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WO2008087984A1 - レーザ加工装置及びその加工方法 - Google Patents

レーザ加工装置及びその加工方法 Download PDF

Info

Publication number
WO2008087984A1
WO2008087984A1 PCT/JP2008/050445 JP2008050445W WO2008087984A1 WO 2008087984 A1 WO2008087984 A1 WO 2008087984A1 JP 2008050445 W JP2008050445 W JP 2008050445W WO 2008087984 A1 WO2008087984 A1 WO 2008087984A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
detecting
unit
gingiva
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050445
Other languages
English (en)
French (fr)
Inventor
Eiichiro Yamada
Akira Inoue
Hitoshi Hatayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to US12/523,290 priority Critical patent/US20100068673A1/en
Priority to JP2008554062A priority patent/JPWO2008087984A1/ja
Priority to KR1020097017013A priority patent/KR20090113291A/ko
Priority to EP08703306A priority patent/EP2105238A4/en
Publication of WO2008087984A1 publication Critical patent/WO2008087984A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N21/4738—Diffuse reflection, e.g. also for testing fluids, fibrous materials
    • G01N21/474—Details of optical heads therefor, e.g. using optical fibres
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C1/00—Dental machines for boring or cutting ; General features of dental machines or apparatus, e.g. hand-piece design
    • A61C1/0046—Dental lasers
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C19/00—Dental auxiliary appliances
    • A61C19/04—Measuring instruments specially adapted for dentistry
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/314—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry with comparison of measurements at specific and non-specific wavelengths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N2021/3129—Determining multicomponents by multiwavelength light
    • G01N2021/3137—Determining multicomponents by multiwavelength light with selection of wavelengths after the sample
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06166—Line selective sources
    • G01N2201/0618—Halogene sources
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/08—Optical fibres; light guides

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Immunology (AREA)
  • Epidemiology (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Dentistry (AREA)
  • Biochemistry (AREA)
  • Animal Behavior & Ethology (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Chemical & Material Sciences (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Laser Beam Processing (AREA)
  • Dental Tools And Instruments Or Auxiliary Dental Instruments (AREA)

Abstract

　レーザ加工装置１は、歯１３Ａあるいは歯肉１３Ｂを加工する為の加工用光を発する加工用光光源２と、歯１３Ａあるいは歯肉１３Ｂを照明する為の照明光を発するハロゲンランプ３と、歯１３Ａあるいは歯肉１３Ｂからの複数波長の光を検出することが可能な検出部４と、第１の発光部２の発光状態を制御する制御部５とを備えている。検出部４は、波長によって受光感度の異なる第１の検出素子６と第２の検出素子７とを有し、異なる波長の光強度を検出し、検出した結果を制御部５に出力している。制御部５は、検出部４により検出された異なる波長の光それぞれの光強度の比率に基づき、加工用光光源２の発光状態を制御している。
PCT/JP2008/050445 2007-01-17 2008-01-16 レーザ加工装置及びその加工方法 Ceased WO2008087984A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/523,290 US20100068673A1 (en) 2007-01-17 2008-01-16 Laser processing device and its processing method
JP2008554062A JPWO2008087984A1 (ja) 2007-01-17 2008-01-16 レーザ加工装置及びその加工方法
KR1020097017013A KR20090113291A (ko) 2007-01-17 2008-01-16 레이저 가공 장치 및 그 가공 방법
EP08703306A EP2105238A4 (en) 2007-01-17 2008-01-16 LASER PROCESSING DEVICE AND CORRESPONDING PROCESSING METHOD

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-008402 2007-01-17
JP2007008402 2007-01-17

Publications (1)

Publication Number Publication Date
WO2008087984A1 true WO2008087984A1 (ja) 2008-07-24

Family

ID=39635986

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050445 Ceased WO2008087984A1 (ja) 2007-01-17 2008-01-16 レーザ加工装置及びその加工方法

Country Status (6)

