[go: up one dir, main page]

WO2008008711A3 - Ion exchange treatment of chemical mechanical polishing slurry - Google Patents

Ion exchange treatment of chemical mechanical polishing slurry Download PDF

Info

Publication number
WO2008008711A3
WO2008008711A3 PCT/US2007/072970 US2007072970W WO2008008711A3 WO 2008008711 A3 WO2008008711 A3 WO 2008008711A3 US 2007072970 W US2007072970 W US 2007072970W WO 2008008711 A3 WO2008008711 A3 WO 2008008711A3
Authority
WO
WIPO (PCT)
Prior art keywords
ion exchange
mechanical polishing
chemical mechanical
polishing slurry
exchange treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/072970
Other languages
French (fr)
Other versions
WO2008008711A2 (en
Inventor
Peter Porshnev
Benjamin R Roberts
Michael Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Edwards Vacuum LLC
Original Assignee
Applied Materials Inc
Edwards Vacuum LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Edwards Vacuum LLC filed Critical Applied Materials Inc
Publication of WO2008008711A2 publication Critical patent/WO2008008711A2/en
Publication of WO2008008711A3 publication Critical patent/WO2008008711A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/42—Treatment of water, waste water, or sewage by ion-exchange
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/66—Treatment of water, waste water, or sewage by neutralisation; pH adjustment
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2101/00—Nature of the contaminant
    • C02F2101/10—Inorganic compounds
    • C02F2101/20—Heavy metals or heavy metal compounds
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
    • C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00—Controlling or monitoring parameters in water treatment
    • C02F2209/005—Processes using a programmable logic controller [PLC]
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00—Controlling or monitoring parameters in water treatment
    • C02F2209/06—Controlling or monitoring parameters in water treatment pH
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00—Controlling or monitoring parameters in water treatment
    • C02F2209/40—Liquid flow rate

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Treatment Of Water By Ion Exchange (AREA)

Abstract

A CMP slurry (408) is treated by ion exchange (82) in a CMP slurry treatment apparatus (100) which can accept slurries containing particles of metals and other abrasion byproducts. The apparatus comprises an ion exchange column (82) comprising a tank which contains a resin bed of resin beads that extract the hazardous materials, such as metals like copper, from the CMP slurry passed through the tank.
PCT/US2007/072970 2006-07-10 2007-07-06 Ion exchange treatment of chemical mechanical polishing slurry Ceased WO2008008711A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US83002406P 2006-07-10 2006-07-10
US60/830,024 2006-07-10
US77364207A 2007-07-05 2007-07-05
US11/773,642 2007-07-05

Publications (2)

Publication Number Publication Date
WO2008008711A2 WO2008008711A2 (en) 2008-01-17
WO2008008711A3 true WO2008008711A3 (en) 2008-10-02

Family

ID=38924056

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/072970 Ceased WO2008008711A2 (en) 2006-07-10 2007-07-06 Ion exchange treatment of chemical mechanical polishing slurry

Country Status (1)

Country Link
WO (1) WO2008008711A2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060138050A1 (en) * 2000-01-03 2006-06-29 Juzer Jangbarwala Method and apparatus for metal removal by ION exchange

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060138050A1 (en) * 2000-01-03 2006-06-29 Juzer Jangbarwala Method and apparatus for metal removal by ION exchange

Also Published As

Publication number Publication date
WO2008008711A2 (en) 2008-01-17

Similar Documents

Publication Publication Date Title
Guimaraes et al. Batch and fixed-bed assessment of sulphate removal by the weak base ion exchange resin Amberlyst A21
Rathore et al. Competitive adsorption of arsenic and fluoride onto economically prepared aluminum oxide/hydroxide nanoparticles: multicomponent isotherms and spent adsorbent management
WO2006074248A3 (en) Engineered non-polymeric organic particles for chemical mechanical planarization
Sahu et al. Adsorption of safranin-O dye on CO 2 neutralized activated red mud waste: process modelling, analysis and optimization using statistical design
EA200900789A1 (en) SORBENT FOR CLEANING WATER FROM HEAVY METAL IONS
TWI350564B (en) Polising slurry for chemical mechanical polishing (cmp) and polishing method
IL187914A0 (en) Integrated chemical mechanical polishing composition and process for single platen processing
IL188247A0 (en) Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components
TW200718647A (en) Method for preparing of cerium oxide powder for chemical mechanical polishing and method for preparing of chemical mechanical polishing slurry using the same
IL189305A0 (en) High throughput chemical mechanical polishing composition for metal film planarization
ATE549426T1 (en) GRINDING PRESSURE WITH IMPROVED MACHINABILITY
TW200720383A (en) Polishing fluids and methods for CMP
MY149008A (en) Aqueous fluid compositions for abrasive slurries, methods of production, and methods of use thereof
EP1856229A4 (en) Polishing slurries and methods for chemical mechanical polishing
EP1302522A3 (en) Gel-free colloidal abrasive and polishing compositions and methods of using them
WO2005072332A3 (en) Chemical mechanical planarization process control utilizing in-situ conditioning process
TW200740973A (en) Adjuvant for CMP slurry
WO2014179419A8 (en) Chemical mechanical planarization slurry composition comprising composite particles, process for removing material using said composition, cmp polishing pad and process for preparing said composition
TW200600454A (en) Process for the production of monodisperse sio2 particles
WO2008025030A3 (en) Method and system for point of use treatment of substrate polishing fluids
WO2008008711A3 (en) Ion exchange treatment of chemical mechanical polishing slurry
Neto et al. Equilibrium and kinetic studies in adsorption of toxic metal ions for wastewater treatment
Asgari et al. The investigation of humic acid adsorption from aqueous solutions onto modified pumice with hexadecyl trimethyl ammonium bromide
Dubey et al. Optimization of Reclamation of Ni (II)-Rich Solutions by γ-Alumina Nanoparticles
TW200732389A (en) Abrasive grain-free polishing liquid and CMP polishing method

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07840363

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: RU

122 Ep: pct application non-entry in european phase

Ref document number: 07840363

Country of ref document: EP

Kind code of ref document: A2