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WO2008071576A2 - Ensemble de circuits et procédé de production d'un ensemble de circuits - Google Patents

Ensemble de circuits et procédé de production d'un ensemble de circuits Download PDF

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Publication number
WO2008071576A2
WO2008071576A2 PCT/EP2007/063165 EP2007063165W WO2008071576A2 WO 2008071576 A2 WO2008071576 A2 WO 2008071576A2 EP 2007063165 W EP2007063165 W EP 2007063165W WO 2008071576 A2 WO2008071576 A2 WO 2008071576A2
Authority
WO
WIPO (PCT)
Prior art keywords
circuit arrangement
contact surfaces
components
roughening
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/063165
Other languages
German (de)
English (en)
Other versions
WO2008071576A3 (fr
Inventor
Frank Baur
Andreas Bernhardt
Roland Brey
Carsten GÖTTE
Martin GÖTZENBERGER
Andreas Rekofsky
Angelika Schingale
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102007021073.8A external-priority patent/DE102007021073B4/de
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of WO2008071576A2 publication Critical patent/WO2008071576A2/fr
Publication of WO2008071576A3 publication Critical patent/WO2008071576A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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Definitions

  • the present invention relates to interconnecting components of a circuit arrangement.
  • a disadvantage for example, is that additional aids or auxiliary substances are always required, which are used between or on the contact surfaces to be fixed (eg, solder, adhesive, screws, etc.).
  • wire bonding With regard to an electrical connection in the field of circuit arrangements, the so-called “wire bonding” is also known in the prior art.
  • a connection thus created should withstand both internal and external stress and permanently ensure electrical conductivity.
  • problems often occur over the lifetime. Such a problem arises z. B. by different thermal expansion coefficients, which can cause mechanical stresses in the materials in question.
  • bonding wires may tear under internal or external stress or even tear off from the respective contact surfaces, so that the electrical connection is interrupted.
  • the often disadvantageous limitation of wire bonds relates in principle to all methods used according to the prior art, such as. B. "Wedge-Wedge- Bonding", “Ribbon Bonding", “Ball Wedge Bonding” etc.
  • voids are formed in the solder.
  • Such voids can be formed in particular by gas bubbles, which often arise during soldering by outgassing of a flux and displace the solder.
  • relatively large voids can arise, which then, often very detrimental, act as thermal insulators and thereby z. B. may have an overheating of an electrical or electronic component result.
  • One known approach to solving this problem is to replace a large ped with several smaller pads, thus limiting the size of the voids.
  • this approach is limited to relatively large pad geometries. For smaller Padgeometrien this approach is unsuitable.
  • the best possible thermal connection is desirable.
  • For optimal cooling for example of electrical components and substrates very small thermal contact resistance in the entire heat path are necessary. Air gaps or materials with high thermal resistance prevent optimal heat dissipation.
  • the known connection methods are disadvantageous.
  • a disadvantage is z.
  • heat sinks or heat sinks often have to be fastened to the component or substrate to be cooled by additional mounting elements (eg screws, clamps, etc.).
  • additional mounting elements eg screws, clamps, etc.
  • additional mounting elements eg screws, clamps, etc.
  • the z. B. must be closed by a heat-conducting foil or paste.
  • such measures often deteriorate the heat dissipation management by a poorer thermal conductivity of USAGE ⁇ Deten materials and / or by the creation of additional resistances.
  • circuit arrangement and “component” are to be understood very broadly.
  • the circuit arrangement according to the invention has at least two components, each with a contact surface. At least one of the contact surfaces is roughened and the components are galvanically and / or mechanically connected by a press connection of the contact surfaces.
  • the inventive method for producing a circuit arrangement having at least two components comprises the method steps: providing at least two components having at least one contact surface each; Roughen at least one of the two contact surfaces and pressing together the contact surfaces for mechanical and / or electrical see fixation of the two components.
  • the invention can be used to overcome respective disadvantages of the prior art and to achieve particular advantages.
  • An advantage of the invention may, for.
  • it may not be necessary for the creation of the compound to require an adjuvant eg solder, adhesive, screws, rivets, etc.
  • the invention is particularly suitable for automated fixation and may optionally also assume a sealing function.