Country Link
US (1) US20100068673A1 (ja)
EP (1) EP2105238A4 (ja)
JP (1) JPWO2008087984A1 (ja)
KR (1) KR20090113291A (ja)
CN (1) CN101588888A (ja)
WO (1) WO2008087984A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011206806A (ja) * 2010-03-30 2011-10-20 Mitsubishi Electric Corp レーザ加工装置
JP2021101196A (ja) * 2011-08-29 2021-07-08 オートモーティブ コアリション フォー トラフィック セーフティ， インコーポレイテッド 自動車運転者において被分析物を非侵襲的に測定するためのシステムおよび方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010007852A1 (ja) * 2008-07-16 2010-01-21 住友電気工業株式会社 レーザ加工装置及びその加工方法
JP2013034569A (ja) * 2011-08-05 2013-02-21 Gc Corp 口腔内検査装置、口腔内検査装置の作動方法
US10631965B2 (en) * 2016-12-07 2020-04-28 Koninklijke Philips N.V. Method and apparatus for protection of soft tissues against a teeth whitening substance
JP7227250B2 (ja) 2017-12-12 2023-02-21 コーニンクレッカ フィリップス エヌ ヴェ 局在的な口腔炎症を測定しながら、自動的に輝度／利得を制御する方法及びシステム
DE102018112129A1 (de) * 2018-05-18 2019-11-21 Volkswagen Aktiengesellschaft Verfahren zur generativen Herstellung eines Bauteils, Vorrichtung zur Durchführung des Verfahrens und Kraftfahrzeug
WO2020160461A1 (en) * 2019-02-01 2020-08-06 Jang Andrew Timothy Dental imaging mixed reality system
US11455721B2 (en) * 2019-02-01 2022-09-27 Andrew Timothy Jang Multiwave dental imaging system
JP7367958B2 (ja) * 2019-07-10 2023-10-24 国立研究開発法人理化学研究所 レーザ加工装置
US10992605B2 (en) * 2019-09-09 2021-04-27 PAG Financial International LLC Systems and methods for operating a mobile application using a conversation interface
CN112044874B (zh) * 2020-09-27 2022-02-25 厦门理工学院 一种激光清洗的实时监测系统及其监测方法
JP7680301B2 (ja) * 2021-08-02 2025-05-20 株式会社Ｓｃｒｅｅｎホールディングス 光照射装置、および、光照射方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313805A (ja) * 1989-06-12 1991-01-22 Welch Allyn Inc 物体の内部観察方法とその装置
JPH04361889A (ja) * 1991-06-06 1992-12-15 Mitsubishi Heavy Ind Ltd レーザ溶接モニタリング方法及びその装置
JPH05335735A (ja) 1992-06-03 1993-12-17 Mitsubishi Electric Corp レーザｏｌｂ装置及び半導体装置の実装方法
JP2002033539A (ja) * 2000-07-18 2002-01-31 Nec Corp グリーンシートの穴あけ加工装置

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DE4015066A1 (de) * 1990-05-10 1991-11-14 Hans Wilhelm Bergmann Vorrichtung und verfahren zur automatischen kontrolle von zahnbehandlungen und chirurgischen eingriffen mit hilfe gepulster laser
US5690486A (en) * 1995-07-28 1997-11-25 Dentalase Corporation Dental tooth color detector apparatus and method
DE29705934U1 (de) * 1997-04-03 1997-06-05 Kaltenbach & Voigt Gmbh & Co, 88400 Biberach Diagnose- und Behandlungsvorrichtung für Zähne
US6271913B1 (en) * 1997-07-01 2001-08-07 Lj Laboratories, Llc Apparatus and method for measuring optical characteristics of an object
US7217266B2 (en) * 2001-05-30 2007-05-15 Anderson R Rox Apparatus and method for laser treatment with spectroscopic feedback
JP2003103386A (ja) * 2001-09-26 2003-04-08 Komatsu Ltd Ｙａｇレーザ溶接のモニタリング装置
FR2843902A1 (fr) * 2002-08-27 2004-03-05 Usinor Dispositif et procede de controle d'une operation de soudage, de rechargement ou d'usinage par faisceau laser d'une piece
JP3792683B2 (ja) * 2003-07-16 2006-07-05 ファナック株式会社 レーザ溶接装置
US7218822B2 (en) * 2004-09-03 2007-05-15 Chemimage Corporation Method and apparatus for fiberscope

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313805A (ja) * 1989-06-12 1991-01-22 Welch Allyn Inc 物体の内部観察方法とその装置
JPH04361889A (ja) * 1991-06-06 1992-12-15 Mitsubishi Heavy Ind Ltd レーザ溶接モニタリング方法及びその装置
JPH05335735A (ja) 1992-06-03 1993-12-17 Mitsubishi Electric Corp レーザｏｌｂ装置及び半導体装置の実装方法
JP2002033539A (ja) * 2000-07-18 2002-01-31 Nec Corp グリーンシートの穴あけ加工装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2105238A4

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011206806A (ja) * 2010-03-30 2011-10-20 Mitsubishi Electric Corp レーザ加工装置
JP2021101196A (ja) * 2011-08-29 2021-07-08 オートモーティブ コアリション フォー トラフィック セーフティ， インコーポレイテッド 自動車運転者において被分析物を非侵襲的に測定するためのシステムおよび方法
JP2023100854A (ja) * 2011-08-29 2023-07-19 オートモーティブ コアリション フォー トラフィック セーフティ， インコーポレイテッド 自動車運転者において被分析物を非侵襲的に測定するためのシステムおよび方法

Also Published As

Publication number Publication date
JPWO2008087984A1 (ja) 2010-05-06
EP2105238A1 (en) 2009-09-30
EP2105238A4 (en) 2012-04-25
KR20090113291A (ko) 2009-10-29
CN101588888A (zh) 2009-11-25
US20100068673A1 (en) 2010-03-18

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