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WO2008065728A1 - Composition de particules métalliques de frittage ayant une plasticité, procédé de production de celle-ci, agent de liaison et procédé de liaison - Google Patents

Composition de particules métalliques de frittage ayant une plasticité, procédé de production de celle-ci, agent de liaison et procédé de liaison Download PDF

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Publication number
WO2008065728A1
WO2008065728A1 PCT/JP2007/000277 JP2007000277W WO2008065728A1 WO 2008065728 A1 WO2008065728 A1 WO 2008065728A1 JP 2007000277 W JP2007000277 W JP 2007000277W WO 2008065728 A1 WO2008065728 A1 WO 2008065728A1
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WO
WIPO (PCT)
Prior art keywords
particle composition
sinterable
metal
silver
dispersion medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/000277
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English (en)
Japanese (ja)
Inventor
Katsutoshi Mine
Kimio Yamakawa
Hidetomo Asami
Nobuhiro Takahashi
Yuko Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Handa Co Ltd
Original Assignee
Nihon Handa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Handa Co Ltd filed Critical Nihon Handa Co Ltd
Priority to JP2008528272A priority Critical patent/JP4247800B2/ja
Publication of WO2008065728A1 publication Critical patent/WO2008065728A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/1017—Multiple heating or additional steps
    • B22F3/1021—Removal of binder or filler
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy

Definitions

  • Sinterable metal particle composition having plasticity, manufacturing method thereof, bonding agent and bonding method
  • the present invention relates to a sinterable metal particle composition having plasticity at room temperature or under heating, a production method thereof, a sheet-like bonding agent comprising the same, and the metal particle composition between a plurality of metal members.
  • the present invention relates to a method of joining metal members that interspers and sinter sinterable metal particles by heating.
  • Conductive coatings and thermal conductive coatings prepared by dispersing fine particles of metals such as silver, copper and nickel in a curable resin composition are cured by heating and become conductive coatings.
  • Forming a conductive circuit on the printed circuit board forming various electronic components such as resistors and capacitors, forming electrodes for various display elements, forming a conductive film for electromagnetic wave shielding, Bonding and bonding of chip components such as capacitors, resistors, diodes, memories, and computing elements (CPUs) to the substrate, formation of solar cell electrodes, especially for solar cell electrodes that cannot be processed at high temperatures using amorphous silicon semiconductors
  • Application to formation of external electrodes of chip-type ceramic electronic components such as forming, multilayer ceramic capacitors, multilayer ceramic inductors, multilayer ceramic actuators, etc. (For example, JP 2 0 0 3 _ 5 5 7 0 1) o
  • conductive films and thermally conductive coatings consist of metal particles and a cured resin, and the cured resin is electrically insulating and has a low thermal conductivity. There is a limit.
  • a conductive and heat conductive paste containing no curable resin For example, silver
  • a precious metal base made of flakes and an organic solvent, and a method of fixing the electronic device to the substrate by heating and sintering the precious metal paste between the electronic device and the substrate.
  • a metal paste comprising an organic solvent and at least one metal powder selected from gold (Au) powder, silver (Ag) powder or palladium (Pd) powder having an average particle size of 0.005 m to 1.0 m; and JP-A-2005-21 6508 discloses a method of forming bumps by heating and sintering the metal paste on a semiconductor wafer.
  • the paste-like metal particle composition is a mixture of metal particles having a large specific gravity and a volatile dispersion medium having a small specific gravity, and the two are easily separated due to the difference in specific gravity between the two. There is.
  • it since it is in the form of a paste, it is not easy to obtain a predetermined shape, size and thickness when applied, and there is a problem that the shape, size and thickness change over time.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2003-55701
  • Patent Document 2 Tokuhei 7 _ 1 1 1 981
  • Patent Document 3 JP 2005 _ 21 6508
  • An object of the present invention is to sinter metal particle composition that does not separate sinterable metal particles and volatile dispersion medium, easily takes a predetermined shape, size and thickness, and has excellent shape retention.
