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WO2008003549A1 - Procédé pour le collage d'au moins une première plaque et d'une deuxième plaque et procédé pour la fabrication d'un agencement porte-conducteur - Google Patents

Procédé pour le collage d'au moins une première plaque et d'une deuxième plaque et procédé pour la fabrication d'un agencement porte-conducteur Download PDF

Info

Publication number
WO2008003549A1
WO2008003549A1 PCT/EP2007/054645 EP2007054645W WO2008003549A1 WO 2008003549 A1 WO2008003549 A1 WO 2008003549A1 EP 2007054645 W EP2007054645 W EP 2007054645W WO 2008003549 A1 WO2008003549 A1 WO 2008003549A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
layer
bonding
conductor carrier
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/054645
Other languages
German (de)
English (en)
Inventor
Andreas Hüttner
Hans-Peter Tranitz
Stefan Wiesinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Continental Automotive GmbH
Siemens Corp
Original Assignee
Siemens AG
Continental Automotive GmbH
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Continental Automotive GmbH, Siemens Corp filed Critical Siemens AG
Publication of WO2008003549A1 publication Critical patent/WO2008003549A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Definitions

  • the invention relates to a method for bonding at least a first plate and a second plate.
  • the two plates are connected by means of a thermal adhesive.
  • Fer ⁇ ner the invention relates to a method for producing a conductor carrier assembly.
  • Conductor carrier arrangements regularly comprise at least one conductor carrier and a base plate on which the conductor carrier is arranged.
  • the base plate can help to electrically insulate the Lei ⁇ carrier and dissipate occurring during operation of the conductor carrier heat. This can be done at ⁇ game instance in that the base plate is provided, on the side facing away from the conductor support side of the base plate with a thermally conductive adhesive, and that a second plate Ü is bonded via the heat adhesive with the base plate. The second plate can then be thermally coupled, for example, with a heat sink.
  • the invention is characterized according to a first aspect of the invention by a method for bonding at least a first plate and a second plate. It is applied by screen printing at least one layer of a plantetkle ⁇ bers on the first plate. The second plate is pressed onto the layer of thermally conductive adhesive.
  • the layer of the thermal adhesive is applied completely to the first plate.
  • the continuous application of the thermal adhesive contributes to a particularly good heat coupling of the two plates to each other and allows elec ⁇ tric isolation of the first plate relative to the second plate.
  • a given range can be left free of thermal adhesive. Outside the specified range, the layer of thermal adhesive is applied without gaps.
  • the predetermined range may be provided for example for a mounting ⁇ medium or a component. In other words, defined structures can also be left out, between which the layer of the thermal adhesive is applied without gaps.
  • the particularly good heat coupling comprises ei ⁇ ne large-scale heat coupling.
  • the layer of the thermal adhesive is formed so that the first plate is electrically isolated from the second plate. If the second plate is electrically con ⁇ tacted, so this allows the particularly good heat ⁇ coupling of the two plates without electrically coupling them. It is advantageous if the thermal adhesive comprises an electrically insulating material.
  • the invention is characterized according to a second aspect of the invention by a method for producing a conductor carrier arrangement.
  • a conductor carrier is fixed on the glued by means of thermal adhesive second plate.
  • the fixation of the conductor carrier on the second plate allows a dissipation of heat, which arises during operation of the conductor carrier, towards the first plate.
  • FIG. 1 shows a flow chart of a method for bonding at least a first plate and a second plate.
  • a method for bonding at least a first plate 2 and a second plate 10 (FIG. 1) is started in a step S1, in which preferably machines for bonding the two plates are calibrated and the required materials are laid ready.
  • a step S2 the first plate 2 in a Vorrich ⁇ device for bonding the first and the second plate 2, 10 is arranged.
  • a layer 4 of a thermally conductive adhesive is applied to the first plate 2.
  • the thermal adhesive is screen printed by a squeegee 10 through a sieve 6, which has a perforated bottom plate 8.
  • the layer 4 of the thermally conductive adhesive is applied to gaps ⁇ los the first plate. 2
  • Kgs ⁇ NEN remain for other device regions of the second plate 2 free of thermally conductive adhesive, but the intermediate space are seamlessly connected to each other by the thermal adhesive layer 4 of the between the vacant areas on the second plate. 2 The release of such areas on the first plate 2 can be easily achieved by an imperforate area in the bottom plate 8 of the sieve 6.
  • the thickness of the layer 4 of the thermally conductive adhesive and the Ge ⁇ speed with which the layer 4 of the thermally conductive adhesive is placed on ⁇ may be prepared by the size of the perforations, the velocity of the doctor blade 10 and / or be dictated by the viscosity of the thermally conductive adhesive.
  • the perforations may have different designs.
  • the perforations may be formed from the intermediate spaces. be formed of a wire mesh. The size of the perfo ⁇ rations is then determined by the wire width and mesh size.
  • the perforations may be bores in the bottom plate 8 of the screen 6. The size of the perforations is then specified by the bore diameter.
  • step S4 the layer 4 of the thermally conductive adhesive is applied completely to the first plate 2.
  • step S4 can be dwelled for a predetermined period of time depending on the flow properties of the thermal adhesive.
  • step S4 the layer 4 of the heat-conducting adhesive can be kept at a predetermined temperature.
  • Step S5 a predetermined pressure on the two plates perpendicular to the layer 4 of the thermally conductive adhesive on the two plates can be ⁇ exerts. This contributes to a particularly strong bond of the two plates and to a very good heat coupling.
  • the thermal adhesive is an insulator.
  • the smooth application of the layer 4 of the thermal adhesive then contributes to a particularly good insulation of the first plate 2 relative to the second plate 10 at.
  • the method can be used for any number of layers 4 and for any number of plates.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne un procédé pour le collage d'au moins une première plaque et d'une deuxième plaque et un procédé pour la fabrication d'un agencement porte-conducteur. Pour le collage d'au moins une première plaque (2) et d'une deuxième plaque (10), on applique, au moyen d'un procédé sérigraphique, au moins une couche (4) d'une colle conductrice de la chaleur sur la première plaque (2). La deuxième plaque (10) est pressée sur la couche (4) de la colle conductrice de la chaleur.
PCT/EP2007/054645 2006-07-06 2007-05-14 Procédé pour le collage d'au moins une première plaque et d'une deuxième plaque et procédé pour la fabrication d'un agencement porte-conducteur Ceased WO2008003549A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006031371.2 2006-07-06
DE102006031371 2006-07-06

