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WO2008009670A1 - Procédé de création d'une liaison par soudage ou diffusion - Google Patents

Procédé de création d'une liaison par soudage ou diffusion Download PDF

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Publication number
WO2008009670A1
WO2008009670A1 PCT/EP2007/057359 EP2007057359W WO2008009670A1 WO 2008009670 A1 WO2008009670 A1 WO 2008009670A1 EP 2007057359 W EP2007057359 W EP 2007057359W WO 2008009670 A1 WO2008009670 A1 WO 2008009670A1
Authority
WO
WIPO (PCT)
Prior art keywords
components
functional coating
nanocrystalline layer
reactive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/057359
Other languages
German (de)
English (en)
Inventor
Jean Pierre Bergmann
Johannes Wilden
Simon Jahn
Markus Dolles
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technische Universitaet Ilmenau
Original Assignee
Technische Universitaet Ilmenau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technische Universitaet Ilmenau filed Critical Technische Universitaet Ilmenau
Publication of WO2008009670A1 publication Critical patent/WO2008009670A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0006—Exothermic brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B23K20/165—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas involving an exothermic reaction of the interposed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/006—Vehicles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles

Definitions

  • the invention relates to a method for producing a soldering or diffusion bonding of components of the same or different, in particular metallic, materials, which are provided for functional reasons with at least one coating. Furthermore, the invention relates to a compound of components of the same or different materials.
  • Bonding (joining) metallic materials coated with a low melting functional coating often causes problems in conventional molten processes.
  • the functional coatings melt and evaporate, resulting in the formation of pores and the occurrence of splashes. This is true for both welding and brazing.
  • the high working temperature which is significantly lower compared to welding, also leads to melting and evaporation of the low melting functional coating, e.g. zinc-based.
  • the functional coating is used as corrosion protection, in the case of zinc theoretically, the base material can still be protected by the anodic action of the remaining layer. In practice, these flaws usually act as possible corrosion spots.
  • brazing by laser technology or novel short arc technique is increasingly used for the joining of such materials.
  • the additional materials used for this purpose At present, they are usually based on copper or aluminum, and due to their high processing temperature, which is usually above the evaporation temperature of the functional coating, they cause injury or destruction of the same.
  • Fig. 1 shows a known from the prior art overlap connection of a first component Ol and a second component 02.
  • the components Ol, 02 consist for example of steel and have a coating 03 made of zinc as a functional coating.
  • the components 01, 02 are connected to each other with a solder joint 04.
  • Hidden points 06 can not be connected over the entire surface using both laser technology and arc technology. The gap filling of these methods is too low.
  • the strength of the compound 04 can thus be achieved only by over-arching the seam.
  • due to the pronounced energy input the thermal influence of the base materials and thus the reduction of the mechanical strength and the deterioration of the technological properties occur in a relatively wide range in addition to the seam.
  • the zinc layer 03 fully constantly melted.
  • the temperature, the speed (up to 30 m / s) and the absolute energy of the joining process can be controlled. Due to the high process speed and the low heat capacity in the joining zone, the components remain "cold.”
  • the intermediate layers of nanocrystalline reactive materials can also be used as solder foils according to the solution known from US Pat. No. 6,991,856 B2, at which point either the solder foils in one be positioned separately or responding to the additional work step Foil are applied.
  • the provision of the solder melt always represents an additional step.
  • the proposed method makes it possible to provide the necessary heat in the direct contact area, without affecting the actual component material in many areas thermally.
  • the small dimensions of the film result in a fine-grained microstructure resulting in no negative influence on the mechanical and technological properties of the joint, and the necessary activation energy for the reaction process is currently being used realized by a local short circuit on the film, which exceeds the necessary energy density and thereby the reaction is triggered.
  • the object of the invention is to combine components of the same or different materials, of which at least one has a functional coating, without the use of additional materials.
  • the inventive method is characterized in that components made of the same or different materials, such as metallic materials, of which at least one with a functional coating (eg., Galvanized steel material / galvanized steel material or galvanized steel material / aluminum or galvanized steel material / magnesium) is provided by the use of reactive nanocrystalline Layers that are inserted or applied directly to the components to be joined, can be joined.
  • a functional coating eg., Galvanized steel material / galvanized steel material or galvanized steel material / aluminum or galvanized steel material / magnesium
  • this represents a local heat source and supplies the necessary energy for melting the functional coating arranged on the reactive nanocrystalline layer, whereby the functional coating is cooled after the functional coating and the components have cooled as a solder or diffusion material, a connection between the functional coating of the respective component and the nanocrystalline layer and / or by suitable structuring of the nanocrystalline layer between the functional coatings of the components (over the surface of the recess, the connection surface can be determined).
  • the component preferably has a much higher melting temperature than its functional coating, for example by a low-melting functional coating, so that the method according to the invention does not thermally influence the component except for the molten functional coating.
  • the molten functional coating is used directly as "in-situ" produced solder or diffusion material, without an additional material supply before or during the process takes place from the outside.With the small thickness of the reactive nanocrystalline layer or film joining compounds can be realized have only a minimal increase in the area of the joint.
  • the change in the material structure leads, for example, to a deterioration of the mechanical-technological property profile.