  • An object of the present invention is to provide a manufacturing method thereof, a sheet-like bonding agent, and a method of strongly bonding a metal member using the same. Means for solving the problem
  • A 100 parts by weight of sinterable metal particles having an average particle size of 0.001 to 50 m, and (B) solid at room temperature, melting at a temperature below the sintering temperature of metal particles
  • a sinterable metal particle composition comprising 3 to 100 parts by weight of a volatilizing dispersion medium and having plasticity at room temperature or under heating.
  • a bonding agent for metal members comprising the sinterable metal particle composition according to [1], and having a sheet shape.
  • the sinterable metal particle composition according to [1] or the bonding agent according to [3] is interposed between a plurality of metal members and heated to a temperature equal to or higher than the melting point of the dispersion medium (B).
  • the dispersion medium (B) is volatilized, and the metal particles (A) are sintered together by heating, heating while applying pressure, applying ultrasonic vibration while applying pressure, or applying ultrasonic vibration while applying pressure and heating.
  • a method for joining metal members characterized in that a plurality of metal members are joined together.
  • the sinterable metal particles are silver particles, [4] or
  • the sinterable metal particle composition of the present invention has plasticity at room temperature or under heating, the metal particles having a large specific gravity and the volatile dispersion medium having a small specific gravity are not separated, and can easily take a predetermined shape. Moreover, it has excellent shape retention.
  • the sheet-like bonding agent of the present invention has plasticity at room temperature or under heating, the metal particles having a large specific gravity and the volatile dispersion medium having a small specific gravity are not separated, and the polarity is excellent.
  • the method for producing a sinterable metal particle composition of the present invention can efficiently and easily produce a sinterable metal particle composition having plasticity at room temperature or under heating. Since the metal member joining method of the present invention uses a sinterable metal particle composition having plasticity at room temperature or under heating, a plurality of metal members can be joined together with high accuracy and strength.
  • FIG. 1 is a plan view of measurement of shape retention of a sinterable metal particle composition in an example.
  • the sinterable metal particle composition of the present invention comprises (A) 100 parts by weight of sinterable metal particles having an average particle diameter of 0.001 to 50 m, and (B) room temperature. Dispersing medium that melts and volatilizes at a temperature lower than the sintering temperature of the metal particles (A) and consists of 3 to 100 parts by weight, is solid at room temperature, and is plastic at room temperature or under heating It is characterized by having
  • the surface state of the sinterable metal particles (A) is not limited, and an organic substance may adhere to the surface. As long as the sinterability is not hindered, the type and amount of organic substances adhering to the surface are not limited. Examples of such organic substances include reducing agents, dispersants, stabilizers and the like used in producing the sinterable metal particles (A), and lubricants used in flaking. .
  • the lubricant As the lubricant, higher fatty acids, higher fatty acid metal salts, higher fatty acid amides or higher fatty acid esters are preferable, and higher fatty acids are particularly preferable.
  • the amount of lubricant attached varies depending on the particle size, specific surface area, and shape of the sinterable metal particles (A), but is preferably 3% by weight or less, more preferably 1% by weight or less of the sinterable metal particles (A). preferable. This is because if the amount is too large, the heat sinterability is lowered.
  • the shape of the sinterable metal particles (A) is spherical, substantially spherical, substantially cubic, flakes, indefinite or the like. From the viewpoint of storage stability, a flake shape is preferable.
  • the flammable sinterable metal particles (A) to which the lubricant is adhered can be obtained by adding a lubricant to the spherical sinterable metal particles and grinding them with a pole mill or the like. It can be produced (see Japanese Patent Publication No. SHO 40-069 71, Japanese Patent Application Laid-Open No. SHO 2000-055 [0 0 0 4]).
  • a granular sinterable metal particle and a lubricant such as a higher fatty acid, a higher fatty acid metal salt, a higher fatty acid ester, a higher fatty acid amide, and the like are put into a rotary drum device (for example, a pole mill) together with a ceramic pole.
  • a rotary drum device for example, a pole mill
  • lipophilic organic substances such as higher fatty acids, higher fatty acid metal salts, higher fatty acid esters, and higher fatty acid amides for improving lubricity adhere to the flaky sinterable metal particles.
  • the flaky sinterable metal surface (A) is preferably coated with more than half or all of such a higher fatty acid or the like.
