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WO2008079449A3 - Apparatus and method for polishing semiconductor wafers - Google Patents

Apparatus and method for polishing semiconductor wafers Download PDF

Info

Publication number
WO2008079449A3
WO2008079449A3 PCT/US2007/075451 US2007075451W WO2008079449A3 WO 2008079449 A3 WO2008079449 A3 WO 2008079449A3 US 2007075451 W US2007075451 W US 2007075451W WO 2008079449 A3 WO2008079449 A3 WO 2008079449A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor wafers
polishing
polishing semiconductor
wafer
unload station
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/075451
Other languages
French (fr)
Other versions
WO2008079449A2 (en
Inventor
In-Kwon Jeong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inopla Inc
Original Assignee
Inopla Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inopla Inc filed Critical Inopla Inc
Publication of WO2008079449A2 publication Critical patent/WO2008079449A2/en
Publication of WO2008079449A3 publication Critical patent/WO2008079449A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

An apparatus and method for polishing semiconductor wafers uses multiple polishing surfaces, multiple polishing heads and multiple wafer stations to sequentially polish the semiconductor wafers. The wafer stations includes at least one wafer load-unload station to transfer the semiconductor wafers between the wafer load-unload station and the polishing heads.
PCT/US2007/075451 2006-08-08 2007-08-08 Apparatus and method for polishing semiconductor wafers Ceased WO2008079449A2 (en)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
US83627806P 2006-08-08 2006-08-08
US60/836,278 2006-08-08
US83727606P 2006-08-10 2006-08-10
US60/837,276 2006-08-10
US84019206P 2006-08-25 2006-08-25
US60/840,192 2006-08-25
US84014306P 2006-08-26 2006-08-26
US60/840,143 2006-08-26
US84415006P 2006-09-12 2006-09-12
US60/844,150 2006-09-12
US11/835,321 2007-08-07
US11/835,321 US20080038993A1 (en) 2006-08-08 2007-08-07 Apparatus and method for polishing semiconductor wafers

Publications (2)

Publication Number Publication Date
WO2008079449A2 WO2008079449A2 (en) 2008-07-03
WO2008079449A3 true WO2008079449A3 (en) 2008-12-11

Family

ID=39051366

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/075451 Ceased WO2008079449A2 (en) 2006-08-08 2007-08-08 Apparatus and method for polishing semiconductor wafers

Country Status (2)

Country Link
US (1) US20080038993A1 (en)
WO (1) WO2008079449A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5009101B2 (en) * 2006-10-06 2012-08-22 株式会社荏原製作所 Substrate polishing equipment
TWI672191B (en) * 2013-10-16 2019-09-21 美商應用材料股份有限公司 System and method of chemical mechanical polisher with hub arms mounted
EP3616237A4 (en) * 2017-04-26 2020-12-16 Axus Technology, LLC CMP MACHINE WITH INCREASED THROUGHPUT AND IMPROVED PROCESS FLEXIBILITY
KR102886818B1 (en) * 2019-12-17 2025-11-14 램 리써치 코포레이션 Purge spindle arms to prevent deposition and wafer sliding
US20210323117A1 (en) 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
US11823916B2 (en) 2020-11-06 2023-11-21 Applied Materials, Inc. Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
US12224186B2 (en) 2023-04-03 2025-02-11 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804507A (en) * 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US20030217811A1 (en) * 2001-08-16 2003-11-27 Jeong In Kwon System and method for processing semiconductor wafers using different wafer processes
WO2004070778A2 (en) * 2003-01-27 2004-08-19 In Kwon Jeong Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3913271A (en) * 1974-02-04 1975-10-21 Speedfam Corp Apparatus for machining work pieces
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JP2001326201A (en) * 2000-05-16 2001-11-22 Ebara Corp Polishing equipment
JP2006524142A (en) * 2003-04-21 2006-10-26 イノプラ インコーポレーテッド Apparatus and method for polishing a semiconductor wafer using one or more polishing surfaces
JP5112061B2 (en) * 2004-07-02 2013-01-09 ストラスボー Wafer processing method and system
US7273408B2 (en) * 2005-12-16 2007-09-25 Applied Materials, Inc. Paired pivot arm

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804507A (en) * 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US20030217811A1 (en) * 2001-08-16 2003-11-27 Jeong In Kwon System and method for processing semiconductor wafers using different wafer processes
WO2004070778A2 (en) * 2003-01-27 2004-08-19 In Kwon Jeong Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups

Also Published As

Publication number Publication date
US20080038993A1 (en) 2008-02-14
WO2008079449A2 (en) 2008-07-03

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