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WO2008081878A1 - 難燃性高耐熱樹脂組成物 - Google Patents

難燃性高耐熱樹脂組成物 Download PDF

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Publication number
WO2008081878A1
WO2008081878A1 PCT/JP2007/075143 JP2007075143W WO2008081878A1 WO 2008081878 A1 WO2008081878 A1 WO 2008081878A1 JP 2007075143 W JP2007075143 W JP 2007075143W WO 2008081878 A1 WO2008081878 A1 WO 2008081878A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
flame
resistant resin
highly heat
retardant highly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/075143
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English (en)
French (fr)
Inventor
Takaaki Miyoshi
Fumiki Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Chemicals Corp
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Priority to JP2008552154A priority Critical patent/JPWO2008081878A1/ja
Publication of WO2008081878A1 publication Critical patent/WO2008081878A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06Polyamides derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/5399Phosphorus bound to nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Conductive Materials (AREA)

Abstract

 本発明は、ポリアミド、ポリフェニレンエーテル及びホスファゼン化合物を含む樹脂組成物であって、ここで、ポリアミドが、下記式で表される構造(A)と構造(B)のモル比(A/B)が、30/70~100/0の範囲内である芳香族ポリアミドである樹脂組成物を開示する。 [上記式中、Rは炭素数6~12のアルキレン基である。]
PCT/JP2007/075143 2007-01-02 2007-12-27 難燃性高耐熱樹脂組成物 Ceased WO2008081878A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008552154A JPWO2008081878A1 (ja) 2007-01-02 2007-12-27 難燃性高耐熱樹脂組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88310107P 2007-01-02 2007-01-02
US60/883101 2007-01-02

Publications (1)

Publication Number Publication Date
WO2008081878A1 true WO2008081878A1 (ja) 2008-07-10

Family

ID=39588558

Family Applications (1)

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PCT/JP2007/075143 Ceased WO2008081878A1 (ja) 2007-01-02 2007-12-27 難燃性高耐熱樹脂組成物

Country Status (2)

Country Link
JP (1) JPWO2008081878A1 (ja)
WO (1) WO2008081878A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222572A (ja) * 2009-02-24 2010-10-07 Asahi Kasei Chemicals Corp 樹脂組成物及びその成形体
JP2011093439A (ja) * 2009-10-30 2011-05-12 Jtekt Corp 電動パワーステアリング装置
JP2011162753A (ja) * 2010-02-15 2011-08-25 Asahi Kasei Chemicals Corp 導電性樹脂組成物およびその製造方法ならびに該導電性樹脂組成物を用いて得られる成形品
JP2011162752A (ja) * 2010-02-15 2011-08-25 Asahi Kasei Chemicals Corp 導電性マスターバッチおよびその製造方法ならびに該導電性マスターバッチを用いて得られる導電性樹脂組成物およびその成形品
JP2015030751A (ja) * 2013-07-31 2015-02-16 三菱樹脂株式会社 ポリアミド系樹脂組成物、及びそれを成形してなるフィルム、射出成形体
CN105017525A (zh) * 2015-07-16 2015-11-04 株洲时代新材料科技股份有限公司 一种支化改性剂及相应的阻燃尼龙树脂
JP2019073657A (ja) * 2017-10-18 2019-05-16 上野製薬株式会社 液晶ポリエステル樹脂組成物
WO2024166903A1 (ja) 2023-02-06 2024-08-15 三井化学株式会社 ポリアミド樹脂組成物及び成形体

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11116797A (ja) * 1997-10-20 1999-04-27 Unitika Ltd ポリアミド樹脂組成物及びその製造法
JP2001131409A (ja) * 1999-11-09 2001-05-15 Otsuka Chem Co Ltd 難燃性芳香族ポリアミド樹脂組成物
JP2001335699A (ja) * 2000-05-30 2001-12-04 Daicel Chem Ind Ltd 難燃性樹脂組成物
JP2002053751A (ja) * 2000-05-29 2002-02-19 Mitsubishi Engineering Plastics Corp 難燃性樹脂組成物
JP2003176408A (ja) * 2001-09-21 2003-06-24 Kuraray Co Ltd 電気・電子部品封止用ポリアミド組成物
WO2006043460A1 (ja) * 2004-10-18 2006-04-27 Asahi Kasei Chemicals Corporation 難燃剤組成物
WO2006112058A1 (ja) * 2005-04-13 2006-10-26 Asahi Kasei Chemicals Corporation ポリアミド-ポリフェニレンエーテル樹脂組成物
JP2008050509A (ja) * 2006-08-25 2008-03-06 Asahi Kasei Chemicals Corp 難燃性ポリアミド系樹脂組成物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11116797A (ja) * 1997-10-20 1999-04-27 Unitika Ltd ポリアミド樹脂組成物及びその製造法
JP2001131409A (ja) * 1999-11-09 2001-05-15 Otsuka Chem Co Ltd 難燃性芳香族ポリアミド樹脂組成物
JP2002053751A (ja) * 2000-05-29 2002-02-19 Mitsubishi Engineering Plastics Corp 難燃性樹脂組成物
JP2001335699A (ja) * 2000-05-30 2001-12-04 Daicel Chem Ind Ltd 難燃性樹脂組成物
JP2003176408A (ja) * 2001-09-21 2003-06-24 Kuraray Co Ltd 電気・電子部品封止用ポリアミド組成物
WO2006043460A1 (ja) * 2004-10-18 2006-04-27 Asahi Kasei Chemicals Corporation 難燃剤組成物
WO2006112058A1 (ja) * 2005-04-13 2006-10-26 Asahi Kasei Chemicals Corporation ポリアミド-ポリフェニレンエーテル樹脂組成物
JP2008050509A (ja) * 2006-08-25 2008-03-06 Asahi Kasei Chemicals Corp 難燃性ポリアミド系樹脂組成物

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222572A (ja) * 2009-02-24 2010-10-07 Asahi Kasei Chemicals Corp 樹脂組成物及びその成形体
JP2011093439A (ja) * 2009-10-30 2011-05-12 Jtekt Corp 電動パワーステアリング装置
JP2011162753A (ja) * 2010-02-15 2011-08-25 Asahi Kasei Chemicals Corp 導電性樹脂組成物およびその製造方法ならびに該導電性樹脂組成物を用いて得られる成形品
JP2011162752A (ja) * 2010-02-15 2011-08-25 Asahi Kasei Chemicals Corp 導電性マスターバッチおよびその製造方法ならびに該導電性マスターバッチを用いて得られる導電性樹脂組成物およびその成形品
JP2015030751A (ja) * 2013-07-31 2015-02-16 三菱樹脂株式会社 ポリアミド系樹脂組成物、及びそれを成形してなるフィルム、射出成形体
CN105017525A (zh) * 2015-07-16 2015-11-04 株洲时代新材料科技股份有限公司 一种支化改性剂及相应的阻燃尼龙树脂
JP2019073657A (ja) * 2017-10-18 2019-05-16 上野製薬株式会社 液晶ポリエステル樹脂組成物
JP7032904B2 (ja) 2017-10-18 2022-03-09 上野製薬株式会社 液晶ポリエステル樹脂組成物
WO2024166903A1 (ja) 2023-02-06 2024-08-15 三井化学株式会社 ポリアミド樹脂組成物及び成形体
KR20250126806A (ko) 2023-02-06 2025-08-25 미쯔이가가꾸가부시끼가이샤 폴리아미드 수지 조성물 및 성형체

Also Published As

Publication number Publication date
JPWO2008081878A1 (ja) 2010-04-30

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