  • the sinterable metal particles (A) whose metal surfaces are coated with a lubricant exhibit lipophilicity and improved affinity with the dispersant (B). Storage stability is improved. However, if too much lubricant is applied, the sinterability may decrease.
  • the adhesion amount of the lubricant can be measured by a usual method. For example, a method of measuring weight loss by heating above the boiling point of the lubricant in nitrogen gas, and heating the sinterable metal particles (A) in an oxygen stream to adhere to the sinterable metal particles (A) Examples include a method of quantitatively analyzing carbon dioxide in the lubricant by changing to carbon dioxide and carbon dioxide by infrared absorption spectroscopy.
  • the sinterable metal particles (A) whose surfaces are coated with a lubricant can also be produced by ordinary methods. For example, it can be produced by immersing metal particles in a lubricant solution, taking out the metal particles and drying them.
  • the dispersion medium (B) is solid at room temperature and melts and volatilizes at a temperature lower than the sintering temperature of the sinterable metal particles (A). is required. This is because the sinterable metal particle composition of the present invention does not become solid at room temperature unless the volatile dispersion medium is solid at room temperature, for example, 5 ° C. to 38 ° C. In order to be solid at room temperature, the melting point must be higher than room temperature. However, if the melting point is too close to room temperature, it will not be possible to retain the shape in high-temperature tubs or workplaces with high room temperature. Specifically, the melting point is preferably 40 ° C. or higher.
  • the melting point of the dispersion medium (B) is lower than the sintering temperature in this temperature range, and its boiling point is the sintering temperature in this temperature range.
  • the boiling point is preferably 60 ° C. to 300 ° C. If the boiling point is less than 60 ° C, the solvent tends to evaporate during the preparation of the sinterable metal particle composition, and if the boiling point is 300 ° C or more, the dispersion medium will remain after sintering. This is because (B) may remain.
  • dispersion medium (B) pyrogallol, p_methylbenzyl alcohol, o_methylbenzyl alcohol, syl_3,3,5-trimethylcyclohexanol, one terbineol, 1,4-cyclohex Xanthodimethanol, 1,4-cyclohexanediol, alcohols such as pinacol, hydrocarbons such as biphenyl, naphthalene, durene, ketones such as dibenzoylmethane, chalcone, acetylcyclohexane, lauric acid, Examples include fatty acids such as force puric acid. Two or more types of dispersion medium (B) may be used in combination, but the mixture must be solid at room temperature.
  • the amount of the dispersion medium (B) is 3 to 100 parts by weight per 100 parts by weight of the sinterable metal particles (A). However, the appropriate amount varies depending on the particle size, shape, specific gravity, etc. of the sinterable metal particles (A) and the properties of the dispersion medium (B), so the mixture with the sinterable metal particles (A) is the dispersion medium. The amount is sufficient to become a paste above the melting point of (B), and is sufficient to become a semi-solid or solid at normal temperature.
  • the sinterable metal particle composition of the present invention contains non-metallic powders, metal compounds and metal complexes, as long as the object of the present invention is not violated. , Thixogens, stabilizers, colorants, and other additives may be included in small or trace amounts.
  • the sinterable metal particle composition of the present invention has plasticity at room temperature or under heating.
  • Plasticity at normal temperature is a property that clay minerals with moderate water content exhibit.
  • plasticity means a property that is semi-solid at normal temperature and easily plastically deforms when stress is applied.
  • plasticity under heating is a property that thermoplastics exhibit. In other words, it is a solid state at normal temperature and does not deform even when stress is applied, but becomes semi-solid when it exceeds a certain temperature and easily plastically deforms when stress is applied.
  • the sinterable metal particle composition of the present invention is a sheet (including a film) at room temperature. It is preferable that The size of the sheet is not limited, and the thickness of the sheet is not limited, but 5 0 ⁇ ! A uniform thickness of ⁇ 1 mm is preferable.
  • the sheet shape is convenient for interposing between two flat metal members.
  • the size and shape of the sheet are preferably the size and shape of the metal member to be joined, or the size and shape that require joining.
