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WO2008088012A1 - 表面実装型の水晶振動子 - Google Patents

表面実装型の水晶振動子 Download PDF

Info

Publication number
WO2008088012A1
WO2008088012A1 PCT/JP2008/050521 JP2008050521W WO2008088012A1 WO 2008088012 A1 WO2008088012 A1 WO 2008088012A1 JP 2008050521 W JP2008050521 W JP 2008050521W WO 2008088012 A1 WO2008088012 A1 WO 2008088012A1
Authority
WO
WIPO (PCT)
Prior art keywords
main body
container main
wall layer
metal
grounding external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050521
Other languages
English (en)
French (fr)
Inventor
Hiromi Otake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to US12/523,313 priority Critical patent/US7990026B2/en
Publication of WO2008088012A1 publication Critical patent/WO2008088012A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

底壁層と枠壁層からなる容器本体内に水晶片を収容し、共晶合金によって金属カバーを容器本体に接合した水晶振動子において、水晶片は、容器本体の一端側で容器本体の内底面となる位置に形成された一対の水晶接続端子に保持される。容器本体の他端側で容器本体の外底面の角部の１つに接地用の外部端子が設けられる。金属カバーを接地用の外部端子に接続するために、接地用の外部端子の形成位置に対応して、枠壁層の下面に、枠壁層のは内壁側面の金属端面膜を介して金属カバーと電気的に接続する第１導通用金属膜が形成され、底壁層の上面に、容器本体外側面の金属端面膜を介して接地用外部端子と電気的に接続する第２導通用金属膜が形成されている。
PCT/JP2008/050521 2007-01-17 2008-01-17 表面実装型の水晶振動子 Ceased WO2008088012A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/523,313 US7990026B2 (en) 2007-01-17 2008-01-17 Surface-mount type crystal unit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007008257A JP2008177767A (ja) 2007-01-17 2007-01-17 表面実装用の水晶振動子
JP2007-008257 2007-01-17

Publications (1)

Publication Number Publication Date
WO2008088012A1 true WO2008088012A1 (ja) 2008-07-24

Family

ID=39636013

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050521 Ceased WO2008088012A1 (ja) 2007-01-17 2008-01-17 表面実装型の水晶振動子

Country Status (3)

Country Link
US (1) US7990026B2 (ja)
JP (1) JP2008177767A (ja)
WO (1) WO2008088012A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102160285B (zh) * 2008-03-31 2014-04-30 株式会社村田制作所 压电振动元件
JP2010136179A (ja) * 2008-12-05 2010-06-17 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶デバイス
JP2013021667A (ja) * 2011-03-23 2013-01-31 Nippon Dempa Kogyo Co Ltd 水晶デバイス
JP2012199861A (ja) * 2011-03-23 2012-10-18 Nippon Dempa Kogyo Co Ltd 水晶デバイス及び水晶デバイスの検査方法
USD674364S1 (en) * 2011-07-08 2013-01-15 Nihon Dempa Kogyo Co., Ltd. Crystal unit
JP5806096B2 (ja) * 2011-11-30 2015-11-10 京セラクリスタルデバイス株式会社 圧電デバイス
JP2016139901A (ja) * 2015-01-27 2016-08-04 京セラクリスタルデバイス株式会社 水晶デバイス
JP6542583B2 (ja) * 2015-05-21 2019-07-10 京セラ株式会社 水晶振動子
JP6527033B2 (ja) * 2015-06-25 2019-06-05 京セラ株式会社 水晶デバイス
JP2017046205A (ja) * 2015-08-27 2017-03-02 京セラクリスタルデバイス株式会社 水晶デバイス

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11265957A (ja) * 1998-03-16 1999-09-28 Sumitomo Metal Electronics Devices Inc セラミックパッケージ基体及びその製造方法
JP2003283293A (ja) * 2002-03-22 2003-10-03 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2004064701A (ja) * 2002-07-31 2004-02-26 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶振動子
JP2005198197A (ja) * 2004-01-09 2005-07-21 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶振動子
JP2006012936A (ja) * 2004-06-23 2006-01-12 Sumitomo Metal Electronics Devices Inc セラミックパッケージの製造方法
JP2006059958A (ja) * 2004-08-19 2006-03-02 Sumitomo Metal Electronics Devices Inc 電子部品収納用セラミックパッケージ及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6998962B2 (en) * 2000-04-14 2006-02-14 Current Technologies, Llc Power line communication apparatus and method of using the same
JP2004146956A (ja) 2002-10-22 2004-05-20 Nippon Dempa Kogyo Co Ltd 水晶振動子用ベース及びこれを用いた表面実装振動子
JP4692722B2 (ja) * 2004-01-29 2011-06-01 セイコーエプソン株式会社 電子部品用パッケージおよび電子部品
US7602107B2 (en) * 2005-11-30 2009-10-13 Nihon Dempa Kogyo Co., Ltd. Surface mount type crystal oscillator

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11265957A (ja) * 1998-03-16 1999-09-28 Sumitomo Metal Electronics Devices Inc セラミックパッケージ基体及びその製造方法
JP2003283293A (ja) * 2002-03-22 2003-10-03 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2004064701A (ja) * 2002-07-31 2004-02-26 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶振動子
JP2005198197A (ja) * 2004-01-09 2005-07-21 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶振動子
JP2006012936A (ja) * 2004-06-23 2006-01-12 Sumitomo Metal Electronics Devices Inc セラミックパッケージの製造方法
JP2006059958A (ja) * 2004-08-19 2006-03-02 Sumitomo Metal Electronics Devices Inc 電子部品収納用セラミックパッケージ及びその製造方法

Also Published As

Publication number Publication date
JP2008177767A (ja) 2008-07-31
US20100066210A1 (en) 2010-03-18
US7990026B2 (en) 2011-08-02

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