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WO2008005094A3 - Process for increasing the adhesion of a metal surface to a polymer - Google Patents

Process for increasing the adhesion of a metal surface to a polymer Download PDF

Info

Publication number
WO2008005094A3
WO2008005094A3 PCT/US2007/010340 US2007010340W WO2008005094A3 WO 2008005094 A3 WO2008005094 A3 WO 2008005094A3 US 2007010340 W US2007010340 W US 2007010340W WO 2008005094 A3 WO2008005094 A3 WO 2008005094A3
Authority
WO
WIPO (PCT)
Prior art keywords
adhesion
increasing
copper
polymer
metal surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/010340
Other languages
French (fr)
Other versions
WO2008005094A2 (en
Inventor
Raymond A Letize
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of WO2008005094A2 publication Critical patent/WO2008005094A2/en
Publication of WO2008005094A3 publication Critical patent/WO2008005094A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Chemical Treatment Of Metals (AREA)

Abstract

A process for increasing the adhesion between a copper or copper alloy surface and a polymeric material is disclosed. The process comprises treating the copper or copper alloy surface with an aqueous solution of cupric ions at a pH from 2.8 to 4.2 to form an oxide conversion coating on the copper or copper alloy surface. The so treated surface can then be bonded to the polymeric material.
PCT/US2007/010340 2006-06-30 2007-04-27 Process for increasing the adhesion of a metal surface to a polymer Ceased WO2008005094A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/479,692 US20080000552A1 (en) 2006-06-30 2006-06-30 Process for increasing the adhesion of a metal surface to a polymer
US11/479,692 2006-06-30

Publications (2)

Publication Number Publication Date
WO2008005094A2 WO2008005094A2 (en) 2008-01-10
WO2008005094A3 true WO2008005094A3 (en) 2008-03-13

Family

ID=38875348

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/010340 Ceased WO2008005094A2 (en) 2006-06-30 2007-04-27 Process for increasing the adhesion of a metal surface to a polymer

Country Status (2)

Country Link
US (1) US20080000552A1 (en)
WO (1) WO2008005094A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12436804B2 (en) 2019-05-28 2025-10-07 Micron Technology, Inc. Memory as a service for artificial neural network (ANN) applications
US11256624B2 (en) 2019-05-28 2022-02-22 Micron Technology, Inc. Intelligent content migration with borrowed memory
US11061819B2 (en) 2019-05-28 2021-07-13 Micron Technology, Inc. Distributed computing based on memory as a service
CN112752428A (en) * 2020-11-30 2021-05-04 深圳明阳电路科技股份有限公司 Surface pretreatment method of metal material and production process of PCB (printed Circuit Board)
JP2025102561A (en) * 2023-12-26 2025-07-08 日本パーカライジング株式会社 Surface treatment agent for copper materials

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6221176B1 (en) * 1999-03-17 2001-04-24 Gould Electronics, Inc. Surface treatment of copper to prevent microcracking in flexible circuits
US6746547B2 (en) * 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2364993A (en) * 1942-12-29 1944-12-12 Walter R Meyer Process for blackening copper or copper alloy surfaces
US2460896A (en) * 1944-08-19 1949-02-08 Enthone Composition for blackening copper and copper alloy surfaces
US2460898A (en) * 1944-11-04 1949-02-08 Enthone Process and composition for coloring copper and copper alloy surfaces
US2481854A (en) * 1946-02-14 1949-09-13 Enthone Composition to blacken surfaces of copper and of alloys containing copper
US3198672A (en) * 1960-08-18 1965-08-03 Internat Protected Metals Inc Preparation of cupric oxide surfaces
US3240662A (en) * 1961-01-23 1966-03-15 Exxon Research Engineering Co Impregnated reinforcing element bonded to an oxide coating on a copper foil
US3177103A (en) * 1961-09-18 1965-04-06 Sauders Associates Inc Two pass etching for fabricating printed circuitry
US3318758A (en) * 1963-02-18 1967-05-09 Tellite Corp Method of making a printed circuit board which includes low temperature saturation and the product
US3374129A (en) * 1963-05-02 1968-03-19 Sanders Associates Inc Method of producing printed circuits
US3292109A (en) * 1964-07-14 1966-12-13 Bell Telephone Labor Inc Nonreciprocal elastic wave coupling network
US3434889A (en) * 1965-12-27 1969-03-25 Budd Co Copper foil surface treatment
US3518168A (en) * 1966-11-18 1970-06-30 Revere Copper & Brass Inc Electrolytic process of preparing a copper foil for a plastic coat
US3481777A (en) * 1967-02-17 1969-12-02 Ibm Electroless coating method for making printed circuits
US3544389A (en) * 1967-12-18 1970-12-01 Bell Telephone Labor Inc Process for surface treatment of copper and its alloys
US3677828A (en) * 1970-07-30 1972-07-18 Olin Corp Tarnish resistant copper and copper alloys
JPS5856758B2 (en) * 1975-12-17 1983-12-16 ミツイアナコンダドウハク カブシキガイシヤ Douhakuhiyoumenshiyorihouhou
FR2390517A1 (en) * 1977-05-10 1978-12-08 Coppertron Sa INSTALLATION FOR THE ELECTRO-PRODUCTION OF COPPER IN SHEETS INTENDED TO BE APPLIED IN PARTICULAR TO DIELECTRIC MATERIALS
US4131517A (en) * 1977-06-03 1978-12-26 Nippon Mining Co., Ltd. Surface treating process for copper foil for use in printed circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6221176B1 (en) * 1999-03-17 2001-04-24 Gould Electronics, Inc. Surface treatment of copper to prevent microcracking in flexible circuits
US6746547B2 (en) * 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper

Also Published As

Publication number Publication date
WO2008005094A2 (en) 2008-01-10
US20080000552A1 (en) 2008-01-03

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