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WO2008099772A1 - 積層セラミックコンデンサおよびその製造方法 - Google Patents

積層セラミックコンデンサおよびその製造方法 Download PDF

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Publication number
WO2008099772A1
WO2008099772A1 PCT/JP2008/052105 JP2008052105W WO2008099772A1 WO 2008099772 A1 WO2008099772 A1 WO 2008099772A1 JP 2008052105 W JP2008052105 W JP 2008052105W WO 2008099772 A1 WO2008099772 A1 WO 2008099772A1
Authority
WO
WIPO (PCT)
Prior art keywords
ceramic capacitor
laminated ceramic
ohmic electrode
electrode
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/052105
Other languages
English (en)
French (fr)
Inventor
Toshiki Nagamoto
Mitsuhiro Kusano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2008558069A priority Critical patent/JP4952723B2/ja
Priority to CN2008800050855A priority patent/CN101611461B/zh
Publication of WO2008099772A1 publication Critical patent/WO2008099772A1/ja
Priority to US12/537,661 priority patent/US7751175B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

　積層セラミックコンデンサ（１）の外部電極（６，７）に抵抗素子としての機能をも与えるようにするため、外部電極（６，７）を形成するに当たって、下層抵抗電極（８）を焼成により形成した後、その上に上層導電電極（９）を焼成により形成したとき、上層導電電極（９）に含まれるガラスが下層抵抗電極（８）中あるいは界面へと流動することがあり、その結果、積層セラミックコンデンサ（１）のＥＳＲの制御が困難となる。 　この課題を解決するため、上層導電電極（９）に含まれるガラスとして、下層抵抗電極（８）に含まれるガラスより２０°C以上高い軟化点を有するものを用いる。
PCT/JP2008/052105 2007-02-14 2008-02-08 積層セラミックコンデンサおよびその製造方法 Ceased WO2008099772A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008558069A JP4952723B2 (ja) 2007-02-14 2008-02-08 積層セラミックコンデンサおよびその製造方法
CN2008800050855A CN101611461B (zh) 2007-02-14 2008-02-08 叠层陶瓷电容器及其制造方法
US12/537,661 US7751175B2 (en) 2007-02-14 2009-08-07 Multilayer ceramic capacitor and method for manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007033151 2007-02-14
JP2007-033151 2007-02-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/537,661 Continuation US7751175B2 (en) 2007-02-14 2009-08-07 Multilayer ceramic capacitor and method for manufacturing the same

Publications (1)

Publication Number Publication Date
WO2008099772A1 true WO2008099772A1 (ja) 2008-08-21

Family

ID=39690005

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052105 Ceased WO2008099772A1 (ja) 2007-02-14 2008-02-08 積層セラミックコンデンサおよびその製造方法

Country Status (4)

Country Link
US (1) US7751175B2 (ja)
JP (1) JP4952723B2 (ja)
CN (1) CN101611461B (ja)
WO (1) WO2008099772A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012244150A (ja) * 2011-05-20 2012-12-10 Samsung Electro-Mechanics Co Ltd 積層型セラミック電子部品
CN103513113A (zh) * 2012-06-28 2014-01-15 联想(北京)有限公司 一种信息获取方法、设备及电容
JP2018107422A (ja) * 2016-12-22 2018-07-05 株式会社村田製作所 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法
JP2019024065A (ja) * 2017-07-25 2019-02-14 太陽誘電株式会社 セラミック電子部品及びセラミック電子部品の製造方法
JP2021007124A (ja) * 2019-06-27 2021-01-21 株式会社村田製作所 積層セラミックコンデンサの製造方法および積層セラミックコンデンサ
JP2022136822A (ja) * 2021-03-08 2022-09-21 Tdk株式会社 セラミック電子部品
JP2022136821A (ja) * 2021-03-08 2022-09-21 Tdk株式会社 セラミック電子部品
WO2024166468A1 (ja) * 2023-02-10 2024-08-15 太陽誘電株式会社 積層セラミック電子部品およびその製造方法

Families Citing this family (20)

