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WO2008016725A2 - Tuyau calorifique avec matériau de mèche nanostructuré - Google Patents

Tuyau calorifique avec matériau de mèche nanostructuré Download PDF

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Publication number
WO2008016725A2
WO2008016725A2 PCT/US2007/063337 US2007063337W WO2008016725A2 WO 2008016725 A2 WO2008016725 A2 WO 2008016725A2 US 2007063337 W US2007063337 W US 2007063337W WO 2008016725 A2 WO2008016725 A2 WO 2008016725A2
Authority
WO
WIPO (PCT)
Prior art keywords
approximately
heat pipe
nanowires
center
wicking material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/063337
Other languages
English (en)
Other versions
WO2008016725A3 (fr
Inventor
Youssef M Habib
Lyman H. Rickard
John G. Bryan
John W. Steinbeck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illuminex Corp
Original Assignee
Illuminex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illuminex Corp filed Critical Illuminex Corp
Priority to CA002657423A priority Critical patent/CA2657423A1/fr
Priority to EP07840139A priority patent/EP1996887A2/fr
Priority to US12/281,511 priority patent/US20100200199A1/en
Publication of WO2008016725A2 publication Critical patent/WO2008016725A2/fr
Publication of WO2008016725A3 publication Critical patent/WO2008016725A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Definitions