  • the compound created according to the invention can In many cases also provide superior fatigue, for example, when it comes to the replacement of the usual wire bonding process.
  • soldering processes of the known type can be replaced or improved with the invention.
  • the invention can be advantageously used in connection with the formation and thermal connection of heat sinks (including heat sinks).
  • At least one of the two components is a circuit carrier.
  • a circuit carrier is generally used to components of a circuit arrangement in the strict sense, ie z. B. electrical or electronic components such as active or passive components (eg., Transistors, semiconductor chips, resistors, capacitors, etc.) to connect and "electrically wired".
  • the circuit carrier as such may in this case be of a type known per se (eg printed circuit board, flex PCB, organic or inorganic substrate, etc.).
  • the term "component” is understood in the broadest sense, so that z.
  • a circuit carrier possibly without electronic function, or z. B. also falls a housing part under this term.
  • At least one of the two components is a QFN ("quad flat no-lead") component, an SMD component or an "bare die”.
  • At least one of the two contact surfaces is a component surface intended for soldering per se (in the prior art).
  • connection surfaces are usually located on the underside of the chip substrate.
  • connection surfaces can, for example, wise also be provided at the ends of corresponding pins or connecting wires.
  • At least one of the two contact surfaces is formed on a connecting wire of the relevant component or the component in question as such is a connecting wire.
  • a contact surface at the end of a connecting wire can be roughened and pressed onto a connection pad of a circuit carrier with or without the interposition of an auxiliary substance (eg solder).
  • an auxiliary substance eg solder
  • At least one of the two components is a housing or a housing part of the circuit arrangement.
  • At least one of the two components is a heat sink.
  • the two contact surfaces are interconnected by direct joining.
  • the two contact surfaces are joined together with the interposition of an auxiliary material.
  • a degree of pressure suitable for the respective application when joining the respective components depends on the type and nature (eg material and roughening geometry) of the relevant contact surfaces and can be optimized in individual cases.
  • the joining process can also z. B. carried out or supported by means of ultrasound and / or a temperature.
  • At least one of the two contact surfaces is a metal surface.
  • the two contact surfaces may be surfaces of the same or different nature. So z. For example, two contact surfaces designed as metal surfaces can be joined together. Alternatively, z. B. a metal surface are connected to a plastic surface. In a metal-metal compound, for. B. a roughening of both metal surfaces may be provided, whereby a non-positive connection can be realized. In a metal-plastic compound or more generally a connection between a relatively solid material and a relatively soft material (possibly also both metals), a positive connection can be created even if the softer material was not roughened before joining.
  • the roughening is provided in the microstructure region.
  • typical dimensions of roughening structures may be less than 1 ⁇ m.
  • the above-explained refinements or peculiarities of the circuit arrangement can be provided individually or in different combinations with each other. Corresponding developments and refinements can also be used for the method according to the invention for producing such a circuit arrangement.
  • a temperature of the joint, in particular z. B. the pressing together takes place at an elevated temperature.
  • the two contact surfaces are connected by a direct joining together.
  • the two contact surfaces are joined together with the interposition of an auxiliary substance.
  • the roughening takes place in the microstructure region.
  • the roughening comprises a mechanical processing of the relevant contact surface.
  • the roughening involves the use of an ion beam technique.
  • the invention can be used for many applications.
  • a preferred field of application is, for example, the mechanical and electrical (galvanic) connection between the relevant components, be it without auxiliary substances (eg. Solder, glue, screws, etc.) or with such auxiliaries.
  • auxiliary substances eg. Solder, glue, screws, etc.
  • Another preferred use is the mechanical fixation of a component with simultaneous sealing or sealing function.
  • the invention can also be used to realize a particularly good thermal connection of a respective component to another component.
  • Another interesting use is to improve on known Drahtbondstellen a circuit arrangement or completely replaced.
  • the invention can be used quite generally as a replacement or improvement of solder joints in circuit arrangements.
  • An improvement can z. B. exist in an extension of the life and / or avoidance or reduction of voids at a solder joint.