  • the sheet-like sinterable metal particle composition is made of a metal such as sheet-like, film-like, or wire-like (however, the same metal as the sinterable metal particles (A) or a dissimilar metal may be sintered). Metal that is easy to bond during tying) A piece may be included.
  • the sinterable metal particle composition of the present invention is semi-solid or solid at room temperature, but when heated to a temperature equal to or higher than the melting point of the dispersion medium (B), the dispersion medium (B) melts. Then it becomes a paste and begins to evaporate. However, depending on the type of dispersion medium (B), it will start to evaporate when the temperature rises further.
  • the dispersion medium (B) is volatilized or completely volatilized, if the temperature exceeds the sintering temperature of the sinterable metal particles (A), the sinterable metal particles (A) sinter, and when cooled, the solid metal and become.
  • the sinterable metal particles (A) When the sinterable metal particles (A) are in contact with the metal member during sintering, the solid metal adheres to the metal member. At this time, the sinterable metal particles (A) and the metal member are preferably the same metal, but even if they are dissimilar metals, any metal can be used as long as it can be easily bonded during sintering.
  • the heat sintering temperature of the sinterable metal particles (A) needs to be not less than the melting point of the dispersion medium (B) and not less than the temperature at which the dispersion medium (B) can be volatilized.
  • the sinterable metal particle composition of the present invention When used for joining a plurality of metal members, it is interposed between the metal members and has a melting point of the dispersion medium (B) or higher. Heat to a temperature equal to or higher than the melting point of B) and higher than the temperature at which the dispersion medium (B) can be volatilized and higher than the temperature at which the sinterable metal particles (A) can be sintered.
  • the melting point of the dispersion medium (B) is 100 ° C. or lower, this temperature is preferably from 100 ° C. to 400 ° C. More preferably, it is 50 ° C or higher and 300 ° C or lower.
  • the shape of the solid metal resulting from the sintering of the sinterable metal particle composition (A) by heating the sinterable metal particle composition of the present invention is not limited to a sheet, but a tape, It may be linear, disk-shaped, block-shaped, spot-shaped, or indefinite.
  • the sinterable metal particle composition of the present invention is dispersed when heated, heated while applying pressure, applied ultrasonic vibration while applying pressure, or applied ultrasonic vibration while applying pressure and heated.
  • the medium (B) melts and volatilizes and the sinterable metal particles (A) sinter, it becomes a solid metal with excellent strength, electrical conductivity, and thermal conductivity.
  • This solid metal adheres to metal parts that have been in contact, such as gold-plated substrates, silver substrates, silver-plated metal substrates, metal substrates such as copper substrates, and electrodes on electrically insulating substrates. It is useful for joining metallic substrates, joining electronic parts with metal parts, electronic equipment, electrical parts, electrical equipment, etc.
  • the sinterable metal particles (A) are silver particles, solid silver having high strength, extremely high electrical conductivity and thermal conductivity is preferable.
  • Such bonding includes bonding of chip components such as capacitors and resistors to circuit boards, bonding of semiconductor chips such as diodes, memories, and CPUs to lead frames or circuit boards, and cooling of high heat generating CPU chips. The joining with a board is illustrated.
  • the frequency of the ultrasonic vibration is 2 kHz or more, and preferably 10 kHz or more.
  • the upper limit is not particularly limited, but it is about 500 kHz due to the ability of the ultrasonic vibration device.
  • the amplitude of the ultrasonic vibration affects the sinterability, it is preferably 0.1 to 40 m, more preferably 0.3 to 20 m, and still more preferably 0.5 to 12 m. .
  • the ultrasonic vibration transmitting portion is pressed against the sinterable metal particle composition through a cover material made of a material that hardly absorbs ultrasonic vibration.
  • Pressure Pushing to sintered metal particle composition preferably 0.9 k Pa (0.09 gf / mm 2) or more, more preferably 9 k P a (0.92 gf / mm 2) or more, more preferably 39 k P a (3.98 gf / mm 2 ) or more.
  • the upper limit of the pressing pressure is the maximum pressure at which the members to be joined are not destroyed.
  • Dispersion medium (B) is volatilized and sinterable metal particles (A) are sintered. Any temperature can be used. However, if the temperature exceeds 400 ° C, the dispersion medium (B) may evaporate suddenly and adversely affect the shape of the solid metal.