  • Heat pipes are the method of choice for electronic systems thermal management because of the performance advantages they have over conventional aluminum extrusion heat sinks and other solid state cooling technologies.
  • a heat pipe cooler uses the high efficiency evaporation and condensation cycles of a working fluid to transfer heat as shown in Figure 1.
  • heat pipes do not require mechanical pumps, switches, valves or consume any power. Consequently heat pipes are quieter, more efficient, have no operating cost and are more reliable than other thermal management systems.
  • the functional components of a heat pipe are the wick, the working fluid, and the package housing them.
  • the wick acts on a coolant (working fluid) in a liquid phase to move the working fluid from the sink (condenser) to the source (evaporator) by means of capillary action.
  • the center of the heat pipe enclosure is open and free of obstruction.
  • the working fluid moves through the wick to the evaporator, in the opposite direction of the gas phase that moves in the open space to the condensor.
  • a phase change from liquid into vapor occurs, while at the cool side, the phase change from vapor into liquid occurs.
  • Heat transport is accomplished by the removal of heat through the latent heat of evaporation and cooling through the latent heat of condensation.
  • the wicking material passively transports the liquid thus making a cycle that continuously cools the heat generating element.
  • the center of the heat pipe continuously transports the vapor via a pressure differential between the hot and cold ends of the heat pipe
  • the invention is a heat pipe where the wicking structure is nanostructured, meaning that the cross sectional dimension of the elementary structures comprising the wicking material are on the order of approximately 10 to 400 nanometers with spacings between the elements between approximately 20 to 600 nanometers, center to center that residing within the interior surface of the enclosed space (package) of the heat pipe and a method of making the nanostructures.
  • the nanostructures are bristles or a plurality of nano wires that are attached on one end to the interior surface of the heatpipe.
  • nanowire it is meant a wire whose cross sectional dimension is between approximately 10 nanometers and approximately 400 nanometers.
  • the nanowires are also substantially free-standing, that is, they are surrounded on the sides by the working fluid in either the liquid phase or gas phase, not a substrate other than the substrate they are grown on, template or other support material. Groups of nanowires are also referred to herein as bristles or nanobristles.
  • the nanostructured wicking material provides improved capillary action for transporting liquid and a low thermal resistance to vapor evolution for improved evaporation and transport compared to conventional wick geometries. Therefore, nanostructured bristle wicks enable more efficient heat exchange in a heat pipe.
  • the wick structure must accommodate two physical behaviors in the heat pipe. At the evaporator, a low thermal resistance is required, while to transport the liquid from the condenser through the adiabatic region and back to the evaporator, a high capillary pumping pressure is desired. This can lead to heat pipes with hybrid or composite wicks to accommodate these two regions. In the present invention, this can be accomplished by engineering nanowires of different dimensions in the two areas of relevance.
  • the heat pipe wicking material is shown schematically in Figure 2.
  • the device has many of the same attributes of larger heat pipe structures.
  • the device comprises a metallic enclosure with a wick material on its inner walls.
  • the wick comprises an array of substantially vertically aligned copper nanowires extending out from the walls of the enclosure.
  • the wires are between 10 and 400 nm in diameter, spaced at 20 to 600 nm and are up to approximately 250 microns in length.
  • SEM micrographs of copper nanowire arrays that can be used for the wick application are also shown in Figure 6 and 7.
  • the wick performs similarly to conventional wicks in that capillary action is used as the mechanism to pump a working fluid to the evaporator.
  • the significant advantage possessed by the nanowire device is that the boiling surface area available in the nanowire array can be well in excess of 1000 cm per square centimeter of the surface area of the heat pipe surface that it occupies. This is to be compared with boiling surface areas of only a few cm per cm in grooved heat pipes and a few tens of cm 2 in sintered metal powder devices. This enhancement to the surface area can potentially result in a several fold improvement in heat flux transport enabling devices that can remove up to several hundred W/ cm .
  • the nanobristle array wick allows the height, or profile, of the entire heat pipe to be reduced to less than 1 mm (0.040") and can be used where conventional heat pipe devices and cooling technologies are inadequate. This is critical for portable electronic devices that utilize ever increasingly powerful (heat generating) processors in smaller and smaller packages.
  • Figure 3 schematically shows a thermal bus architecture utilizing nanobristle heat pipe technology as the key link between the high power circuits and the external thermal bus.
  • the current heat pipe technology typically limits the wicking structure to a minimum thickness of lmm to provide adequate cooling.
  • the heat pipe has to be greater than about 2 mm thick, plus packaging, plus evaporation space.
  • 5 mm in width is a minimum dimension.
  • the wicking structure has to be smaller.
  • the current invention can be used to create wicking structures that are only about 50-100 microns (1Ox improvement) in bristle wick length, thus making it possible for a 300 micron width copper layer sufficient to enclose the heat pipe volume while still providing the same heat transport capacity..
  • the invention permits a heat pipe with a 900 micron cross section or less. This reduces weight and size for the same amount of heat transfer efficiency.
  • the nano-structured wicking material exhibits improved capillary action and lower thermal resistance.
  • the bristle structures are arrayed.
  • the bristles have a uniform size and spacing that can be controlled to optimize the capillary action and thermal resistance for a particular application.
  • a 35% to 50% reduction in thermal resistance than sintered copper powder wicks can be achieved by means of the use of nanostructured wicking materials.
  • Sintered copper powder is the industry preference and currently exhibits the lowest thermal resistance of all currently commercially distributed heat pipe wick structures.
  • nanowire array heat pipe can be built with an extremely thin profile and that the nanowire wick will enable operation at any orientation.
  • Devices less than 1 mm thick can be built that can be directly incorporated into high power component packages. This design flexibility can enable the top of the heat pipe to be specifically designed to incorporate a coupling structure so that the device can be efficiently mated to a thermal (heat pipe) bus as well as the device to be cooled.
  • Heat pipes are well known heat transfer devices that are highly useful for heat management in electronic devices and packaging. Heat pipes are disclosed in a number of U.S. patents, including 3,952,798, issued on April 27, 1976, which is incorporated herein by reference for all that it teaches.
  • Figure 2 Diagram of a nanobristle array.
  • Figure 3 Electronic systems thermal management concept utilizing nanobristle wick
  • Metallic nanowires can be produced using an aluminum oxide template, are also disclosed in the articles listed in the following list, and each is incorporated herein by reference for all that they teach:
  • the preferred embodiment uses alumina as the template and copper as both the substrate and the bristle.
  • the method of forming is as follows:
  • Nanobristle arrays using porous Al 2 O 3 as a template have been successfully engineered using electrodeposition of Cd, Fe, Au, Ag, Cu, Ni, and other metals from aqueous solution, as further disclosed in the articles listed in the following and incorporated herein by reference: Y. Peng, H. Zhang, S. Pan, and H. Li, Jour. Appl. Phys. 87, 7405 (2000) and A. Jansson, G. Thornell, and S. Johansson, J.
  • the alumina template (alumina clad on copper or the Anodisc filter) is removed by etching in 1 M NaOH.
  • Figure 6 shows an SEM micrograph of copper nanobristles formed from aluminum clad on copper. In the preferred embodiment, the resulting nanobristles range in diameter from 100 - 250 nm with a height of 30- 70 ⁇ m and a separation of 75-200 nm depending on the anodization conditions.
  • Figure 7 shows an SEM image of a nanobristle array prepared by using an Anodisc filter. The nanobristles had diameters ranging from 150 - 300 nm, lengths of 2 - 7 ⁇ m and spacing of 90 - 220 nm.
  • the heat flux capacities obtained for the prototypes provide the required capacities for the current Hewlett Packard and AMD chip packages (80-100 W/cm2) and new generation microprocessors such as the Intel Pentium 4 Extreme Edition (150 W/cm2).
  • the thermal resistances measured for the nanobristle wicks were 25-30% lower than current sintered copper heat pipes. This improvement in thermal resistance coupled with the low profile ( ⁇ 100 ⁇ m compared to ⁇ 1 mm for sintered copper) is very attractive for the production of new heat pipes.
  • Techniques have been developed for monitoring the uniformity of the nanobristle arrays. In the first method a prototype nano-bristle wick inspection system (shown schematically in Figure 9 measures the reflectivity of the surface at one wavelength as an indication of the array uniformity.
  • the nanowire wick has anisotropic flow characteristics.
  • the flow channels through the wick are narrow in the plane of the device, but are long normal to the substrate surface.
  • the capillary pressure should be high as the high surface area provides high surface tension.
  • the flow resistance in the plane of the wick may be low, however, since the net channel cross-section can be as high as 10 micron for 100 micron wires spaced 100 nm apart. This is nearly comparable to the channel cross-section in sintered powder wicks made of 15 micron particles.
  • Flow normal to the plane of the nanowire device will be unimpeded as illustrated in Figure 11. This provides a significant advantage as convection currents in the working fluid will easily circulate to the vapor chamber, potentially minimizing bubble formation.
  • the potential combination of these characteristics in the nanowire wick can result in a device with unprecedented thermal performance.
  • nanostructures including nanowires can be used at the evaporator, condenser, and return path regions of the heat pipe.
  • different wick materials could be used to feed the working fluid to the nanowires at the evaporator.
  • a conventional wick could be hybridized with the nanowire wick, either selectively or patterned throughout the inner wick structure of the heat pipe.
  • a sintered powder wick can be used in one part of the pipe while the nanostructure wick is used in another.
  • the sintered metal powder example assumes a 1 mm thick coating and thus has a BSR/t calculated to be about .035.
  • the metal whisker approach has a higher BSR/t than the sintered powder, calculated to be about .054.
  • These prior art materials exhibit a BSR on the order of 3 to 5 for wick thicknesses of 100 microns.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Brushes (AREA)