  • Fig. 1 is a schematic representation of a roughening process for two to be joined together
  • Fig. 2 is a representation corresponding to FIG. 1
  • Fig. 3 is a view corresponding to FIG. 2 after
  • FIG. 4 shows a plan view of a contact surface arrangement in a QFN component
  • 5 is a view corresponding to FIG. 4 for a SMD Bauelernent
  • connection region 7 shows a perspective view of a connection region according to a further exemplary embodiment
  • FIG. 8 is a perspective view of a composite of two printed circuit boards
  • FIG. 9 is a perspective view of a composite of two printed circuit boards on another flexible circuit board.
  • FIG. 10 is a perspective view for illustrating the space requirement of soldering pads
  • FIG. 11 is a schematic side view of a sealing area between a housing cover and a housing bottom of conventional design
  • FIG. 12 is a view similar to FIG. 11, but of inventive design
  • FIG. 13 is a view similar to FIG. 11, according to a modified embodiment
  • FIG. 14 is a view similar to FIG. 13, but for a erfindungsffleße design
  • Fig. 15 is an illustration for illustrating a
  • Wire bonding according to two variants 16 shows a representation to illustrate a soldering process, on the one hand of conventional type (FIG. 16, left) and, on the other hand, of the type according to the invention (FIG. 16, right),
  • 17 is an illustration for illustrating the increase of a cooling surface in a heat sink by means of a roughening process
  • FIG. 18 is an illustration for illustrating the attachment of a heat sink to a device of a circuit arrangement
  • FIG. 19 is an illustration of more concrete application examples of the mounting method shown in FIG. 18.
  • FIG. 19 is an illustration of more concrete application examples of the mounting method shown in FIG. 18.
  • FIGS. 1 to 3 illustrate an exemplary embodiment of a method for producing a circuit arrangement in which at least two components are to be galvanically and / or mechanically connected.
  • FIG. 1 shows in the construction of a circuit arrangement (not shown in total) galvanically and mechanically interconnected components 10-1 and 10-2 (eg electronic component and circuit carrier).
  • the components 10-1 and 10-2 each have a contact surface 12-1 and 12-2, which are in the illustrated embodiment, metal surfaces on which the
  • Fig. 1 an ion beam device 14 is further symbolized, by means of which first a roughening of at least one of the contact surfaces 12-1 and 12-2.
  • both contact surfaces are roughened, preferably in each case in the microstructure region.
  • Fig. 2 shows (highly schematic and enlarged) the result of the roughening process of Fig. 1.
  • a plurality of protruding structural bodies is provided.
  • FIG. 3 shows how, after the components 10-1 and 10-2 have been joined to one another at their contact surfaces 12-1 or 12-2, these structural bodies mesh with one another. This creates an advantageously easy-to-implement, mechanically stable and electrically highly conductive connection of the components.
  • this embodiment illustrates a mechanical fixation of a metal surface on another metal surface while maintaining the electrical conductivity.
  • Two metal surfaces of the same or different nature can be fixed to one another in such a way that the connection withstands both internal and external loading, while maintaining the electrical conductivity at this connection point.
  • the connection illustrated in FIG. 3 can in many applications have a longer service life and / or withstand the respective loads for a longer time.
  • the fixation method illustrated in FIG. B. a conventional soldering can be performed.
  • What is essential in this exemplary embodiment is the contact surface of one or both components 10-1 and 10-2 modified by an ion beam (alternatively, for example, by mechanical processing).
  • the surfaces can be modified in the form that, similar to a hook-and-loop fastener, a mechanical bond or also a toothing between the merged contact surfaces 12-1 and 12-2 is achieved.
  • the two contact surfaces 12-1 and 12-2 are joined together directly.
  • This has, for example, the advantage of a small footprint of the joint in the joining direction.
  • This small footprint can in the relevant circuit z. B. be used for a high packing density.
  • an adjuvant could be used, which brings an additional mechanical fixation and / or an improvement of the galvanic connection or its connection effect by the roughening described at least one of the contact surfaces 12-1 and 12-2 in terms the load capacity and the life is improved.
  • the components 12-1 and 12-2 may be "components in the narrower sense", ie in particular electrical or electronic components (eg semiconductor components) that are mechanically and electrically connected to a circuit carrier (eg printed circuit board). be connected to the concerned one
  • a circuit carrier eg printed circuit board
  • a Schal- Carrier itself be regarded as a "component" of the relevant circuit arrangement.
