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WO2008038869A1 - Parquet en bois solide carbonisé présentant une structure symétrique et procédé de préparation de celui-ci - Google Patents

Parquet en bois solide carbonisé présentant une structure symétrique et procédé de préparation de celui-ci Download PDF

Info

Publication number
WO2008038869A1
WO2008038869A1 PCT/KR2007/001024 KR2007001024W WO2008038869A1 WO 2008038869 A1 WO2008038869 A1 WO 2008038869A1 KR 2007001024 W KR2007001024 W KR 2007001024W WO 2008038869 A1 WO2008038869 A1 WO 2008038869A1
Authority
WO
WIPO (PCT)
Prior art keywords
wood
layer
wood flooring
carbonized solid
base layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2007/001024
Other languages
English (en)
Inventor
Seog-Goo Kang
Jee-Woong Kim
Sung-Gyu Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Chem Ltd
Original Assignee
LG Chem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Chem Ltd filed Critical LG Chem Ltd
Priority to JP2009530243A priority Critical patent/JP5351026B2/ja
Publication of WO2008038869A1 publication Critical patent/WO2008038869A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/024—Sectional false floors, e.g. computer floors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/14—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood board or veneer
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members

Definitions

  • the present invention relates to wood flooring having a symmetric structure comprising application of carbonized solid wood to top and bottom layers and a process for preparing the same. More specifically, the present invention relates to wood flooring having a symmetric structure, which is capable of maintaining the balance and is capable of completely solving a problem of deformation in response to environmental fluctuations by symmetric lamination of high-temperature heat-treated veneers having a thickness of 2 mm or more on both faces of a base layer.
  • wooden floors having a top layer thickness of less than 2 mm are intended for underfloor heating applications and those having a top layer thickness of 2 mm or more are intended for common applications in solid wood floors.
  • Conventional solid wood floors are composed of surface wood having a thickness of more than 2 mm and plywood or strip having a thickness of 5 to 7 mm as a base material.
  • a size of underfloor-heating wood flooring is usually confined to a dimension of 75 mm x 92 mm x 900 mm, whereas the solid wood floor is produced in various dimensions of 65 to 210 mm (width) x 360 to 2,525 mm (length).
  • WPC Wood Plastic Composite
  • the solid wood flooring using a veneer having a thickness of 2 mm or more suffers from poor dimensional stability and poor warp resistance due to changes in moisture conditions, thereby showing weakness in application thereof to Korean traditional floor heating (Ondol) systems.
  • commercially available solid wood flooring has a top-bottom asymmetric structure comprising a veneer having a thickness of more than 2 mm on the top and plywood or strip (square lumber having a relatively smaller dimension than a width of the wood flooring is glued perpendicularly relative to the grain direction of the surface wood) on the bottom as a base material, thus resulting in an imbalance of the whole structure and consequently a deterioration in the basic properties of the product as compared to the wood flooring for underfloor heating.
  • Japanese Unexamined Patent Publication No. 1994-158842 discloses a wooden floor heating panel disposing a heater in the recessed portion of base plywood, which has, however, an asymmetric structure between the upper and lower parts around the base layer.
  • Japanese Unexamined Patent Publication No. 2005-161624 discloses a wood composite board for the floor panel of the truck. However, this art suffers from poor dimensional stability due to no use of heat-treated wood layers.
  • US Patent Publication No. 2005/0153150 Al discloses a bamboo board for use as container flooring, which also exhibits, however, insufficient poor dimensional stability due to no use of heat-treated wood layers.
  • Japanese Unexamined Patent Publication No. 2003-251616 discloses a carbonized woody fiber heat insulating material. However, this technique is directed to an insulating material intended for the outer wall or the floor of the building, not to the flooring material.
  • the present invention has been made in view of the above problems, and it is an object of the present invention to provide wood flooring which is capable of improving dimensional stability owing to a superior rate of change in response to moisture and heat via the use of carbonized solid wood in the top and bottom layers, as compared to that of conventional solid wood flooring, is capable of solving a problem of distortion associated with heat and humidity owing to finishing of the top and bottom layers with the same material, and is designed to be suitable for Korean traditional floor heating (Ondol) systems by imparting the stability of symmetric structure. It is another object of the present invention to provide wood flooring which is capable of improving consumer's emotional image of the product by achieving high-quality color of wood flooring via the heat treatment.