  • the thickness of the functional coating is z. B. in galvanized steel materials 5 to 200-300 microns, so that there is a sufficient Lotreservoir.
  • the reactive nanocrystalline layer used is preferably a reactive nanocrystalline film, for example so-called nanofoils.
  • the cooling of the functional coating and the components is preferably carried out under the action of a joining pressure, which is applied by means of a pressing device.
  • a rapid resistance heating via an electric current flow can be used for the activation of the reactive nanocrystalline layer.
  • significantly lower current intensities are sufficient for this in comparison to the resistance point or hunchback welding, so that structural changes in the material or the melting of the functional coating to the side facing the electrode are avoided.
  • the contact it is possible to use the contact provide for the supply of the necessary current to build up the required contact pressure.
  • the reaction of the nanocrystalline layer triggered by the current pulse and the rapid resistance heating serves as an energy supply and leads to superficial melting of the low-melting functional coating of the components to be joined, whereby a thermal influence on the remaining component material can be prevented. Due to the short reaction time and the low energy supply, pronounced cooling rates and very short reaction times occur, which prevents formation of intermetallic phases at the contact point and thus counteracts embrittlement of the joint.
  • the melting can be limited to the total thickness, so that a failure-free joining of the components can be assumed.
  • the melting of the functional coating can be controlled by supplying additional energy into the functional coating. The energy necessary for melting the functional coating can also be applied by the nanocrystalline layer in such a way that size effects are utilized for this purpose.
  • Fig. 1 a solder joint according to the prior art, without flowing the solder into the gap
  • Fig. 2 two embodiments of the invention
  • FIG. 3 shows a further embodiment of the method according to the invention, in which a connection is effected by wetting or interaction of the functional coating with the exothermically reacting film;
  • Fig. 4 a basic arrangement for carrying out the method according to the invention.
  • Fig. 1 shows a solder joint according to the prior art, which is described in the introduction to the description.
  • FIG. 2 illustrates two embodiments of the method according to the invention respectively before and after the connection has been established.
  • FIG. 2 a shows a reactive nanocrystalline film 10, which is arranged between a first component 11 and a second component 12.
  • the reactive nanocrystalline film 10 has cavities 13.
  • the components 11, 12 have a coating 14 made of zinc.
  • Figure b) of Figure 2 shows the reactive nanocrystalline film 10 shown in Figure a) with the cavities 13 in detail.
  • the cavities 13 may also have any other geometric structure instead of a strip shape in other embodiments.
  • Figure c) of Fig. 2 shows the arrangement shown in Figure a), after the permanent connection between the components 11, 12 was created. The cavities 13 are now filled with the coating material.
  • FIG. 2 d shows another embodiment, in which again the reactive nanocrystalline film 10 is arranged between the first component 11 and the second component 12.
  • the reactive nanocrystalline film 10 with the cavities 13 is shown in detail in FIG. 2 e) of FIG. Figure f) of Fig. 2 shows the arrangement shown in Figure c), after the permanent connection between the components 11, 12 has been created.
  • the cavities 13 are now filled with the coating material.
  • the low-melting functional coating present on the metallic component (s) 11, 12 as coating 14 is used as solder material, the necessary energy for melting this layer and the resulting solder or diffusion bond from the reactive nanocrystal film 10 targeted and locally limited is provided in the joint.
  • This nanocrystalline film 10 can be contoured as desired, so that a flow of the molten functional layer and a metallurgical bond can be achieved. Consequently, no additional flux and / or other filler materials, as usual in soldering, needed in this joining process.
  • the low-melting functional coating embodied as coating 14 is melted only partially and not completely.
  • the functional coating embodied as a coating 14 is retained on the components 11, 12 to be joined (insofar as it was applied there prior to joining) and is not destroyed.
  • the components 11, 12 are pressed against each other both in the butt and in the lap joint after the exothermically reacting nanocrystalline film 10 has been positioned therebetween. After starting the exothermic reaction, the joining zone is briefly heated locally due to the continuous reaction front.
  • portions of the functional coating formed as the coating 14 may be melted and either wet the exothermic film 10, interact with it, or connect to the second component by conforming the film.
  • the functional coating serves as solder or additional material produced "in-situ.”
  • the time span in which the solder or filler material is in the molten phase is in the millisecond range
  • Another object, such as corrosion protection, is to promote the formation of the solder and / or diffusion bond.
  • Fig. 3 illustrates another embodiment of the method according to the invention.
  • Figure a) of Figure 3 shows the arrangement before the connection has been made.
  • Figure b) of Figure 3 shows the arrangement after the connection has been made.
  • the arrangement again comprises the reactive nanocrystalline film 10, which is arranged between the first component 11 and the second component 12.
  • the components 11, 12 in turn have the coating 14 made of zinc.
  • Figure b) of Fig. 3 shows the arrangement shown in Figure a), after the connection between the two components 11, 12 has been created.
  • the coatings 14 on the two components 11, 12 now have a thickness between 0 microns and d.
  • Between the reactive nanocrystalline film 10 and one of the Components 11, 12 wetting areas 16 are formed.
  • the wetting areas 16 may additionally or alternatively be formed as a region of interaction between the reactive nanocrystalline foil 10 and one of the components 11, 12.
  • FIG. 4 shows an embodiment of the method according to the invention in which the exothermic reaction of the reactive nanocrystalline film 10 arranged between the first component 11 and the second component 12 is triggered by resistance heating.
  • a first electrode 17 is arranged on the first component 11 and a second electrode 18 on the second component 12. Via the electrodes 17, 18 flows an electric current of a current source 19 through the two components 11, 12 and the reactive nanocrystalline film 10.
  • the components 11, 12 in turn have the coating 14 made of zinc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