  • a component which can be galvanically and / or mechanically connected in this manner can be formed by a housing arrangement of the circuit arrangement.
  • FIGS. 4 and 5 each show an example of a packaged semiconductor device of a type known per se, which, however, are readily usable within the scope of the invention.
  • FIG. 4 is a bottom plan view of a so-called QFN (quad flat no-lead) device 10A-1.
  • the device 10a-1 has 32 contact surfaces 12a-1 ("connection pads").
  • these contact surfaces 12a-l z. B. with correspondingly arranged contact surfaces of a circuit carrier are electrically and mechanically connected.
  • FIG. 5 shows a plan view of the underside of a so-called SMD (surface-mounted device) component 10B-1, which in the example shown has two contact surfaces 12b-1.
  • SMD surface-mounted device
  • the corresponding contact surfaces of the respective "joining partner" eg printed circuit board
  • the corresponding contact surfaces of the respective "joining partner” can advantageously be dimensioned smaller, in particular z. B. with dimensions identical to the component contact surfaces.
  • Fig. 6 shows an example of a circuit arrangement 16c comprising a printed circuit board 10c-2, which is equipped on its upper side with a plurality of electronic components. At least some of these components are embodied as so-called “bare-dies" (unpackaged chips) 10c-1 and according to the invention, for example as described above with reference to FIGS. 1 to 3, galvanically and mechanically with corresponding conductor track sections Printed circuit board 10c-2 connected.
  • bare-dies unpackaged chips
  • Fig. 7 illustrates an example of an electronic device 10d-1 on a circuit board 10d-2.
  • the printed circuit board 10d-2 is provided with electrical feedthroughs ("vias") 18d of a type known per se, in the regions of which electrical contacting of the component 10D-1 takes place via so-called solder balls 20d.
  • a special feature of this galvanic and mechanical connection is that contact surface areas of the leadthroughs 18d and / or of the component 10d-1 which come into contact with the solder have been previously roughened.
  • FIG. 8 shows an example of a circuit arrangement 16e comprising a first substrate 10e-1 and a second substrate 10e-2, which are galvanically and mechanically provided according to the invention. are connected to each other. This connection consists of contact surfaces on the underside of the first substrate 10e-1 and corresponding contact surfaces on the upper side of the second substrate 10e-2.
  • the substrates lOe-1 and 10e-2 may be organic and / or inorganic substrates.
  • both substrates 1Oe-1 and 10e-2 each serve as circuit carriers for the electrical connection of further components of the circuit arrangement 16e.
  • Fig. 9 shows an example of a circuit arrangement 16f comprising two rigid printed circuit boards 10f-1 which are connected to each other via a flexible printed circuit board (“flex PCB”) 10f-2.
  • flex PCB flexible printed circuit board
  • the rigid printed circuit boards 10f-1 serve as circuit carriers for accommodating conventional electronic components.
  • the peculiarity of the circuit arrangement 16f consists in the manner of the galvanic and mechanical connection of the two end regions of the flexible printed circuit board 10f-2 to corresponding contacting regions on the upper sides of the rigid printed circuit boards 10f-1. Of these two “joining partners" at least one has a roughened contact surface arrangement.
  • FIG. 10 illustrates the conventionally large space requirement of contact surfaces 12g-2 on a flat side of a substrate 10g-2 for contacting corresponding contact surfaces of an electronic component 10g-1 (eg SMD component).
  • an electronic component 10g-1 eg SMD component
  • the substrate-side contact surfaces 12g-2 or the component-side contact surfaces or both of these contact surfaces are roughened, then the substrate-side contact surfaces 12g-2 can be provided smaller than shown in FIG.
  • the connection can be made by simply joining or pressing, whereby by no means should be closed, that as an excipient z. B. a solder or an electrically conductive adhesive is interposed.
  • a solder it is expedient to carry out the pressing process at elevated temperature.
  • the joining process z. B. performed or supported by means of ultrasound.
  • the use of the invention for the galvanic and / or mechanical connection of components in the strict sense and circuit carriers is in the foreground.
  • the invention has a very wide range of applications.
  • the use of the invention for "components" in the form of housings or housing parts of circuit arrangements is illustrated below with reference to FIGS. 11 to 14.
