手
US12440963B2 (en) 2021-12-13 2025-10-14 Sony Group Corporation Support arm device and robot device
CN119771519A (zh) * 2024-12-25 2025-04-08 常熟市虞华真空设备科技有限公司 具有平移门结构的真空罐

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JPS63252439A (ja) * 1986-12-19 1988-10-19 アプライド　マテリアルズインコーポレーテッド 多チャンバの統合処理システム
JPH11254357A (ja) * 1998-03-06 1999-09-21 Meidensha Corp 水平アームを有するロボット
JP2007015023A (ja) * 2005-07-05 2007-01-25 Daihen Corp リンク装置および搬送ロボット

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101080333B1 (ko) 2009-12-18 2011-11-04 주식회사 나래나노텍 전극 공급 장치
JP2017504492A (ja) * 2014-01-17 2017-02-09 ブルックス オートメーション インコーポレイテッド 基板搬送装置
US11273558B2 (en) 2014-01-17 2022-03-15 Brooks Automation Us, Llc Substrate transport apparatus
CN115042165A (zh) * 2021-03-08 2022-09-13 北华大学 拮抗式双向回转柔性驱动器

Also Published As

Publication number Publication date
KR20100065241A (ko) 2010-06-16
CN101730613A (zh) 2010-06-09
JP5467115B2 (ja) 2014-04-09
TWI408765B (zh) 2013-09-11
JPWO2008140093A1 (ja) 2010-08-05
CN101730613B (zh) 2013-11-06
US20100111649A1 (en) 2010-05-06
JP2012115985A (ja) 2012-06-21
TW200903697A (en) 2009-01-16
KR101191074B1 (ko) 2012-10-15

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