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WO2008018967A3 - Method of making sputtering target and target produced - Google Patents

Method of making sputtering target and target produced Download PDF

Info

Publication number
WO2008018967A3
WO2008018967A3 PCT/US2007/015654 US2007015654W WO2008018967A3 WO 2008018967 A3 WO2008018967 A3 WO 2008018967A3 US 2007015654 W US2007015654 W US 2007015654W WO 2008018967 A3 WO2008018967 A3 WO 2008018967A3
Authority
WO
WIPO (PCT)
Prior art keywords
target
target material
melted
mold
sputtering target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/015654
Other languages
French (fr)
Other versions
WO2008018967A2 (en
Inventor
Michael G Launsbach
Tyrus W Hansen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Howmet Corp
Original Assignee
Howmet Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Howmet Corp filed Critical Howmet Corp
Priority to JP2009520756A priority Critical patent/JP2009543954A/en
Priority to EP07796745A priority patent/EP2043800A2/en
Publication of WO2008018967A2 publication Critical patent/WO2008018967A2/en
Publication of WO2008018967A3 publication Critical patent/WO2008018967A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D21/00—Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
    • B22D21/02—Casting exceedingly oxidisable non-ferrous metals, e.g. in inert atmosphere
    • B22D21/025—Casting heavy metals with high melting point, i.e. 1000 - 1600 degrees C, e.g. Co 1490 degrees C, Ni 1450 degrees C, Mn 1240 degrees C, Cu 1083 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
    • B22D27/04—Influencing the temperature of the metal, e.g. by heating or cooling the mould
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)

Abstract

Method of making a sputtering target includes the steps of melting a metallic target material, controlling the temperature of the melted target material in a manner that the melted target material has almost no superheat, introducing the melted target material into a mold having interior walls forming a mold cavity in the shape of the desired target, and solidifying the melted target material in the mold by extracting heat therefrom at a rate to solidify it to form a sputtering target having a cellular nondendritic microstructure uniformly throughout the target. A sputtering target is provided comprising a metallic target material having a substantially equiaxed, cellular nondendritic microstructure uniformly throughout the target.
PCT/US2007/015654 2006-07-17 2007-07-09 Method of making sputtering target and target produced Ceased WO2008018967A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009520756A JP2009543954A (en) 2006-07-17 2007-07-09 Method for producing sputtering target and sputtering target produced by the method
EP07796745A EP2043800A2 (en) 2006-07-17 2007-07-09 Method of making sputtering target and target produced

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US83152106P 2006-07-17 2006-07-17
US60/831,521 2006-07-17

Publications (2)

Publication Number Publication Date
WO2008018967A2 WO2008018967A2 (en) 2008-02-14
WO2008018967A3 true WO2008018967A3 (en) 2008-11-27

Family

ID=39033456

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/015654 Ceased WO2008018967A2 (en) 2006-07-17 2007-07-09 Method of making sputtering target and target produced

Country Status (6)

Country Link
US (1) US20080011392A1 (en)
EP (1) EP2043800A2 (en)
JP (1) JP2009543954A (en)
CN (1) CN101490290A (en)
TW (1) TW200811304A (en)
WO (1) WO2008018967A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013158200A1 (en) * 2012-04-20 2013-10-24 Fs Precision Tech Single piece casting of reactive alloys
CN103924122B (en) * 2014-04-30 2016-01-20 厦门建霖工业有限公司 A kind of zirconium silver alloys target and preparation method thereof and application
JP2018178251A (en) * 2017-04-07 2018-11-15 三菱マテリアル株式会社 Cylindrical sputtering target and manufacturing method of the same
CN112962070B (en) * 2021-02-02 2023-02-07 邱从章 Preparation equipment and preparation method of sputtering target material

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4832112A (en) * 1985-10-03 1989-05-23 Howmet Corporation Method of forming a fine-grained equiaxed casting
US6799627B2 (en) * 2002-06-10 2004-10-05 Santoku America, Inc. Castings of metallic alloys with improved surface quality, structural integrity and mechanical properties fabricated in titanium carbide coated graphite molds under vacuum
US20050183797A1 (en) * 2004-02-23 2005-08-25 Ranjan Ray Fine grained sputtering targets of cobalt and nickel base alloys made via casting in metal molds followed by hot forging and annealing and methods of making same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5590389A (en) * 1994-12-23 1996-12-31 Johnson Matthey Electronics, Inc. Sputtering target with ultra-fine, oriented grains and method of making same
US5866067A (en) * 1997-03-24 1999-02-02 Sony Corporation And Materials Research Corporation High purity chromium metal by casting with controlled oxygen content
AU2002236551A1 (en) * 2001-07-19 2003-03-03 Honeywell International Inc. Sputtering targets, sputter reactors, methods of forming cast ingots, and methods of forming metallic articles
US7235143B2 (en) * 2002-08-08 2007-06-26 Praxair S.T. Technology, Inc. Controlled-grain-precious metal sputter targets
US6805189B2 (en) * 2002-10-30 2004-10-19 Howmet Research Corporation Die casting

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4832112A (en) * 1985-10-03 1989-05-23 Howmet Corporation Method of forming a fine-grained equiaxed casting
US6799627B2 (en) * 2002-06-10 2004-10-05 Santoku America, Inc. Castings of metallic alloys with improved surface quality, structural integrity and mechanical properties fabricated in titanium carbide coated graphite molds under vacuum
US20050183797A1 (en) * 2004-02-23 2005-08-25 Ranjan Ray Fine grained sputtering targets of cobalt and nickel base alloys made via casting in metal molds followed by hot forging and annealing and methods of making same

Also Published As

Publication number Publication date
WO2008018967A2 (en) 2008-02-14
EP2043800A2 (en) 2009-04-08
JP2009543954A (en) 2009-12-10
CN101490290A (en) 2009-07-22
US20080011392A1 (en) 2008-01-17
TW200811304A (en) 2008-03-01

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