  • FIG. 11 shows a schematic side view of the per se known connection of the edge region of a housing cover 30h of a (not shown) circuit arrangement on a housing bottom 32h by means of a seal 34h. Not shown are for this connection method usual fastening means (eg screws, rivets, etc.), which fix the housing cover 30h in the position shown with respect to the housing bottom 32h and clamp the seal 34h between them.
  • fastening means eg screws, rivets, etc.
  • the housing parts 30h and 32h must be connected to each other using such fastening means (also for example adhesives).
  • the sealing function of the connection desired here requires a special sealing material in the form of the seal 34h (eg insertion seal, sealing bead, sealing gel etc.), which represents an additional expense in the production of the circuit arrangement.
  • the avoidance of these additional parts and the hard-to-automate effort can be realized in a simple manner by a modification, as z. B. in Fig. 12 is shown.
  • FIG. 12 again shows a housing cover 10h-1 whose cover edge is mechanically connected to an edge region of a housing bottom 10h-2, a sealing function being ensured at this connection point.
  • the housing bottom 10h-2 is made of metal and the housing cover 10h-1 made of plastic.
  • a contact surface of the metallic housing bottom 10h-2 was roughened (eg by means of an ion beam) and then the cover 10H-1 was pressed onto the bottom 10h-2.
  • the roughened metal part 10h-2 has upwardly projecting structural elements in the connection area, which press into the plastic material of the cover 10H-1 during the pressing process, so that a form-fitting connection is created.
  • connection thus realized advantageously already has a sealing function, so that the provision and installation of a separate seal or the like is unnecessary.
  • the roughening could also be provided for both joining partners (lid 10h-1 and bottom 10h-2).
  • the materials could be chosen other than those described above.
  • a connection is produced during assembly, which can be positive and / or non-positive.
  • the cover 10H-1 as well as the bottom 10h-2 are formed of metal and roughened on the corresponding contact surfaces and connected to one another, the result is primarily a frictional connection, which also has a positive fit can be, if a joining partner has a certain elasticity or deformability.
  • a relatively high pressure and optionally also an elevated temperature can have a positive effect on the strength or the tightness of the connection created.
  • the geometric structural change of at least one of the surfaces involved a use of hitherto conventional excipients (screws, gaskets, etc.) omitted.
  • the assembly process is greatly simplified and the material costs are reduced.
  • FIG. 13 shows a modified example of a connection between a housing cover 30i and a housing bottom 32i, sealing in the illustrated edge region of the housing arrangement 30i, 32i in a manner known per se using two seals 34i and 36i. These seals each seal against a spacer 38i.
  • Fig. 14 shows a similar housing structure with a housing cover 10j -1 and a housing bottom 10j -2, which are again connected to each other via a spacer 10j -3 sealingly.
  • the transitions from the spacer 10J-3 on the one hand to the cover 10J-1 and, on the other hand, to the bottom 10j-2 are each implemented according to the invention.
  • FIGS. 12 and 14 thus illustrate a mechanical fixation of two or more components of a circuit arrangement with optional sealing effect.
  • Fig. 15 illustrates the use of the invention for improved wire bonding.
  • 15 shows a first exemplary embodiment in which an electronic component 10K-1 (eg chip) is connected via a bonding wire 10k-2 to the upper side of a "target pad" of a substrate or a printed circuit board 10k-3. is clocked.
  • the printed circuit board 10k-3 also carries the electronic component 10k-1 (by means of a conductive adhesive layer).
  • the contact surface lOk-1 was roughened.
  • the bonding wire 10k-2 (not roughened in this example) was pressed onto the roughened contact surface 12k-1.
  • a second connection made in a corresponding manner is provided between the left-hand end of the bonding wire 10k-2 in the figure and the printed circuit board 10k-3 or its contact surface 12k-3. Also at this point was before the pressing of the bonding wire 10k-2, the circuit board-side contact surface
  • a modified embodiment of an improved bonding wire connection (eg for "ribbon bonding") is shown below in FIG.
  • a bonding wire 101-2 is electrically and mechanically connected at both wire ends to contact surfaces 121-3 and 121-1 of respective circuit carriers (eg DCB) 101-3 and 101-1, respectively.
  • the two circuit carriers are at their
  • the two variants of the method can, of course, be used in one and the same circuit arrangement individually or in combination.