  • the temperature is preferably lower than the melting point of A), more preferably 300 ° C or less.
  • the dispersion medium does not remain after the sinterable metal particles (A) are sintered, it is not necessary to wash the sintered product. May be washed.
  • the sinterable metal particle composition of the present invention is in the form of a sheet, it is preferably stored by being sandwiched between protective materials such as a glass plate and a plastic film.
  • protective materials such as a glass plate and a plastic film.
  • the storage temperature is exemplified as 10 ° C. or lower.
  • the sinterable metal particle composition according to the present invention is sandwiched between two polytetrafluoroethylene sheets and sintered using a press machine heated to the melting point of the dispersion medium (B) + 10 ° C. Pressure was applied so that the thickness of the binder metal particle composition was 300 m, and after cooling to below the melting point of the dispersion medium (B), it was taken out and cut into a predetermined size to form a sheet.
  • a press machine heated to the melting point of the dispersion medium (B) + 10 ° C. Pressure was applied so that the thickness of the binder metal particle composition was 300 m, and after cooling to below the melting point of the dispersion medium (B), it was taken out and cut into a predetermined size to form a sheet.
  • a silver-plated copper plate 1 with a width of 25 mm, a length of 25 mm, and a thickness of 1 mm the length is 10 mm O x W 10.0 mm and the thickness is 300 m.
  • the size of the sinterable silver particle composition after placing the sinterable silver particle composition 2 and allowing it to stand for 1 hour at 25 was measured, and the average value of the vertical and horizontal lengths was shown.
  • the sinterable silver particle composition 2 has a paste-like shape, use a mold and a squeegee that are 10 mm long and 10 mm wide and have an opening with a thickness of 300 m.
  • Pace-like composition Printed on a silver-plated copper plate measured for size of sinterable silver particle composition after standing at 25 ° C for 1 hour, average length and width Indicated by value.
  • Width 5mm x Length ⁇ 5mm x Thickness 1mm On a silver-plated copper plate, place a 5mm width x Length 5mm x Thickness 10O Zm sheet of sinter-like sinterable silver particle composition on top of it. After mounting a 5 mm X long 5 mm X 0.5 mm thick silver chip, the silver chip was bonded to the silver-plated copper plate by heating at 200 ° C for 1 hour in a forced circulation oven. When the test body was taken out of the oven and allowed to cool, the silver particles were sintered and the copper plate and the silver chip were bonded.
  • the test specimen for adhesive strength measurement obtained in this way is attached to a die shear strength measurement tester, and the side of the silver chip is pressed at a speed of 23 mmZ with the die shear tool of the die shear strength measurement tester.
  • the load when the joint between the copper plates was subjected to shear failure was defined as the adhesive strength (unit: kgf).
  • the bond strength test was performed three times, and the average value was defined as bond strength A.
  • Crimping was performed at a temperature of 30 seconds.
  • the test specimen for adhesive strength measurement thus obtained was attached to a die shear strength measurement tester, and the side of the silver tip was pressed at a speed of 23 mmZ with the die air tool of the die shear strength measurement tester, and the silver tip and silver plated copper
  • the load when the joint between the plates was sheared and broken was defined as the adhesive strength (unit: kgf).
  • the bond strength test was performed three times, and the average value was defined as bond strength B.
  • the polyimide sheet was taken out of the press machine, cooled, and peeled off from the polyimide sheet to obtain a sheet-like composition.
  • This sheet-like composition was made of durene in which silver particles were uniformly dispersed, was a hard solid at 25 ° C., and became best when the temperature was raised to 90 ° C. That is, it was thermoplastic.
  • Example 2 Sintered in the same manner as in Example 1 except that Pinacol (reagent released by Wako Pure Chemical Industries, Ltd., melting point: 42 ° C, boiling point: 1775 ° C) was used in place of Duren. Metal particle composition was prepared. This sinterable silver particle composition is pasty at 90 ° C. This sinterable silver particle composition was sandwiched between two polyimide sheets with a thickness of 130 m and added to a thickness of 300 m with a press machine heated to 90 ° C. Pressed. The polyimide sheet was taken out from the press machine, cooled, and peeled off from the polyimide sheet to obtain a sheet-like composition. This sheet-like composition was composed of pinacol in which silver particles were uniformly dispersed, was a hard solid at 25 ° C, and became a paste when heated to 80 ° C. That is, it was thermoplastic.