Abstract

L'invention concerne un tuyau calorifique avec une mèche nanostructurée, ainsi que le procédé de fabrication de la mèche nanostructurée sur un substrat métallique. Le matériau de mèche est un motif de nanostructures métalliques sous la forme de soies ou fils attachés à un substrat, les soies étant sensiblement librement dressés.
PCT/US2007/063337 2006-03-03 2007-03-05 Tuyau calorifique avec matériau de mèche nanostructuré Ceased WO2008016725A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CA002657423A CA2657423A1 (fr) 2006-03-03 2007-03-05 Tuyau calorifique avec materiau de meche nanostructure
EP07840139A EP1996887A2 (fr) 2006-03-03 2007-03-05 Tuyau calorifique avec matériau de mèche nanostructuré
US12/281,511 US20100200199A1 (en) 2006-03-03 2007-03-05 Heat Pipe with Nanostructured Wick

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US77887306P 2006-03-03 2006-03-03
US66/778,873 2006-03-03
US88839107P 2007-02-06 2007-02-06
US60/888,391 2007-02-06

Publications (2)

Publication Number Publication Date
WO2008016725A2 true WO2008016725A2 (fr) 2008-02-07
WO2008016725A3 WO2008016725A3 (fr) 2008-08-07

Family

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Application Number Title Priority Date Filing Date
PCT/US2007/063337 Ceased WO2008016725A2 (fr) 2006-03-03 2007-03-05 Tuyau calorifique avec matériau de mèche nanostructuré

Country Status (4)

Country Link
US (1) US20100200199A1 (fr)
EP (1) EP1996887A2 (fr)
CA (1) CA2657423A1 (fr)
WO (1) WO2008016725A2 (fr)

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