  • the surface roughened by the roughened target pad makes it easier for the contact partners to connect to one another.
  • the necessary energy input is reduced and the load on the joining partners during joining decreases.
  • Bonding wire can be achieved, which continues to lead to a longer life.
  • both joining partners are roughened before joining, the surface increases further and the contact partners can additionally interlock, which further facilitates a connection.
  • the necessary energy input is reduced and the load on the joining partners during joining decreases. It can also be achieved a better integration of the bonding wire, which increases the life of the connection created.
  • roughened surfaces of one or both joining partners achieve a bond with less energy input. By better interlocking of the partners, the life of the connection can be increased.
  • Fig. 16 illustrates another aspect of the present invention, namely the possibility of avoiding disadvantageous voids in solder joints.
  • This is illustrated in the left part of FIG. 16. From top to bottom in this illustration, a conventional soldering process is shown, in which a component 50m is soldered to a contact surface 52m on a circuit carrier 54m.
  • the circuit carrier 54m is first provided with a solder layer 56m and then the component 50m is pressed onto the solder layer 56m under the influence of temperature.
  • Fig. 16 shows an improved soldering process in which a device 10n-1 is soldered to another device (eg, printed circuit board) 10n-2.
  • solder layer 56n is applied to the contact surface 12n-2.
  • the components lOn-1 and 10n-2 are joined together and preferably used under the influence of temperature. solders. The formation of one or more large voids in the solder layer 56n is advantageously avoided.
  • Figure 17 illustrates another aspect of the present invention for which the applicant also reserves independent protection.
  • This aspect relates to increasing the heating efficiency of a heat sink (including heat sink) of a circuit arrangement, regardless of whether the relevant heat sink in the manner described above (roughening at least one contact surface) is connected to another component of the circuit arrangement or not.
  • the heat emission in a conventional heat sink 6Oo is illustrated on the left in FIG. 17 (the arrows in the figure symbolize the release of heat to the environment).
  • the use of the heat sink 6Oo serves z.
  • the resulting in a powered device heat loss dissipate.
  • the amount of heat that can be released to the environment depends greatly on the size of the surface provided by the heat sink 6Oo.
  • a heat sink of the type symbolized in FIG. 17 has usually been attached to the surface to be cooled. This happened among other things by means of glue or screws.
  • the heat transfer from the surface is hindered in the heat sink, for example by air gaps between the two parts or by an intermediate layer such.
  • B. adhesive layer since the surface to be cooled and the heat sink are not in one piece, the heat transfer from the surface is hindered in the heat sink, for example by air gaps between the two parts or by an intermediate layer such.
  • Fig. 17 right is illustrated how can be increased by the roughening of a surface of a heat sink 1Oo its provided for the release of heat surface.
  • the roughening of the surface can z. B. by means of ion beam technology. Alternatively or additionally, mechanical processing steps are considered in order to produce the desired roughness.
  • the roughening is provided in the microstructure region, ie with comparatively small resulting structural elements on the relevant surface.
  • heat sink 10Oo With the heat sink 10Oo, with the same dimensions, compared to a conventional heat sink (60o), one has a much larger surface area to release heat from the material of the heat sink (eg metal) to the environment.
  • the material of the heat sink eg metal
  • the heat sink to form a section of a housing of an electronic component in the strict sense, or for the heat sink to form a section of a circuit carrier (eg printed circuit board or the like).
  • a "conventional separate heat sink” is formed larger surface available for heat dissipation.
  • the advantage of this development over conventional heat sinks is that in this technique "cooling fins" and the underlying material consist of one piece. As a result z. B. no air gaps present that hinder the thermal transport. Also, no fasteners or materials (eg, screws, glue, etc.) are needed to secure the heat sink, since everything is one piece. Furthermore, the "handling" is eliminated, since the "cooling fins" are formed directly on the material of the respective surface by the roughening.
  • One possible application example is roughening the surface of a microcontroller.
  • the temperature of the microcontroller can be considerably lowered during operation.
  • Another application is to treat the inside and / or outside surfaces of a radiator in the car. This would make it possible to deliver the temperature to the cooler faster in the water cycle.
  • the radiator however, can deliver the temperature to the environment faster through the wind and rough surface.