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KR101153573B1 (ko) * 2010-11-25 2012-06-11 삼성전기주식회사 이중 전극 구조를 갖는 적층형 세라믹 캐패시터
JP5488725B2 (ja) * 2011-02-14 2014-05-14 株式会社村田製作所 積層セラミックコンデンサの製造方法
KR20130065199A (ko) * 2011-12-09 2013-06-19 삼성전기주식회사 외부 전극용 도전성 페이스트, 이를 이용한 적층 세라믹 전자부품 및 이의 제조방법
KR101607536B1 (ko) * 2012-08-07 2016-03-30 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 콘덴서 및 적층 세라믹 콘덴서의 제조방법
KR101823174B1 (ko) 2013-06-14 2018-01-29 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101434108B1 (ko) * 2013-07-22 2014-08-25 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판과 제조 방법
JP2015026838A (ja) * 2013-10-22 2015-02-05 株式会社村田製作所 コンデンサ
CN104576051B (zh) * 2013-10-25 2017-05-24 株式会社村田制作所 陶瓷电子部件
KR101940981B1 (ko) 2014-05-05 2019-01-23 3디 글래스 솔루션즈 인코포레이티드 2d 및 3d 인덕터 안테나 및 변압기 제작 광 활성 기판
US12165809B2 (en) 2016-02-25 2024-12-10 3D Glass Solutions, Inc. 3D capacitor and capacitor array fabricating photoactive substrates
JP7008824B2 (ja) 2017-12-15 2022-01-25 スリーディー グラス ソリューションズ，インク 接続伝送線路共振ｒｆフィルタ
AU2018399638B2 (en) 2018-01-04 2021-09-02 3D Glass Solutions, Inc. Impedance matching conductive structure for high efficiency RF circuits
KR102076153B1 (ko) * 2018-05-02 2020-02-11 삼성전기주식회사 적층형 커패시터
KR102076149B1 (ko) 2018-06-19 2020-02-11 삼성전기주식회사 적층 세라믹 전자부품 및 그 실장 기판
KR20210147040A (ko) 2019-04-05 2021-12-06 3디 글래스 솔루션즈 인코포레이티드 유리 기반의 빈 기판 집적 도파관 디바이스
US11908617B2 (en) 2020-04-17 2024-02-20 3D Glass Solutions, Inc. Broadband induction
JP7276296B2 (ja) * 2020-09-30 2023-05-18 株式会社村田製作所 積層セラミックコンデンサ
JP7606368B2 (ja) * 2021-03-08 2024-12-25 Tdk株式会社 セラミック電子部品
JP7535005B2 (ja) * 2021-03-31 2024-08-15 Tdk株式会社 積層電子部品
KR20240019226A (ko) * 2021-06-04 2024-02-14 3디 글래스 솔루션즈 인코포레이티드 광활성 유리 기판들의 rf 시스템용 세라믹상 커패시터들 디바이스들

Citations (1)

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JPH11345745A (ja) * 1997-10-27 1999-12-14 Tdk Corp 電子デバイスおよびその製造方法

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JP3230394B2 (ja) * 1994-06-01 2001-11-19 株式会社村田製作所 磁器コンデンサ
US5670089A (en) * 1995-12-07 1997-09-23 E. I. Du Pont De Nemours And Company Conductive paste for MLC termination
KR100345031B1 (ko) * 1997-10-06 2002-07-24 티디케이가부시기가이샤 전자장치 및 그 제조방법
JP3494115B2 (ja) * 2000-03-30 2004-02-03 株式会社村田製作所 導電性ペーストおよびこれを用いた積層セラミック電子部品
US7147804B2 (en) * 2003-01-24 2006-12-12 E. I. Du Pont De Nemours And Company Terminal electrode compositions for multilayer ceramic capacitors
CN1993784B (zh) 2004-08-27 2011-04-13 株式会社村田制作所 层叠陶瓷电容器及其等效串联电阻调整方法
JP4218614B2 (ja) 2004-08-27 2009-02-04 アイシン精機株式会社 座席状態検出装置、車両用ヘッドランプの照射方向調節装置及び着座検出装置
WO2006090551A1 (ja) 2005-02-22 2006-08-31 Murata Manufacturing Co., Ltd. 導電性ペースト、積層セラミック電子部品およびその製造方法
EP2065908B1 (en) * 2006-09-22 2018-09-12 Murata Manufacturing Co. Ltd. Laminated ceramic capacitor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345745A (ja) * 1997-10-27 1999-12-14 Tdk Corp 電子デバイスおよびその製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012244150A (ja) * 2011-05-20 2012-12-10 Samsung Electro-Mechanics Co Ltd 積層型セラミック電子部品
CN103513113A (zh) * 2012-06-28 2014-01-15 联想(北京)有限公司 一种信息获取方法、设备及电容
JP2018107422A (ja) * 2016-12-22 2018-07-05 株式会社村田製作所 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法
JP2019024065A (ja) * 2017-07-25 2019-02-14 太陽誘電株式会社 セラミック電子部品及びセラミック電子部品の製造方法
JP7171171B2 (ja) 2017-07-25 2022-11-15 太陽誘電株式会社 セラミック電子部品及びセラミック電子部品の製造方法
JP2021007124A (ja) * 2019-06-27 2021-01-21 株式会社村田製作所 積層セラミックコンデンサの製造方法および積層セラミックコンデンサ
JP7243487B2 (ja) 2019-06-27 2023-03-22 株式会社村田製作所 積層セラミックコンデンサの製造方法
JP2022136822A (ja) * 2021-03-08 2022-09-21 Tdk株式会社 セラミック電子部品
JP2022136821A (ja) * 2021-03-08 2022-09-21 Tdk株式会社 セラミック電子部品
JP7550082B2 (ja) 2021-03-08 2024-09-12 Tdk株式会社 セラミック電子部品
JP7606369B2 (ja) 2021-03-08 2024-12-25 Tdk株式会社 セラミック電子部品
WO2024166468A1 (ja) * 2023-02-10 2024-08-15 太陽誘電株式会社 積層セラミック電子部品およびその製造方法

Also Published As

Publication number Publication date
JPWO2008099772A1 (ja) 2010-05-27
CN101611461B (zh) 2012-03-21
US7751175B2 (en) 2010-07-06
CN101611461A (zh) 2009-12-23
JP4952723B2 (ja) 2012-06-13
US20090290281A1 (en) 2009-11-26

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