  • wood flooring comprising a base layer and carbonized solid wood layers symmetrically laminated on both faces of the base layer.
  • the present invention is characterized by achieving remarkably improved dimensional stability via the symmetric configuration of the carbonized solid wood layers laminated on both faces of the base layer, simultaneously with a high-quality color of the wood flooring via the heat treatment.
  • the carbonized solid wood layer in the present invention is preferably a veneer which is heat-treated at a temperature of 150 ° C to 230 ° C .
  • Chemical components constituting the wood may be broadly classified into cellulose, hemicellulose, lignin, and other extracts.
  • hemicellulose undergoes thermal decomposition at a temperature above 150 ° C , thus causing changes in the physicochemical properties of the wood.
  • the thermal decomposition of cellulose takes place at a temperature of 240 ° C to 350 ° C, which will lead to a severe decrease in the strength of the wood.
  • the preferred form of the wood flooring to be applied in the present invention is solid wood flooring in which the upper carbonized solid wood layer has a thickness of 2 mm or more.
  • At least one layer of the surface-treated layer, carbonized solid wood layer and base layer may contain at least one functional material selected from charcoal, loess, silver, Maekbanseok (Elvan), germanium, magnetite, jade, an antibacterial agent and an insect repellent; at least one cured resin selected from epoxy, phenol, acrylic, melamine, polyurethane, unsaturated polyester and diallylphthalate; at least one filler selected from calcium carbonate, talc, titanium oxide, silica, glass powder and silicon dioxide; and/or at least one flame retardant selected from phosphoric ester, halogeno hydrocarbon, antimony oxide, aluminum hydroxide, phosphate compound and dicyandiamide.
  • at least one functional material selected from charcoal, loess, silver, Maekbanseok (Elvan), germanium, magnetite, jade, an antibacterial agent and an insect repellent
  • at least one cured resin selected from epoxy, phenol, acrylic, melamine, polyurethane, unsaturated polyester
  • raw materials for heat treatment are prepared by cutting wood in the form of square lumber having a thickness capable of obtaining large amounts of veneers after lumber sawing.
  • the heat treatment process may be broadly divided into three steps: drying, high-temperature treatment and cooling.
  • drying also called high-temperature drying, is a process of reducing the water content in the lumber to almost zero %. Maximum care should be taken to avoid the occurrence of internal checks or honeycombs. Drying conditions may vary depending upon the initial water content, species of trees and a thickness of lumber.
  • the treatment temperature is elevated to a predetermined range of 150 to 230 "C and then the optimum temperature is maintained for a given period of time.
  • steam is used to prevent the likelihood of a fire and to control chemical changes in the lumber.
  • a wood layer having a thickness of about 3.0 mm and a water content of 5 to 7% was used which was heat-treated at a temperature of 180 to 200 ° C .
  • Finnish Birch plywood having a thickness of 4.0 mm and a water content of 5% was used as the base layer 30 .
  • an aqueous emulsion containing vinyl urethane as a main component was mixed with a 10% curing agent.
  • a room temperature-compressible and room temperature-curable resin was used.
  • Comparative Example 2 Commercially available conventional wood flooring.
  • Example 1 the wood flooring prepared in Example 1 exhibited superior dimensional stability and warp resistance, as compared to the wood flooring of Comparative Examples 1 and 2.
  • wood flooring according to the present invention is capable of solving the deformation problem of the product due to environmental changes via application of a triple-layer structure comprising a base layer and veneers having the same thickness applied to the top and bottom of the base layer, wherein the intermediate base layer is composed of a wood-based board, such as raw wood, water-resistant plywood, MDF, HDF, particle board (PB), resin-wood meal mixed board or the like.
  • a wood-based board such as raw wood, water-resistant plywood, MDF, HDF, particle board (PB), resin-wood meal mixed board or the like.
  • PB particle board
  • the present invention provides Korean-type wood flooring which is capable of being used under any environment by completely solving problems of deformation due to heat and humidity via the application of high-temperature heat-treated veneers having a thickness of 2 mm or more to top and bottom layers, and is designed to meet requirements suitable for floor heating (Ondol) systems by solving problems of height differences between products due to unevenness, indentation and bending of the floor via T&G processing.
  • Korean-type wood flooring which is capable of being used under any environment by completely solving problems of deformation due to heat and humidity via the application of high-temperature heat-treated veneers having a thickness of 2 mm or more to top and bottom layers, and is designed to meet requirements suitable for floor heating (Ondol) systems by solving problems of height differences between products due to unevenness, indentation and bending of the floor via T&G processing.