  • FIG. 18 illustrates an assembly of a heat sink IOp-1 and another device 10P-2, in which it is z. B. can be a circuit carrier (eg., Printed circuit board, circuit substrate, etc.).
  • the device could also 10p-2 of a substrate or a housing of a device in the strict sense, ie z. B. an electronic module (transistor, chip, etc.) may be formed.
  • FIG. 18 below shows the composite formed after assembly of the components 10P-1 and 10P-2. In this connection method, all special features and developments can be provided, which have already been explained in the embodiments described above.
  • FIG. 19 illustrates two more specific application examples of the embodiment explained above.
  • Fig. 19 the thermal and mechanical connection of a heat sink 10q-1 at the bottom of a conventional circuit board 10q-2 is shown.
  • FIG. 19 an embodiment is shown in which a heat sink lOr-1 is placed on the top of a housing of a conventional electronic component 10r-2 and pressed.
  • joining two contact surfaces, of which at least one is roughened directly or indirectly (eg with the interposition of solder, adhesive (in particular electrically and / or thermally conductive), etc .).

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Metallurgy (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention a pour objectif de relier mécaniquement et/ou électriquement au moins deux éléments structurels (10). Selon l'invention, cet objectif est atteint avec un ensemble de circuits doté d'au moins deux éléments structurels (10) qui présentent chacun une surface de contact (12), du fait qu'au moins l'une des surfaces de contact (12) est rugueuse et que les éléments structurels (10) sont reliés de manière galvanique et/ou mécanique par un assemblage à serrer des surfaces de contact (12). Un avantage de l'invention est que, pour la création de l'assemblage, un matériau auxiliaire (par exemple métal d'apport, colle, vis, rivets, etc.) n'est pas forcément nécessaire. La présente invention convient en particulier à une fixation automatisée ainsi qu'éventuellement à une fonction étanche. Des processus de brasage du type connu par exemple peuvent être remplacés ou améliorés avantageusement. De plus, la présente invention peut être utilisée avantageusement en rapport avec la réalisation et la liaison thermique de corps de refroidissement.
PCT/EP2007/063165 2006-12-11 2007-12-03 Ensemble de circuits et procédé de production d'un ensemble de circuits Ceased WO2008071576A2 (fr)

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DE102006058651.4 2006-12-11
DE102006058651 2006-12-11
DE102007021073.8 2007-05-04
DE102007021073.8A DE102007021073B4 (de) 2007-05-04 2007-05-04 Verfahren zum Herstellen einer Schaltungsanordnung

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018145968A1 (fr) * 2017-02-09 2018-08-16 Siemens Aktiengesellschaft Module de puissance
US20210407937A1 (en) * 2018-11-15 2021-12-30 Rohm Co., Ltd. Semiconductor device

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US4937653A (en) * 1988-07-21 1990-06-26 American Telephone And Telegraph Company Semiconductor integrated circuit chip-to-chip interconnection scheme
JP3135435B2 (ja) * 1993-10-19 2001-02-13 松下電器産業株式会社 回路基板の電極接続方法
JP2870497B2 (ja) * 1996-08-01 1999-03-17 日本電気株式会社 半導体素子の実装方法
US6742701B2 (en) * 1998-09-17 2004-06-01 Kabushiki Kaisha Tamura Seisakusho Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus
DE19958328A1 (de) * 1999-10-08 2001-07-12 Flexchip Ag Verfahren zum Herstellen einer elektrischen Verbindung zwischen Chip-Kontaktelemente-Einheiten und externen Kontaktanschlüssen
US7015580B2 (en) * 2003-11-25 2006-03-21 International Business Machines Corporation Roughened bonding pad and bonding wire surfaces for low pressure wire bonding
JP2006294650A (ja) * 2005-04-05 2006-10-26 Oki Electric Ind Co Ltd 電子部品の実装方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018145968A1 (fr) * 2017-02-09 2018-08-16 Siemens Aktiengesellschaft Module de puissance
US20210407937A1 (en) * 2018-11-15 2021-12-30 Rohm Co., Ltd. Semiconductor device
US11894325B2 (en) * 2018-11-15 2024-02-06 Rohm Co., Ltd. Semiconductor device having a resin that seals a rewiring

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