  • Example 2 2 parts of pinacol 2 and 3 parts of benzyl alcohol (reagent released by Wako Pure Chemical Industries, Ltd., melting point: 15 ° C., boiling point: 20 5 ° C.) were used instead of 5 parts of pinacol 2 Except for this, a sinterable silver particle composition was prepared in the same manner as in Example 2. This sinterable silver particle composition is pasty at 90 ° C. This sinterable silver particle composition was sandwiched between two polyimide sheets with a thickness of 130 m and pressed to a thickness of 300 m with a press machine heated to 90 ° C. .
  • the polyimide sheet was taken out from the press and cooled, and the bow I was peeled off from the polyimide sheet to obtain a sheet-like composition.
  • the sheet-like composition was a uniform and hard solid in which silver particles, pinacol and benzyl alcohol were well dispersed.
  • the shape retention of the sinterable silver particle composition and the adhesive strength of the solid metal with the sinterable silver particle composition were measured. The results are summarized in Table 1. From the above results, this sinterable silver particle composition is composed of silver particles, pinacol and benzyl alcohol. It was found that there was no separation, excellent shape retention, and useful for strongly joining metal members.
  • Example 1 instead of durene as the dispersion medium, undecane (reagent released by Wako Pure Chemical Industries, Ltd., melting point—26 ° C., boiling point: 19 6 ° C.) was used, as in Example 1. Thus, a sinterable silver particle composition was prepared. This sinterable silver particle composition was a paste that was fluid even at 25 ° C., and could not be molded into a sheet. The shape retention of the sinterable silver particle composition and the adhesive strength of the solid metal with the sinterable silver particle composition were measured, and the results are summarized in Table 1.
  • Flaked silver particles (0.5% by weight of stearin) with an average primary particle size of 3. O um (measured by laser diffraction method) obtained by flaking silver particles produced by a reduction method on the market.
  • the silver surface is coated with an acid, and the silver particles have water repellency.
  • 100 parts of ethylene glycol as a dispersion medium (a reagent released by Wako Pure Chemical Industries, Ltd., dielectric constant 39.0, melting point equal to 1)
  • a paste-like silver particle composition was prepared by adding 15 parts of (13 ° C, boiling point 19.8 ° C) and mixing uniformly using a rotary kneader.
  • This sinterable silver particle composition was in the form of a paste that was fluid even at 25 ° C., and could not be molded into a uniform shape.
  • the shape retention of this sinterable silver particle composition and the adhesive strength of the solid metal with the sinterable silver particle composition were measured, and the results are summarized in Table 1.
  • the sinterable metal particle composition of the present invention has no separation between the sinterable metal particles and the dispersion medium, and is excellent in shape retention, so that the capacitor, resistor, diode, memory, arithmetic element (CPU) This is useful for bonding chip components such as to the substrate with high accuracy.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
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  • Materials Engineering (AREA)
  • Powder Metallurgy (AREA)

Abstract

Composition de particules métalliques de frittage ayant une plasticité qui comprend : (A) 100 parties en poids de particules métalliques de frittage ayant un diamètre de particules moyen de 0,001 à 50 μm ; et (B) 3 à 100 parties en poids d'un milieu de dispersion qui est solide à température ambiante et qui fond et qui se vaporise à une température inférieure à la température de frittage des particules métalliques (A) : un agent de liaison en forme de feuille qui comprend la composition de particules métalliques de frittage ci-dessus ; et un procédé de liaison d'éléments métalliques qui comprend le frittage de la composition de particules métalliques de frittage ci-dessus, par exemple, à l'aide d'un chauffage entre les éléments métalliques.