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Floor Finish (AREA)
  • General Engineering & Computer Science (AREA)
  • Finished Plywoods (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)

Abstract

L'invention concerne un parquet présentant une structure symétrique obtenu par application d'un bois solide carbonisé sur des couches supérieure et inférieure, ainsi qu'un procédé de préparation dudit parquet. Le parquet de l'invention présente une structure symétrique obtenue par stratification symétrique de placages traités thermiquement à haute température qui présentent une épaisseur de 2 mm ou plus sur des couches supérieure et inférieure, et par intégration des couches dans des conditions de température et de pression données. Ledit parquet permet ainsi d'assurer le maintien d'un équilibre, de résoudre un problème de déformation dû aux variations environnementales, d'obtenir une stabilité dimensionnelle et une couleur haute qualité de produit, et d'éliminer les problèmes de contamination de surface, ce qui permet d'utiliser du bois de conifère de basse qualité contaminé en tant que matériau de parquet.
PCT/KR2007/001024 2006-09-26 2007-02-28 Parquet en bois solide carbonisé présentant une structure symétrique et procédé de préparation de celui-ci Ceased WO2008038869A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009530243A JP5351026B2 (ja) 2006-09-26 2007-02-28 熱処理したウッドを適用した対称構造のウッドフローリング及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20060093242A KR100970112B1 (ko) 2006-09-26 2006-09-26 열처리한 목재를 적용한 대칭구조 마루바닥재 및 그제조방법
KR10-2006-0093242 2006-09-26

Publications (1)

Publication Number Publication Date
WO2008038869A1 true WO2008038869A1 (fr) 2008-04-03

Family

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Application Number Title Priority Date Filing Date
PCT/KR2007/001024 Ceased WO2008038869A1 (fr) 2006-09-26 2007-02-28 Parquet en bois solide carbonisé présentant une structure symétrique et procédé de préparation de celui-ci

Country Status (4)

Country Link
JP (1) JP5351026B2 (fr)
KR (1) KR100970112B1 (fr)
CN (1) CN101517177A (fr)
WO (1) WO2008038869A1 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102071789A (zh) * 2009-11-23 2011-05-25 浙江世友木业有限公司 一种大幅面拼花地板的生产方法及大幅面拼花地板
CN102554980A (zh) * 2012-02-20 2012-07-11 浙江世友木业有限公司 一种单板层积材的制造方法
CN102672771A (zh) * 2012-05-31 2012-09-19 浙江林碳木业科技有限公司 一种木材单面表层密实化处理方法及产品
WO2014160938A1 (fr) * 2013-03-29 2014-10-02 Armstrong World Industries, Inc. Produits de bois hybrides
US9228093B2 (en) 2013-10-18 2016-01-05 Weyerhaeuser Nr Company Colored water-repellant and crocking-resistant compositions
CN106121182A (zh) * 2016-07-27 2016-11-16 广东皇田环保科技有限公司 一种高强度实木地板及其制作方法
CN106121183A (zh) * 2016-07-27 2016-11-16 广东皇田环保科技有限公司 一种高强度实木地板及其制作方法
EP3173201A1 (fr) * 2015-11-30 2017-05-31 Omya International AG Carbonate de calcium pour panneaux à particules
US10730202B2 (en) 2015-11-18 2020-08-04 SWISS KRONO Tec AG OSB (oriented strand board) wood material panel having improved properties and method for producing same
CN118991183A (zh) * 2024-09-27 2024-11-22 中南林业科技大学 一种轻炭化防变形多层板及其制造方法

Families Citing this family (13)