L'invention concerne un procédé de création d'une liaison par soudage ou diffusion de composants en matériaux identiques ou différents, notamment métalliques, pourvus d'un revêtement pour des raisons fonctionnelles. L'invention concerne également une liaison de composants en matériaux identiques ou différents. Le procédé selon l'invention est caractérisé en ce que les composants en matériaux identiques ou différents, notamment en matériaux métalliques, dont au moins un est pourvu d'un revêtement fonctionnel, peuvent être assemblés au moyen de couches nanocristallines réactives intégrées aux composants à assembler ou appliquées directement sur ceux-ci. Après déclenchement d'une réaction exothermique dans la couche nanocristalline réactive, cette dernière constitue une source de chaleur locale et fournit l'énergie nécessaire à la fusion du revêtement fonctionnel, une liaison entre la couche nanocristalline réactive et le composant respectif et/ou entre les composants étant créée après refroidissement du revêtement fonctionnel et des composants.
PCT/EP2007/057359 2006-07-20 2007-07-17 Procédé de création d'une liaison par soudage ou diffusion Ceased WO2008009670A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006035765.5 2006-07-20
DE102006035765A DE102006035765A1 (de) 2006-07-20 2006-07-20 Verfahren und Anordnung zum Erzeugen einer Löt- oder Diffusionsverbindung von Bauteilen aus gleichen oder unterschiedlichen Werkstoffen

Publications (1)

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WO2008009670A1 true WO2008009670A1 (fr) 2008-01-24

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WO (1) WO2008009670A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102039484A (zh) * 2010-11-30 2011-05-04 上海工程技术大学 一种用于金属材料的低温扩散焊接方法
CN102069295A (zh) * 2010-12-09 2011-05-25 上海工程技术大学 强化层扩散连接制备Fe3Al/Al复合结构的方法
WO2010108734A3 (fr) * 2009-03-25 2012-03-08 Robert Bosch Gmbh Liaison électrique de paires de conducteurs individuels et procédé de fabrication
WO2013124447A1 (fr) * 2012-02-22 2013-08-29 Tubefuse Applications B.V. Procédé et machine pour le soudage à la forge d'articles tubulaires et flux de mélange exothermique et procédé de fabrication d'un flux de mélange exothermique
CN103506752A (zh) * 2013-10-11 2014-01-15 江苏大学 一种制备块体纳米晶合金材料的方法
EP2883024A2 (fr) * 2012-08-10 2015-06-17 Werthschützky, Roland Capteur à connectique simple
EP3017905A1 (fr) * 2014-11-10 2016-05-11 MAGNA STEYR Engineering AG & Co KG Procédé destiné à relier deux composants plats