PCT/JP2007/000277 2006-11-29 2007-03-20 Composition de particules métalliques de frittage ayant une plasticité, procédé de production de celle-ci, agent de liaison et procédé de liaison Ceased WO2008065728A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008528272A JP4247800B2 (ja) 2006-11-29 2007-03-20 可塑性を有する焼結性金属粒子組成物、その製造方法、接合剤および接合方法

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JP2006-322505 2006-11-29
JP2006322505 2006-11-29

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WO2008065728A1 true WO2008065728A1 (fr) 2008-06-05

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JP2011236494A (ja) * 2010-04-12 2011-11-24 Nippon Handa Kk 金属製部材接合体の製造方法および金属製部材接合体
WO2012081255A1 (fr) * 2010-12-17 2012-06-21 古河電気工業株式会社 Matière de liaison thermique, matière de revêtement pour liaison thermique, revêtement et procédé de liaison de composants électroniques
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JP2017228714A (ja) * 2016-06-24 2017-12-28 日東電工株式会社 加熱接合用シート及びダイシングテープ付き加熱接合用シート
JP2018049932A (ja) * 2016-09-21 2018-03-29 日東電工株式会社 加熱接合用シート及びダイシングテープ付き加熱接合用シート
WO2018179796A1 (fr) 2017-03-29 2018-10-04 日東電工株式会社 Feuille de liaison thermique et bande de découpage en dés fixée à une feuille de liaison thermique
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WO2019208071A1 (fr) 2018-04-27 2019-10-31 日東電工株式会社 Procédé de fabrication pour dispositif à semi-conducteur
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WO2020003663A1 (fr) 2018-06-26 2020-01-02 日東電工株式会社 Procédé de fabrication de dispositif à semi-conducteur
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JP2021167004A (ja) * 2020-04-10 2021-10-21 株式会社鈴野製作所 シートはんだ、およびはんだ付け方法
JPWO2022138455A1 (fr) * 2020-12-25 2022-06-30
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JP2011021255A (ja) * 2009-07-16 2011-02-03 Applied Nanoparticle Laboratory Corp ３金属成分型複合ナノ金属ペースト、接合方法及び電子部品
JP2011236494A (ja) * 2010-04-12 2011-11-24 Nippon Handa Kk 金属製部材接合体の製造方法および金属製部材接合体
JP2016021578A (ja) * 2010-07-21 2016-02-04 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー ボンディング構造および方法
JP2014503936A (ja) * 2010-11-03 2014-02-13 フライズ・メタルズ・インコーポレイテッド 焼結材料およびこれを用いた取付方法
US10535628B2 (en) 2010-11-03 2020-01-14 Alpha Assembly Solutions Inc. Sintering materials and attachment methods using same
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JPWO2012081255A1 (ja) * 2010-12-17 2014-05-22 古河電気工業株式会社 加熱接合用材料、加熱接合用コーティング材料、及びコーティング物
JP2013177618A (ja) * 2010-12-17 2013-09-09 Furukawa Electric Co Ltd:The 加熱接合用材料の製造方法、及び電子部品の接合方法
US9221130B2 (en) 2010-12-17 2015-12-29 Furukawa Electric Co., Ltd. Material for thermal bonding, coating material for thermal bonding, coating, and electronic component bonding method
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KR101852649B1 (ko) * 2010-12-17 2018-04-26 후루카와 덴키 고교 가부시키가이샤 가열 접합용 재료, 가열 접합용 코팅 재료, 코팅물, 및 전자부품의 접합방법
WO2012081255A1 (fr) * 2010-12-17 2012-06-21 古河電気工業株式会社 Matière de liaison thermique, matière de revêtement pour liaison thermique, revêtement et procédé de liaison de composants électroniques
JP2013039580A (ja) * 2011-08-11 2013-02-28 Furukawa Electric Co Ltd:The 加熱接合用材料、加熱接合用シート体、及び加熱接合用成形体
WO2014181372A1 (fr) * 2013-05-08 2014-11-13 国立大学法人大阪大学 Procede d'assemblage
JPWO2014181372A1 (ja) * 2013-05-08 2017-02-23 国立大学法人大阪大学 接合方法
JP2017228714A (ja) * 2016-06-24 2017-12-28 日東電工株式会社 加熱接合用シート及びダイシングテープ付き加熱接合用シート
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