Publications (1)

Publication Number Publication Date
WO2008003549A1 true WO2008003549A1 (fr) 2008-01-10

Family

ID=38370726

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/054645 Ceased WO2008003549A1 (fr) 2006-07-06 2007-05-14 Procédé pour le collage d'au moins une première plaque et d'une deuxième plaque et procédé pour la fabrication d'un agencement porte-conducteur

Country Status (1)

Country Link
WO (1) WO2008003549A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102355797A (zh) * 2011-10-18 2012-02-15 武汉凡谷电子技术股份有限公司 一种金属基板与印制板烧结工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864980A (ja) * 1994-08-23 1996-03-08 Mitsubishi Electric Corp 半導体装置、及びその製造方法
US5576934A (en) * 1992-07-09 1996-11-19 Robert Bosch Gmbh Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board
EP1330148A2 (fr) * 2002-01-21 2003-07-23 Siemens Aktiengesellschaft Appareil électrique
US20030236362A1 (en) * 1995-07-10 2003-12-25 3M Innovative Properties Company Adhesive compositions and methods of use
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
US20050256241A1 (en) * 2004-05-11 2005-11-17 International Business Machines Corporation Thermal interface adhesive and rework

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5576934A (en) * 1992-07-09 1996-11-19 Robert Bosch Gmbh Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board
JPH0864980A (ja) * 1994-08-23 1996-03-08 Mitsubishi Electric Corp 半導体装置、及びその製造方法
US20030236362A1 (en) * 1995-07-10 2003-12-25 3M Innovative Properties Company Adhesive compositions and methods of use
EP1330148A2 (fr) * 2002-01-21 2003-07-23 Siemens Aktiengesellschaft Appareil électrique
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
US20050256241A1 (en) * 2004-05-11 2005-11-17 International Business Machines Corporation Thermal interface adhesive and rework

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102355797A (zh) * 2011-10-18 2012-02-15 武汉凡谷电子技术股份有限公司 一种金属基板与印制板烧结工艺

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