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009001850A1 (de) * 2009-03-25 2010-09-30 Robert Bosch Gmbh Elektrische Verbindung paarweiser Leiterenden und Verfahren zur Herstellung der Verbindung
DE102019102544B4 (de) 2019-02-01 2025-12-04 Vacuumschmelze Gmbh & Co. Kg Verfahren zur vorbehandlung von edelstahlsubstraten vor dem löten mittels nanokristalliner lötfolien

Citations (6)

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Publication number Priority date Publication date Assignee Title
JPH03165968A (ja) * 1989-11-22 1991-07-17 Aisin Seiki Co Ltd 亜鉛メッキ鋼板の接合方法
US20050051607A1 (en) * 2000-05-02 2005-03-10 Jiaping Wang Nanostructured soldered or brazed joints made with reactive multilayer foils
WO2005051815A2 (fr) * 2003-07-23 2005-06-09 Johns Hopkins University Procede d'assemblage au moyen de feuilles multicouches reactives a regulation amelioree de matieres d'assemblage fondus
JP2005205459A (ja) * 2004-01-23 2005-08-04 Matsushita Electric Ind Co Ltd 被接合体の接合方法
JP2005297014A (ja) * 2004-04-13 2005-10-27 Honda Motor Co Ltd アルミニウム系部材の接合方法
US6991856B2 (en) * 2000-05-02 2006-01-31 Johns Hopkins University Methods of making and using freestanding reactive multilayer foils

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03165968A (ja) * 1989-11-22 1991-07-17 Aisin Seiki Co Ltd 亜鉛メッキ鋼板の接合方法
US20050051607A1 (en) * 2000-05-02 2005-03-10 Jiaping Wang Nanostructured soldered or brazed joints made with reactive multilayer foils
US6991856B2 (en) * 2000-05-02 2006-01-31 Johns Hopkins University Methods of making and using freestanding reactive multilayer foils
WO2005051815A2 (fr) * 2003-07-23 2005-06-09 Johns Hopkins University Procede d'assemblage au moyen de feuilles multicouches reactives a regulation amelioree de matieres d'assemblage fondus
JP2005205459A (ja) * 2004-01-23 2005-08-04 Matsushita Electric Ind Co Ltd 被接合体の接合方法
JP2005297014A (ja) * 2004-04-13 2005-10-27 Honda Motor Co Ltd アルミニウム系部材の接合方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010108734A3 (fr) * 2009-03-25 2012-03-08 Robert Bosch Gmbh Liaison électrique de paires de conducteurs individuels et procédé de fabrication
CN102039484A (zh) * 2010-11-30 2011-05-04 上海工程技术大学 一种用于金属材料的低温扩散焊接方法
CN102069295A (zh) * 2010-12-09 2011-05-25 上海工程技术大学 强化层扩散连接制备Fe3Al/Al复合结构的方法
WO2013124447A1 (fr) * 2012-02-22 2013-08-29 Tubefuse Applications B.V. Procédé et machine pour le soudage à la forge d'articles tubulaires et flux de mélange exothermique et procédé de fabrication d'un flux de mélange exothermique
AU2013224000B2 (en) * 2012-02-22 2016-09-29 Enventure Global Technology Inc. Method and machine for forge welding of tubular articles and exothermic flux mixture and method of manufacturing an exothermic flux mixture
US9561559B2 (en) 2012-02-22 2017-02-07 Tubefuse Applications B.V. Method and machine for forge welding of tubular articles and exothermic flux mixture and method of manufacturing an exothermic flux mixture
EP2883024A2 (fr) * 2012-08-10 2015-06-17 Werthschützky, Roland Capteur à connectique simple
CN103506752A (zh) * 2013-10-11 2014-01-15 江苏大学 一种制备块体纳米晶合金材料的方法
CN103506752B (zh) * 2013-10-11 2016-08-17 江苏大学 一种制备块体纳米晶合金材料的方法
EP3017905A1 (fr) * 2014-11-10 2016-05-11 MAGNA STEYR Engineering AG & Co KG Procédé destiné à relier deux composants plats

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