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RU2537442C2 (ru) * 2009-09-24 2015-01-10 Конинклейке Филипс Электроникс Н.В. Система для покрытия пола, включающая в себя систему освещения
CN102107446B (zh) * 2009-12-26 2013-09-25 浙江世友木业有限公司 一种表面增强实木型材及其制造方法
KR101333574B1 (ko) * 2010-10-25 2013-11-27 홍재철 연소온도 이하로 가열한 후에 탄화된 표피를 제거하는 것을 특징으로 하는 소나무 가공방법 및 상기 방법을 이용한 소나무 목재
CN102626940B (zh) * 2011-02-07 2016-03-30 刘锡丽 一种实木型材改良方法及其型材
CN102825643A (zh) * 2011-06-13 2012-12-19 承泰丰木业有限公司 防水的密集板
KR101338025B1 (ko) * 2011-09-21 2013-12-06 문중묵 고온 열처리 목재를 이용한 바닥재
CN103216075B (zh) * 2013-04-24 2016-06-01 琚长林 一种植物纤维地板及其制作方法
CN103696556A (zh) * 2013-12-31 2014-04-02 徐州中原木业有限公司 无机纳米银离子实木复合地板及其制作方法
CN105860295A (zh) * 2016-05-06 2016-08-17 王泽陆 低吸湿聚丁烯基木塑复合地板材料的制备方法
CN106049824A (zh) * 2016-07-20 2016-10-26 平湖信达软木工艺有限公司 新型加强复合型软木地板
CN106013723A (zh) * 2016-07-20 2016-10-12 平湖信达软木工艺有限公司 加强复合型软木地板
CN107083044A (zh) * 2017-05-22 2017-08-22 安徽三义和能源科技有限公司 一种抗压防火木塑材料的制备方法
CN111173226A (zh) * 2019-12-26 2020-05-19 安徽五秒达网络科技有限公司 一种复合型阻燃实木地板及其制备工艺

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KR100537541B1 (ko) * 2002-04-04 2005-12-16 주식회사 엘지화학 대칭구조를 이용한 무늬목과 합성수지층을 갖는마루바닥재 및 그 제조방법
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US4540624A (en) * 1984-04-09 1985-09-10 Westinghouse Electric Corp. Antistatic laminates containing long carbon fibers
JPH06280376A (ja) * 1993-03-26 1994-10-04 Noda Corp 建築用板
JP2003213913A (ja) * 2002-01-28 2003-07-30 Matsushita Electric Works Ltd 床 材
KR20060076144A (ko) * 2004-12-29 2006-07-04 주식회사 엘지화학 온돌마루 바닥재 및 이의 제조방법

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102071789A (zh) * 2009-11-23 2011-05-25 浙江世友木业有限公司 一种大幅面拼花地板的生产方法及大幅面拼花地板
CN102554980A (zh) * 2012-02-20 2012-07-11 浙江世友木业有限公司 一种单板层积材的制造方法
CN102672771A (zh) * 2012-05-31 2012-09-19 浙江林碳木业科技有限公司 一种木材单面表层密实化处理方法及产品
WO2014160938A1 (fr) * 2013-03-29 2014-10-02 Armstrong World Industries, Inc. Produits de bois hybrides
CN105102738A (zh) * 2013-03-29 2015-11-25 阿姆斯特郎世界工业公司 混合木质产品
AU2014240948B2 (en) * 2013-03-29 2016-10-20 Afi Licensing Llc Hybrid wood products
US9228093B2 (en) 2013-10-18 2016-01-05 Weyerhaeuser Nr Company Colored water-repellant and crocking-resistant compositions
US10730202B2 (en) 2015-11-18 2020-08-04 SWISS KRONO Tec AG OSB (oriented strand board) wood material panel having improved properties and method for producing same
AU2016363349B2 (en) * 2015-11-30 2019-04-18 Omya International Ag Calcium carbonate for particle boards
EP3173201A1 (fr) * 2015-11-30 2017-05-31 Omya International AG Carbonate de calcium pour panneaux à particules
WO2017093122A3 (fr) * 2015-11-30 2017-07-13 Omya International Ag Carbonate de calcium pour panneaux de particules
CN108367452A (zh) * 2015-11-30 2018-08-03 Omya国际股份公司 用于颗粒板的碳酸钙
EA034897B1 (ru) * 2015-11-30 2020-04-03 Омиа Интернэшнл Аг Карбонат кальция для древесно-стружечных плит
US10780605B2 (en) 2015-11-30 2020-09-22 Omya International Ag Calcium carbonate for particle boards
CN108367452B (zh) * 2015-11-30 2021-01-15 Omya国际股份公司 用于颗粒板的碳酸钙
CN106121183A (zh) * 2016-07-27 2016-11-16 广东皇田环保科技有限公司 一种高强度实木地板及其制作方法
CN106121182A (zh) * 2016-07-27 2016-11-16 广东皇田环保科技有限公司 一种高强度实木地板及其制作方法
CN118991183A (zh) * 2024-09-27 2024-11-22 中南林业科技大学 一种轻炭化防变形多层板及其制造方法

Also Published As

Publication number Publication date
CN101517177A (zh) 2009-08-26
KR100970112B1 (ko) 2010-07-15
KR20080028015A (ko) 2008-03-31
JP2010504866A (ja) 2010-02-18
JP5351026B2 (ja) 2013-11-27

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